Properties and interfacial microstructure of Sn–Zn–Ga solder joint with rare earth Pr addition

2013 ◽  
Vol 46 ◽  
pp. 816-823 ◽  
Author(s):  
Huan Ye ◽  
Songbai Xue ◽  
Jiadong Luo ◽  
Yang Li
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Interfacial Microstructure

Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

2011 ◽  
Vol 509 (25) ◽  
pp. 7152-7161 ◽  
Author(s):  
Guang Zeng ◽  
Songbai Xue ◽  
Lili Gao ◽  
Liang Zhang ◽  
Yuhua Hu ◽  
...  
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Interfacial Microstructure ◽  
Microstructure And Properties ◽  
Nd Addition

Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint

2021 ◽  
Vol 127 ◽  
pp. 114385
Author(s):  
Li Yang ◽  
Jian Qiao ◽  
Yaocheng Zhang ◽  
Huiming Gao ◽  
Zengjian Yao ◽  
...  
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Composite Solder ◽  
Composite Solder Joint ◽  
Shear Property

Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint

2005 ◽  
Vol 34 (3) ◽  
pp. 217-224 ◽  
Author(s):  
Bo Li ◽  
Yaowu Shi ◽  
Yongping Lei ◽  
Fu Guo ◽  
Zhidong Xia ◽  
...  
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Rare Earth Element ◽  
Earth Element ◽  
Element Addition

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

2015 ◽  
Vol 27 (2) ◽  
pp. 76-83 ◽  
Author(s):  
Jibing Chen ◽  
Yanfang Yin ◽  
Jianping Ye ◽  
Yiping Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Solder Bump ◽  
Fatigue Behavior ◽  
Interfacial Microstructure ◽  
Content Type ◽  
X Ray ◽  
Snpb Solder ◽  
Rapid Thermal Cycling

Purpose – The purpose of this paper is to investigate the thermal fatigue behavior of a single Sn-3.0Ag-0.5Cu (SAC) lead-free and 63Sn-37Pb (SnPb) solder joint treated by rapidly alternating heating and cooling cycles. Design/methodology/approach – With the application of electromagnetic-induced heating, the specimen was heated and cooled, controlled with a system that uses a fuzzy logic algorithm. The microstructure and morphology of the interface between the solder ball and Cu substrate was observed using scanning electron microscopy. The intermetallic compounds and the solder bump surface were analyzed by energy-dispersive X-ray spectroscopy and X-ray diffraction, respectively. Findings – The experimental results showed that rapid thermal cycling had an evident influence on the surface and interfacial microstructure of a single solder joint. The experiment revealed that microcracks originate and propagate on the superficial oxide of the solder bump after rapid thermal cycling. Originality/value – Analysis, based on finite element modeling and metal thermal fatigue mechanism, determined that the rimous cracks can be explained by the heat deformation theory and the function of temperature distribution in materials physics.

Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint

2002 ◽  
Vol 17 (1) ◽  
pp. 43-51 ◽  
Author(s):  
Won Kyoung Choi ◽  
Jong Hoon Kim ◽  
Sang Won Jeong ◽  
Hyuck Mo Lee
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Intermetallic Layer ◽  
Melting Behavior ◽  
Interfacial Microstructure ◽  
X Ray Diffraction ◽  
Solder Alloys ◽  
X Ray ◽  
Joint Characteristics ◽  
Ductile Fractures

Interfacial phase and microstructure, solder hardness, and joint strength of Sn–3.5Ag–X (X = Cu, In, Ni; compositions are all in wt% unless specified otherwise) solder alloys were investigated. Considering the melting behavior and the mechanical properties, five compositions of Sn–3.5Ag–X solder alloys were selected. To examine the joint characteristics, they were soldered on under bump metallurgy isothermally at 250 °C for 60 s. Aging and thermal cycling (T/C) were also performed on the solder joint. The interfacial microstructure of the joint was observed by scanning electron microscopy. X-ray diffraction and energy dispersive x-ray analyses were made toidentify the type of solder phase and to measure compositions. Excessive growth of an interfacial intermetallic layer in the Sn–3.5Ag–6.5 In solder joint led to a brittle fracture. In the other four solder joints, ductile fractures occurred through the solder region and the solder hardness was closely related with the joint strength.

Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint

2009 ◽  
Vol 472 (1-2) ◽  
pp. 198-202 ◽  
Author(s):  
WeiMin Xiao ◽  
YaoWu Shi ◽  
GuangChen Xu ◽  
Ren Ren ◽  
Fu Guo ◽  
...  
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Fatigue Property ◽  
Snagcu Solder ◽  
Creep Fatigue ◽  
Mechanical Creep

scholarly journals The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

2020 ◽  
Vol 10 (24) ◽  
pp. 8935
Author(s):  
Peng Xue ◽  
Jianzhi Tao ◽  
Peng He ◽  
Weimin Long ◽  
Sujuan Zhong
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Aging Treatment ◽  
Interfacial Microstructure ◽  
Growth Constant ◽  
Nd Addition ◽  
Excellent Mechanical Property ◽  
Surface Active ◽  
Cu3sn Imcs ◽  
Effect Of Surface

In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explained as the adsorbing-hindering effect of surface-active Nd atoms which blocked the growth of brittle intermetallic compounds (IMCs) in the solder joint. Theoretical analysis indicated that 0.05 wt. % addition of Nd could distinctly decrease the growth constant of Cu6Sn5 IMCs and slightly decrease the growth constant of Cu3Sn IMCs respectively. The shear force of SAC387-0.05Nd/Cu solder joint was evidently improved compared with the origin solder joint. In addition, SAC387-0.05Nd/Cu solder joint maintained excellent mechanical property compared with SAC387/Cu solder joint even after 1440 h aging treatment.

Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization

2006 ◽  
Vol 512 ◽  
pp. 355-360
Author(s):  
Akio Hirose ◽  
Tomoyuki Hiramori ◽  
Mototaka Ito ◽  
Yoshiharu Tanii ◽  
Kojiro F. Kobayashi
Keyword(s):  
Solder Joint ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Joint Strength ◽  
Aging Treatment ◽  
Interfacial Microstructure ◽  
Interfacial Reaction Layer ◽  
Solder Balls ◽  
Lead Free Solders ◽  
Electroless Ni

Sn-3.5Ag (Sn-Ag) and Sn-3.5Ag-0.75Cu (Sn-Ag-Cu) solder balls were reflowed on electroless Ni-P/Au plated Cu pad with varying thickness of Au layer (0 to 500nm). In the Sn-Ag solder joint, a P-rich layer including voids, which resulted from Ni diffusion from the Ni-P plating to form Ni3Sn4 interfacial reaction layer, formed at the interface regardless of Au plating thickness. This caused the degradation of the joint strength. On the contrary, the Sn-Ag-Cu solder joint had no continuous P-rich layer formed and showed a higher joint strength than the Sn-Ag solder joint in the case of Au plating of 50nm or less. Cu alloying to the solder promote the formation of (Cu, Ni)6Sn5 instead to Ni3Sn4 as the interfacial reaction layer. The (Cu, Ni)6Sn5 reaction layer can suppress the diffusion of Ni from the N-P plating and thereby inhibit the formation of the P-rich layer. However, in the case of thick Au plating of 250nm or more, a thin P-rich layer formed at the interface even in the Sn-Ag-Cu solder joint and the joint strength was degraded. Au dissolving into the solder from the Au plating during the reflow process may encourage the diffusion of Ni from the Ni-P plating into the solder. As a result, the Sn-Ag-Cu solder joints with 50nm Au coating provided the best joint strength, although its joint strength considerably degraded after the aging treatment at 423K.

The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

2011 ◽  
Vol 704-705 ◽  
pp. 685-689 ◽  
Author(s):  
Yao Li Wang ◽  
Ke Ke Zhang ◽  
Chen Yang Li ◽  
Li Juan Han
Keyword(s):  
Rare Earth ◽  
Energy Spectrum ◽  
Solder Joint ◽  
Cross Section ◽  
Isothermal Aging ◽  
Joint Interface ◽  
X Ray Diffraction ◽  
X Ray ◽  
The Cross ◽  
Electronic Microscope

The morphology and growing behavior of Cu6Sn5intermetallic compound (IMC) of low Ag content Sn-2.5Ag-0.7Cu-0.1RE/Cu solder joint interface are investigated by adopting the X-ray diffraction, JSM-5610LV scanning electronic microscope and energy spectrum analysis. The results show that the cross-section morphology Cu6Sn5of the solder joint interface is scallop-like and its section morphology is circle-like grain. With the aging time increasing, the cross-section Cu6Sn5morphology of the solder joint interface can be changed from the scallop-like to the shape-layer, and the growing kinetics is coincidence with the law of parabola and its growing behavior is controlled by diffusion. With adding a small amount of rare earth elements in the Sn-2.5Ag-0.7Cu solder alloy, the growing rate of the Cu6Sn5can be reduced.

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