Assessment of Au Stud-Solder Interconnection for Fine Pitch Flip Chip Packaging

2007 ◽  
Author(s):  
Alfred Yeo ◽  
Sharon Lim ◽  
Tan Ai Min
Keyword(s):  
Flip Chip ◽  
Solder Interconnection ◽  
Fine Pitch ◽  
Flip Chip Packaging

UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging

2004 ◽  
Author(s):  
Seung Wook Yoon ◽  
V. Kripesh ◽  
Wong Wai Kwan ◽  
Li Chao Yong ◽  
Chen Man Tong ◽  
...  
Keyword(s):  
Flip Chip ◽  
Fine Pitch ◽  
Flip Chip Packaging ◽  
Low K

Under bump metallurgy study on copper/low-k dielectrics for fine pitch flip chip packaging

2004 ◽  
Vol 33 (10) ◽  
pp. 1144-1155 ◽  
Author(s):  
Seung Wook Yoon ◽  
Vaidyanathan Kripesh ◽  
Su Young Ji Jeffery ◽  
Mahadevan K. Iyer
Keyword(s):  
Flip Chip ◽  
Fine Pitch ◽  
Flip Chip Packaging ◽  
Low K

A High-Linearity 76–85-GHz 16-Element 8-Transmit/8-Receive Phased-Array Chip With High Isolation and Flip-Chip Packaging

2014 ◽  
Vol 62 (10) ◽  
pp. 2337-2356 ◽  
Author(s):  
Bon-Hyun Ku ◽  
Ozgur Inac ◽  
Michael Chang ◽  
Hyun-Ho Yang ◽  
Gabriel M. Rebeiz
Keyword(s):  
Flip Chip ◽  
Phased Array ◽  
High Isolation ◽  
High Linearity ◽  
Flip Chip Packaging
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