Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

2013 ◽  
Author(s):  
Vempati Srinivasa Rao ◽  
Ser Choong Chong ◽  
Chen Zhaohui ◽  
Jie Li Aw ◽  
Eva Wai Leong Ching ◽  
...  
Keyword(s):  
Bonding Process ◽  
High Density ◽  
Wafer Level ◽  
Fine Pitch ◽  
3D Applications

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

2014 ◽  
Author(s):  
Ling Xie ◽  
Sunil Wickramanayaka ◽  
Boo Yung Jung ◽  
Jerry Aw Jie Li ◽  
Lim Jung-kai ◽  
...  
Keyword(s):  
High Density ◽  
Wafer Level ◽  
3D Ic ◽  
Fine Pitch ◽  
Cu Bonding

Fine-pitch solder joining for high density interconnection

2014 ◽  
Author(s):  
Kuniaki Sueoka ◽  
Sayuri Kohara ◽  
Akihiro Horibe ◽  
Fumiaki Yamada ◽  
Hiroyuki Mori ◽  
...  
Keyword(s):  
High Density ◽  
Fine Pitch

scholarly journals Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 295
Author(s):  
Pao-Hsiung Wang ◽  
Yu-Wei Huang ◽  
Kuo-Ning Chiang
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Glass Substrate ◽  
High Speed ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
Design Parameters ◽  
Time To Failure ◽  
Wafer Level ◽  
Fine Pitch

The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

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