scholarly journals Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 295
Author(s):  
Pao-Hsiung Wang ◽  
Yu-Wei Huang ◽  
Kuo-Ning Chiang
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Glass Substrate ◽  
High Speed ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
Design Parameters ◽  
Time To Failure ◽  
Wafer Level ◽  
Fine Pitch

The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

2018 ◽  
Vol 140 (1) ◽  
Author(s):  
Lei Shi ◽  
Lin Chen ◽  
David Wei Zhang ◽  
Evan Liu ◽  
Qiang Liu ◽  
...  
Keyword(s):  
Finite Element ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Equivalent Stress ◽  
Circuit Board ◽  
Electrical Performance ◽  
Design Parameters ◽  
Wafer Level ◽  
Element Analysis

Due to low cost and good electrical performance, wafer-level chip scale packaging (WLCSP) has gained more attention in both industry and academia. However, because the coefficient of thermal expansion (CTE) mismatches between silicon and organic printed circuit board (PCB), WLCSP technology still faces reliability challenges, such as the solder joint fragile life issue. In this paper, a new WLCSP design (WLCSP-PN) is proposed, based on the structure of WLCSP with Cu posts (WLCSP-P), to release the stress on the solder joints. In the new design, there is a space between the Cu post and the polymer which permits NiSn coating on the post sidewall. The overcoating enhances the solder–post interface where cracks were initiated and enlarges the intermetallic compounds (IMC) joint area to enhance the adhesion strength. Design of experiment (DOE) with the Taguchi method is adopted to obtain the sensitivity information of design parameters of the new design by the three-dimensional (3D) finite element model (FEM), leading to the optimized configuration. The finite element analysis results demonstrate that compared to WLCSP-P, the proposed WLCSP-PN reduces the package displacement, equivalent stress, and plastic strain energy density and thus improves the fatigue life of solder joints.

Mechanical and Optimization Analyses for Novel Wound Composite Axial Impeller

2009 ◽  
Author(s):  
Jifeng Wang ◽  
Qubo Li ◽  
Norbert Mu¨ller
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Three Dimensional ◽  
Von Mises Stress ◽  
Loading Conditions ◽  
Element Analysis ◽  
Wound Composite

A mechanical and optimal analyses procedure is developed to assess the stresses and deformations of Novel Wound Composite Axial-Impeller under loading conditions particular to centrifuge. This procedure is based on an analytical method and Finite Element Analysis (FEA, commercial software ANSYS) results. A low-cost, light-weight, high-performance, composite turbomachinery impeller from differently designed patterns will be evaluated. Such impellers can economically enable refrigeration plants using water as a refrigerant (R718). To create different complex patterns of impellers, MATLAB is used for creating the geometry of impellers, and CAD software UG is used to build three-dimensional impeller models. Available loading conditions are: radial body force due to high speed rotation about the cylindrical axis and fluid forces on each blade. Two-dimensional plane stress and three-dimensional stress finite element analysis are carried out using ANSYS to validate these analytical mechanical equations. The von Mises stress is investigated, and maximum stress and Tsai-Wu failure criteria are applied for composite material failure, and they generally show good agreement.

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Thermomechanical Design for Fine Pitch 3D-IC Packages

2012 ◽  
Vol 2012 (1) ◽  
pp. 001001-001009 ◽  
Author(s):  
Akihiro Horibe ◽  
Sayuri Kohara ◽  
Kuniaki Sueoka ◽  
Keiji Matsumoto ◽  
Yasumitsu Orii ◽  
...  
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
High Stress ◽  
High Viscosity ◽  
Thermomechanical Properties ◽  
Design Parameters ◽  
Element Analysis ◽  
Package Design ◽  
Fine Pitch ◽  
Silicon Vias

Low stress package design is one of the greatest challenges for the realization of reliable 3D integrated devices, since they are composed of elements susceptible to failures under high stress such as thin dies, metal through silicon vias (TSVs), and fine pitch interconnections. In variety of package components, an organic interposer is a key to obtain low cost modules with high density I/Os. However, the large mismatch in coefficient of thermal expansion (CTE) between silicon dies and organic laminates causes high stress in an organic package. The major parametric components in 3D devices are dies with /without Cu-TSVs, laminates, bumps, and underfill layers. Especially, the die thicknesses and underfill properties are ones of the parameters that give us some range to control as package design parameters. In general, the underfill material with a high modulus and a low CTE is effective in reducing the stress in solder interconnections between the Si die and the laminate. However, the filler content of underfill materials with such mechanical properties generally results in high viscosity. The use of high viscous materials in between silicon dies in 3D modules can degrade process ability in 3D integration. In this study, we show that the interchip underfills in 3D modules have a wider mechanical property window than in 2D modules even with fine pitch interconnections consisting mostly of intermetallic compounds (IMCs). Also the finite element analysis results show that the optimization of the structural or thermomechanical properties of organic laminates and interchip underfill contributes to reduction of stressing thinned silicon dies which may have some risks to the device performance.

Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration

2010 ◽  
Vol 2010 (1) ◽  
pp. 000548-000553
Author(s):  
Zhaozhi Li ◽  
Brian J. Lewis ◽  
Paul N. Houston ◽  
Daniel F. Baldwin ◽  
Eugene A. Stout ◽  
...  
Keyword(s):  
Flip Chip ◽  
Low Cost ◽  
Three Dimensional ◽  
Cost Effective ◽  
Market Demand ◽  
Wafer Level ◽  
Packaging Technology ◽  
Fine Pitch ◽  
3D Packaging ◽  
Assembly Technique

Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies.

