Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

2016 ◽  
Author(s):  
Yangyang Long ◽  
Folke Dencker ◽  
Friedrich Schneider ◽  
Benjamin Emde ◽  
Chun Li ◽  
...  
Keyword(s):  
Bonding Process ◽  
Removal Mechanism ◽  
Oxide Removal ◽  
Wedge Bonding

Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001726-001742
Author(s):  
Alan Huffman ◽  
Jason Reed ◽  
Matthew Lueck ◽  
Christopher Gregory ◽  
Dorota Temple ◽  
...  
Keyword(s):  
High Pressures ◽  
Bonding Process ◽  
Self Assembled Monolayers ◽  
Environmental Damage ◽  
3D Integration ◽  
Chemical Cleaning ◽  
Plasma Pretreatment ◽  
Assembled Monolayers ◽  
Thermocompression Bonding ◽  
Oxide Removal

The study of copper-based bump structures for interconnects in 3D integration applications has been ongoing for several years. Typically, an array of Cu bumps is bonded to an array of Sn-capped Cu bumps or another Cu bump array using a thermocompression bonding process. These processes rely on high pressures and temperatures to facilitate bonding between the bump arrays. In order for this bonding to take place, some method of oxide removal is normally required for the Cu and/or Cu/Sn bump surfaces before bonding. A number of different methods have been investigated by a number of groups, including chemical cleaning, plasma cleaning, self-assembled monolayers, and no-flow underfill (NUF) materials. The use of NUFs is particularly intriguing, since these materials can be formulated with fluxing agents which could reduce surface oxides on Cu and Sn and can be deposited immediately prior to the thermocompression bonding process. In addition, the material provides a protective encapsulant to the interconnect array, protecting it from environmental damage and adding mechanical strength to the assembly. We will present the results of a study to evaluate new fluxing NUF materials in thermocompression bonding processes on full area array test devices with 25 micron bump pitch. The test devices are fabricated with either Cu or Cu/Sn bumps to provide two different bonding options (Cu to Cu or Cu/Sn to Cu). We will compare the NUF bonding process and resulting bonded interfaces to assemblies fabricated using our standard bonding processes, which rely on both chemical and plasma pretreatment processes to prepare the bump arrays before bonding. Mechanical and electrical data will be used to compare the two bonding processes, as well as SEM cross-section analysis of the bonded interfaces.

Visualization of oxide removal during ultrasonic wire bonding process

2017 ◽  
Author(s):  
Yangyang Long ◽  
Folke Dencker ◽  
Andreas Isaak ◽  
Friedrich Schneider ◽  
Jorg Hermsdorf ◽  
...  
Keyword(s):  
Wire Bonding ◽  
Bonding Process ◽  
Oxide Removal ◽  
Ultrasonic Wire Bonding

Novel Method for Diffusion Bonding Superalloys and Aluminium Alloys (USA Patent 6,669,534 B2, European Patent Pending)

2005 ◽  
Vol 502 ◽  
pp. 431-436 ◽  
Author(s):  
A.A. Shirzadi ◽  
E.R. Wallach
Keyword(s):  
Diffusion Bonding ◽  
Aluminium Alloys ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Metallic Alloys ◽  
European Patent ◽  
Sophisticated Equipment ◽  
Novel Method ◽  
Oxide Removal ◽  
Cobalt Base

A novel method for diffusion bonding metallic alloys with stable surface oxide films (e.g. nickel and cobalt base superalloys and aluminium alloys) has been developed. The stable oxides on the faying surfaces of these alloys are replaced, prior to the bonding process, with a very thin metallic layer and/or less stable oxides, using a proprietary non-chemical oxide removal method based on the use of gallium. This new method is very rapid and neither requires the use of any sophisticated equipment nor is a costly process. Bonding is then readily achieved by either solid-state or transient-liquid-phase (TLP) diffusion bonding. Using this method, bonds in nickelbase and cobalt-base superalloys with “virtually invisible” bond interfaces and bonds in aluminium alloys with strengths as high as those of the parent alloys can be produced.

Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process

2007 ◽  
Vol 182 (1-3) ◽  
pp. 202-206 ◽  
Author(s):  
Hongjun Ji ◽  
Mingyu Li ◽  
Chunqing Wang ◽  
Jingwei Guan ◽  
Han Sur Bang
Keyword(s):  
Bonding Process ◽  
Bond Interface ◽  
Wedge Bonding

The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor

2010 ◽  
Vol 87 (4) ◽  
pp. 537-542 ◽  
Author(s):  
H. Gaul ◽  
A. Shah ◽  
M. Mayer ◽  
Y. Zhou ◽  
M. Schneider-Ramelow ◽  
...  
Keyword(s):  
Real Time ◽  
Force Sensor ◽  
Bonding Process ◽  
Laser Vibrometer ◽  
Wedge Bonding

A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process

2016 ◽  
Vol 2016 (1) ◽  
pp. 000427-000432 ◽  
Author(s):  
Yangyang Long ◽  
Folke Dencker ◽  
Marc Wurz ◽  
Armin Feldhoff ◽  
Jens Twiefel
Keyword(s):  
Relative Motion ◽  
Physical Vapor Deposition ◽  
Central Area ◽  
Bonding Process ◽  
Cleaning Efficiency ◽  
Substrate Interface ◽  
Self Cleaning ◽  
The Wire ◽  
Aluminum Oxide Layer ◽  
Wedge Bonding

Abstract Ultrasonic wire bonding is a dominating interconnection technique that has been applied in packaging industry for decades. The phenomena at the wire/substrate interface and the wire/tool interface, however, are not clear yet. Specifically, the motion behaviors of the wire during the bonding process have to be deeply understood. In this project, the relative motion amplitudes at the wire/tool interface and the self-cleaning efficiency at the wire/substrate interface are investigated via the analysis of an artificially coated layer. For each experiment, a thin layer made of a specific material was coated onto the surface of a 400 μm wire by physical vapor deposition. The change of thicknesses of the layer was observed by a scanning electron microscope after the bonding process. The results indicated a complex relative motion behavior at the wire/tool interface. The relative motion amplitude at the fillets contact regions is higher than that at the other contact perimeter regions while the amplitude at the central area is the lowest. The insignificant influence of a 200 nm aluminum oxide layer on the bonding quality demonstrated the high self-cleaning efficiency of the wedge-wedge bonding process.

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