Dynamic Qualification of High Speed Solder Ball Shear Transducer Calibration

2007 ◽  
Author(s):  
Richard Griffin ◽  
Robert Sykes
Keyword(s):  
High Speed ◽  
Solder Ball ◽  
Ball Shear ◽  
Transducer Calibration

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Pb-free PBGA Design Points to Improve Handling Robustness

2012 ◽  
Vol 2012 (1) ◽  
pp. 000110-000118 ◽  
Author(s):  
Isabel de Sousa ◽  
Brian Roggeman ◽  
Oswaldo Chacon ◽  
Niki Spencer ◽  
Mamoru Ueno
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
High Strain ◽  
Strain Rates ◽  
Process Variables ◽  
Flexural Stress ◽  
High Strain Rates ◽  
Ball Shear ◽  
Laminate Design ◽  
Free Solder

Pb-Free BGA solder joints are more brittle and more susceptible to interfacial fails than the leaded versions. These brittle failures typically occur if the modules are subjected to high strain rates through module handling impacts or PCB flexural stress. The high speed ball shear technique is a useful method to submit solder joints to high strain rates in a controlled manner to emulate the levels of strain the BGAs may see in handling. This measurement technique was used to evaluate different laminate design and process variables on organic laminate substrates to create a more robust Pb-Free solder joint. Experiments were conducted to evaluate the effects and interactions of laminate, module assembly process, SAC alloy composition, and thermal treatments. Modulations of shear speed and shear angle made it possible to observe transitions from ductile to brittle solder fractures. The high speed ball shear method was successful to differentiate subtle effects resulting from different design points and process variables. The copper composition in the PbFree solder alloy, thermal history, and geometric factors such as solder volume, solder resist opening and solder resist thickness all had measurable impacts on the shear strength and transition point of ductile to brittle failure. Some BGA configurations have also been tested in reliability, namely in thermal cycling, and were shown to meet application requirements. Optimal design points can therefore be applied to enhance handling robustness without compromising on reliability.

A New Method for the Solder Ball Pull Test Using a Shape Memory Alloy Tube

2004 ◽  
Author(s):  
Jeffery Lo ◽  
Dennis Lau ◽  
S. W. Ricky Lee ◽  
Simon Chan ◽  
Frank Chan ◽  
...  
Keyword(s):  
Shape Memory Alloy ◽  
Shape Memory ◽  
Shear Test ◽  
Solder Ball ◽  
Shear Loading ◽  
Ball Shear ◽  
Pull Test ◽  
Ball Shear Test ◽  
Attachment Strength ◽  
Inner Diameter

The solder ball shear test is a commonly used method to evaluate the attachment strength of solder balls. However, some previous studies indicated that the solder ball shear test may not be suitable for showing the effect of intermetallic compound (IMC) growth due to thermal aging. This is because the IMC layer is thin and not susceptible to the shear loading. Since the IMC layer consists of brittle materials, the ball pull test should be a better method to evaluate the solder ball attachment strength. The major challenge of conducting a solder ball pull test is how to grip the solder ball. This paper presents an innovative method for conducting the solder ball pull test. A shape memory alloy (SMA) tube is used to grip the solder ball and pull it off from the substrate. The inner diameter of the SMA tube is originally smaller than the diameter of the solder ball under testing. Once the temperature is raised to higher than the switching temperature of SMA, the SMA tube will expand radially, resulting an inner diameter larger than the solder ball. After the SMA tube cools down, the tube contracts and grips the solder ball firmly. The solder ball can then be pulled off from the attached substrate by frictional force. A prototype of the aforementioned solder ball pull test device has been developed. Some preliminary testing results are presented in this paper.

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test

2009 ◽  
Vol 38 (12) ◽  
pp. 2489-2495 ◽  
Author(s):  
Sang-Su Ha ◽  
Jin-Kyu Jang ◽  
Sang-Ok Ha ◽  
Jong-Woong Kim ◽  
Jeong-Won Yoon ◽  
...  
Keyword(s):  
Mechanical Property ◽  
High Speed ◽  
Shear Test ◽  
Solder Joints ◽  
Ball Shear ◽  
Property Evaluation ◽  
Ball Shear Test

Optimum Shear Height for Evaluation of Pb-Free Solder Ball Shear Strength

2005 ◽  
Vol 486-487 ◽  
pp. 269-272 ◽  
Author(s):  
Jong Woong Kim ◽  
Sun Kyu Park ◽  
Seung Boo Jung
Keyword(s):  
Solder Ball ◽  
High Standard ◽  
Test Results ◽  
Element Analysis ◽  
Test Parameter ◽  
Ball Shear ◽  
Ball Shear Test ◽  
Ball Surface ◽  
Free Solder ◽  
Ball Shear Strength

Ball shear test was investigated in terms of the effects of important test parameter, i.e., shear height, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. The substrate was a common SMD type with solder bond pad openings of 460 ㎛ in diameter. It was observed that increasing the shear height, at a fixed shear speed, has the effect of decreasing the shear force. The high shear height could cause some bad effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball surface. The low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces.

The mechanics of the solder ball shear test and the effect of shear rate

2006 ◽  
Vol 417 (1-2) ◽  
pp. 259-274 ◽  
Author(s):  
Julian Yan Hon Chia ◽  
Brian Cotterell ◽  
Tai Chong Chai
Keyword(s):  
Shear Rate ◽  
Shear Test ◽  
Solder Ball ◽  
Ball Shear ◽  
Ball Shear Test
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