Finite Element Analysis of the Nut-Supports Subassembly Based on ANSYS

2012 ◽  
Vol 215-216 ◽  
pp. 847-850
Author(s):  
Shou Jun Wang ◽  
Xing Xiong ◽  
Hong Jie Wang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Reference Data ◽  
Three Dimensional ◽  
Design Parameters ◽  
Weak Links ◽  
Fe Model ◽  
Element Analysis ◽  
Design And Optimization ◽  
Wave Maker

In the condition of alternating impact ,the nut-supports subassembly is analyzed according to uncertainty of design parameters. Firstly, a three-dimensional (3-D) finite element (FE) model of the nut-supports subassembly is built and is meshed,and the constraints and loads are imposed.Secondly,the model of nut-supports was assembled using the software ANSYS to understand the stress distribution and various parts of the deformation of the nut-supports and its weak links in the harmonic forces.Finally,socket head cap screw has not enough pre-load in the condition of alternating impact and will be simplified.It is analyzed and checked whether it is cut or not; which provides the reference data for design and optimization of the wave maker.

scholarly journals Performance Analysis of Conical Permanent Magnet Couplings for Underwater Propulsion

2019 ◽  
Vol 7 (6) ◽  
pp. 187 ◽  
Author(s):  
Li ◽  
Hu ◽  
Song ◽  
Mao ◽  
Tian
Keyword(s):  
Finite Element ◽  
Permanent Magnet ◽  
Cone Angle ◽  
Three Dimensional ◽  
Design Parameters ◽  
3D Fem ◽  
Torque Density ◽  
Design And Optimization ◽  
Pull Out ◽  
Underwater Propulsion

Permanent magnet couplings (PMCs) are widely used in underwater propulsion because it can solve the deep-sea sealing problem effectively. In this paper, a new type of conical permanent magnet coupling (CPMC) is proposed, which is able to match the tail shape of the underwater vehicle and make full use of the tail space to increase pull-out torque capability. Based on the three-dimensional finite element method (3D-FEM), the electromagnetic characteristics of an initial model for CPMC are analyzed. In order to facilitate the design and optimization of CPMC, an equivalent three-dimensional (3D) analytical method for the pull-out torque calculation is presented, and its accuracy is verified by comparison with the 3D finite element results. Finally, the influence of design parameters such as half-cone angle, pole pair, pole arc coefficient and permanent magnet thickness on maximum pull-out torque and torque density of CPMC is analyzed, and a preliminary optimization model is obtained.

Underfill Assessments and Validations for Low-k FCBGA

2006 ◽  
Author(s):  
Nicholas Kao ◽  
Jeng Yuan Lai ◽  
Jase Jiang ◽  
Yu Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Finite Element ◽  
High Speed ◽  
Flip Chip ◽  
Failure Modes ◽  
Solder Bump ◽  
Material Selection ◽  
Coefficient Of Thermal Expansion ◽  
Electrical Performance ◽  
Low K ◽  
Underfill Material

With the trend of electronic consumer product toward more functionality, high performance and miniaturization, IC chip is required to deliver more I/Os signals and better electrical characteristics under same package form factor. Thus, Flip Chip BGA (FCBGA) package was developed to meet those requirements offering better electrical performance, more I/O pins accommodation and high transmission speed. For high-speed application, the low dielectric constant (low-k) material that can effectively reduce the signal delays is extensively used in IC chips. However, the low-k material possesses fragile mechanical property and high coefficient of thermal expansion (CTE) compared with silicon chip, which raises the reliability concerns of low-k material integrated into IC chip. The typical reliability failure modes are low-k layer delamination and bump crack under temperature loading during assembly and reliability test. Delamination is occurred in the interface between low-k dielectric layers and underfill material at chip corner. Bump crack is at Under Bump Metallization (UBM) corner. Thus, the adequate underfill material selection becomes very important for both solder bump and low-k chips [1]. This paper mainly characterized FCBGA underfill materials to guide the adequate candidates to prevent failures on low-k chip and solder bump. Firstly, test vehicle was a FCBGA package with heat spreader and was investigated the thermal stress by finite element models. In order to analyze localized low-k structures, sub-modeling technique is used for underfill characterizations. Then, the proper underfill candidates picked from modeling results were experimentally validated by reliability tests. Finally, various low-k FCBGA package structures were also studied with same finite element technique.

Integrated Structure/Control Design of High Speed Flexible Robots Based on Time Optimal Control

1995 ◽  
Vol 117 (4) ◽  
pp. 503-512 ◽  
Author(s):  
Sudhendu Rai ◽  
Haruhiko Asada
Keyword(s):  
Optimal Control ◽  
Finite Element ◽  
High Speed ◽  
Control Design ◽  
Design Criterion ◽  
Time Optimal Control ◽  
Design Parameters ◽  
Element Analysis ◽  
Structure Control ◽  
Time Optimal

This paper presents the integrated structure/control design of high speed single link robots based on time-optimal control and finite element analysis. First, the solutions of a time optimal control problem are analyzed with respect to the arm link inertia and its structural flexibility. A new technique is developed to further reduce the optimal traveling time by redesigning the arm structure through the trade-off analysis between the arm inertia and its natural frequency. In the latter half of the paper, the design criterion is extended to multiple indices by considering residual vibrations, load bearing capacity and other design constraints. For suppressing residual vibrations, a simple feedback control is designed and its dynamic performance with respect to pole-zero locations is improved along with other criteria through mechanical structure modification. The finite element method is used as a modeling tool and the shape of the arm geometry is modified as design parameters. An arm is designed which performs much better as compared to the design which is done without considering the interactions between physical structure and control. The newly designed arm is tested by constructing an experimental setup. The results show significantly improved performance.

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