Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process

2007 ◽  
Vol 182 (1-3) ◽  
pp. 202-206 ◽  
Author(s):  
Hongjun Ji ◽  
Mingyu Li ◽  
Chunqing Wang ◽  
Jingwei Guan ◽  
Han Sur Bang
Keyword(s):  
Bonding Process ◽  
Bond Interface ◽  
Wedge Bonding

The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor

2010 ◽  
Vol 87 (4) ◽  
pp. 537-542 ◽  
Author(s):  
H. Gaul ◽  
A. Shah ◽  
M. Mayer ◽  
Y. Zhou ◽  
M. Schneider-Ramelow ◽  
...  
Keyword(s):  
Real Time ◽  
Force Sensor ◽  
Bonding Process ◽  
Laser Vibrometer ◽  
Wedge Bonding

Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method

2008 ◽  
Vol 580-582 ◽  
pp. 173-176
Author(s):  
Hee Seon Bang ◽  
Hong Jun Ji ◽  
Ming Yu Li ◽  
Chun Qing Wang ◽  
Han Sur Bang
Keyword(s):  
Copper Substrate ◽  
Bonding Mechanism ◽  
Aluminum Wire ◽  
X Ray ◽  
Interfacial Composition ◽  
Bond Center ◽  
Bond Interface ◽  
Fracture Study ◽  
Wedge Bonding ◽  
Peeling Off

In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was observed and interfacial composition was certified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features of interfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded at bond center. When the bonding time was lower, the ratio of the bond length to its width was larger and elemental aluminum distributed discontinuously on the bond fracture, primarily at the periphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC) was identified. The phenomena of bond interfacial tracings were analyzed, and the bonding mechanism was ascribed to plastic flow analyzed by finite element method based on the contact issues.

A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process

2016 ◽  
Vol 2016 (1) ◽  
pp. 000427-000432 ◽  
Author(s):  
Yangyang Long ◽  
Folke Dencker ◽  
Marc Wurz ◽  
Armin Feldhoff ◽  
Jens Twiefel
Keyword(s):  
Relative Motion ◽  
Physical Vapor Deposition ◽  
Central Area ◽  
Bonding Process ◽  
Cleaning Efficiency ◽  
Substrate Interface ◽  
Self Cleaning ◽  
The Wire ◽  
Aluminum Oxide Layer ◽  
Wedge Bonding

Abstract Ultrasonic wire bonding is a dominating interconnection technique that has been applied in packaging industry for decades. The phenomena at the wire/substrate interface and the wire/tool interface, however, are not clear yet. Specifically, the motion behaviors of the wire during the bonding process have to be deeply understood. In this project, the relative motion amplitudes at the wire/tool interface and the self-cleaning efficiency at the wire/substrate interface are investigated via the analysis of an artificially coated layer. For each experiment, a thin layer made of a specific material was coated onto the surface of a 400 μm wire by physical vapor deposition. The change of thicknesses of the layer was observed by a scanning electron microscope after the bonding process. The results indicated a complex relative motion behavior at the wire/tool interface. The relative motion amplitude at the fillets contact regions is higher than that at the other contact perimeter regions while the amplitude at the central area is the lowest. The insignificant influence of a 200 nm aluminum oxide layer on the bonding quality demonstrated the high self-cleaning efficiency of the wedge-wedge bonding process.

Diffusion Bonding of Superplastic 7075 Aluminum Alloy

1990 ◽  
Vol 196 ◽  
Author(s):  
Huang Yan ◽  
Cui Jianzhong ◽  
Ma Longxiang
Keyword(s):  
Aluminum Alloy ◽  
Base Metal ◽  
Diffusion Bonding ◽  
Joint Strength ◽  
Bonding Process ◽  
Special Method ◽  
Bonding Mechanism ◽  
7075 Aluminum Alloy ◽  
Joint Microstructure ◽  
Bond Interface

ABSTRACTBecause of the presence of surface oxide films, aluminum alloys are very difficult to join by diffusion bonding processes when there are no interlayers between mating surfaces. In the present investigation, the diffusion bonding of superplastic 7075 aluminum alloy has been carried out using a special method for surface treatment in the temperature range 500∼520°C, at pressures of 2.07∼3.OMPa, times of 90∼150min and a vaccum of 1×10−5torr. The joint strength obtained is the same as the base metal strength of the alloy, and the joint microstructure is indistinguishable from that of the base metal. In this paper, the effect of the superplastic treatment of the alloy on the bonding process is discussed, and it is proposed that the bonding mechanism is the migration of the initial bond interface caused both by the diffusion of atoms and by the growth of grains during the diffusion bonding process.

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