Logic Circuits Testing for Transient Faults

2005 ◽  
Author(s):  
S. Krishnaswamy ◽  
I.L. Markov ◽  
J.P. Hayes
Keyword(s):  
Logic Circuits ◽  
Transient Faults

scholarly journals Reliability evaluation of logic circuits based on transient faults propagation metrics

2017 ◽  
Vol 14 (7) ◽  
pp. 20170128-20170128 ◽  
Author(s):  
Shuo Cai ◽  
Fei Yu ◽  
Weizheng Wang ◽  
Tieqiao Liu ◽  
Peng Liu ◽  
...  
Keyword(s):  
Reliability Evaluation ◽  
Logic Circuits ◽  
Transient Faults

Soft Error Reliability Evaluation of Nanoscale Logic Circuits in the Presence of Multiple Transient Faults

2020 ◽  
Vol 36 (4) ◽  
pp. 469-483 ◽  
Author(s):  
Shuo Cai ◽  
◽  
Binyong He ◽  
Weizheng Wang ◽  
Peng Liu ◽  
...  
Keyword(s):  
Reliability Evaluation ◽  
Logic Circuits ◽  
Soft Error ◽  
Transient Faults

Fault effects in asynchronous sequential logic circuits

1993 ◽  
Vol 140 (6) ◽  
pp. 327-332
Author(s):  
M.-D. Shieh ◽  
C.-L. Wey ◽  
P.D. Fisher
Keyword(s):  
Logic Circuits ◽  
Sequential Logic

DIGITALIZATION OF LABOR MIGRATION PROCESSES IN UZBEKISTAN. WORLD EXPERIENCE

2020 ◽  
Vol 4 (3) ◽  
pp. 29-39
Author(s):  
Sulkhiya Gazieva ◽  
Keyword(s):  
Labor Market ◽  
Technological Change ◽  
Labor Migration ◽  
Smart Phone ◽  
Logic Circuits ◽  
Digital Logic ◽  
The Internet ◽  
The Future

The future of labor market depends upon several factors, long-term innovation and the demographic developments. However, one of the main drivers of technological change in the future is digitalization and central to this development is the production and use of digital logic circuits and its derived technologies, including the computer,the smart phone and the Internet. Especially, smart automation will perhaps not cause e.g.regarding industries, occupations, skills, tasks and duties

Case Studies in Atomic Force Probe Analysis

2006 ◽  
Author(s):  
Randal Mulder ◽  
Sam Subramanian ◽  
Tony Chrastecky
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Light Emission ◽  
Electrical Characterization ◽  
Logic Circuits ◽  
Contrast Imaging ◽  
Atomic Force ◽  
Measuring Surface ◽  
Analysis Environment

Abstract The use of atomic force probe (AFP) analysis in the analysis of semiconductor devices is expanding from its initial purpose of solely characterizing CMOS transistors at the contact level with a parametric analyzer. Other uses found for the AFP include the full electrical characterization of failing SRAM bit cells, current contrast imaging of SOI transistors, measuring surface roughness, the probing of metallization layers to measure leakages, and use with other tools, such as light emission, to quickly localize and identify defects in logic circuits. This paper presents several case studies in regards to these activities and their results. These case studies demonstrate the versatility of the AFP. The needs and demands of the failure analysis environment have quickly expanded its use. These expanded capabilities make the AFP more valuable for the failure analysis community.

Sign in / Sign up

Export Citation Format

Share Document