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2016 ◽  
Author(s):  
Sharon Pei-Siang Lim ◽  
Ser Choong Chong ◽  
Mian Zhi Ding ◽  
Vempati Srinivasa Rao
Keyword(s):  
Bonding Process ◽  
High Density ◽  
Wafer Level ◽  
Wafer Level Package

Benzo‐cyclo‐butene bonding process with ‘stamp’ printing for wafer level package

2014 ◽  
Vol 9 (5) ◽  
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Author(s):  
Wen Xia ◽  
Lei Li ◽  
Kangfa Deng ◽  
Song Li ◽  
Weiguo Su ◽  
...  
Keyword(s):  
Bonding Process ◽  
Wafer Level ◽  
Wafer Level Package

High Density Copper Bump Technology Integrated With Wafer Level Package

2019 ◽  
Vol 16 (7) ◽  
pp. 15-21 ◽  
Author(s):  
Xiang Zeng ◽  
Patty Chang-Chien ◽  
Chi Cheung ◽  
G Akerling ◽  
Rosie Johnson ◽  
...  
Keyword(s):  
High Density ◽  
Wafer Level ◽  
Wafer Level Package
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