Effect of Metallic Coatings on the Thermal Contact Conductance of Turned Surfaces

1990 ◽  
Vol 112 (4) ◽  
pp. 864-871 ◽  
Author(s):  
T. K. Kang ◽  
G. P. Peterson ◽  
L. S. Fletcher
Keyword(s):  
Experimental Data ◽  
Thermal Contact ◽  
Coating Material ◽  
Thermal Contact Conductance ◽  
Enhancement Effect ◽  
Metallic Coatings ◽  
Coating Materials ◽  
Contact Conductance ◽  
Significant Parameter ◽  
Contact Pressures

An experimental investigation was conducted to determine the degree to which the thermal contact conductance at the interface of contacting Aluminum 6061 T6 surfaces could be enhanced through the use of vapor-deposited metallic coatings. Three different coating materials (lead, tin, and indium) were evaluated using four different thicknesses for each coating material. The results verified the existence of an optimum coating thickness, shown to be in the range of 2.0 to 3.0 μm for indium, 1.5 to 2.5 μm for lead, and 0.2 to 0.5 μm for tin. The enhancement factors for thermal contact conductance were found to be on the order of 700, 400, and 50 percent, respectively. Based upon the experimental data, the hardness of the coating materials appears to be the most significant parameter in ranking the substrate and coating material combinations; however, additional experimental data are needed to substantiate this hypothesis. Finally, it was apparent that the thermal contact conductance enhancement effect was greatest at low contact pressures and decreased significantly with increases in the contact pressure.

Thermal Contact Conductance Across Gold-Coated OFHC Copper Contacts in Different Media

2005 ◽  
Vol 127 (6) ◽  
pp. 657-659 ◽  
Author(s):  
Bapurao Kshirsagar, ◽  
Prashant Misra, ◽  
Nagaraju Jampana, and ◽  
M. V. Krishna Murthy
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Pressure ◽  
Thermal Contact ◽  
High Conductivity ◽  
Thermal Contact Conductance ◽  
Ofhc Copper ◽  
Contact Conductance ◽  
Contact Pressures ◽  
Good Agreement

The thermal contact conductance studies across gold-coated oxygen-free high-conductivity copper contacts have been conducted at different contact pressures in vacuum, nitrogen, and helium environments. It is observed that the thermal contact conductance increases not only with the increase in contact pressure but also with the increase in thermal conductivity of interstitial medium. The experimental data are found to be in good agreement with the literature.

The Use of Analog Computers for Determining Surface Parameters Required for Prediction of Thermal Contact Conductance

1964 ◽  
Vol 86 (4) ◽  
pp. 543-550 ◽  
Author(s):  
J. J. Henry ◽  
H. Fenech
Keyword(s):  
Experimental Data ◽  
Unit Area ◽  
Thermal Contact ◽  
Analog Computer ◽  
General Purpose ◽  
Thermal Contact Conductance ◽  
Average Thickness ◽  
Contact Interface ◽  
Contact Conductance ◽  
Surface Profiles

The mathematical analysis of a thermal contact by Fenech and Rohsenow requires knowledge of certain parameters describing the geometry of the contact interface. These parameters are volume average thickness of the void above and below the plane of the contact, the number of contacts per unit area, and the ratio of the actual contact area to the total area. The authors outline a method for determining these parameters graphically. This paper describes a method for obtaining analog voltages of surface profiles of contacting surfaces and the application of a general purpose analog computer to determine the geometric parameters of contact as a function of contact pressure. The results of applying this method are combined with the analysis of Fenech and Rohsenow. The predicted contact conductance is found to agree well with experimental data at mean contact temperatures of 100, 200, and 300 F for load pressures of 100 to 20,000 psi.

Measurement of the Thermal Contact Conductance and Thermal Conductivity of Anodized Aluminum Coatings

1990 ◽  
Vol 112 (3) ◽  
pp. 579-585 ◽  
Author(s):  
G. P. Peterson ◽  
L. S. Fletcher
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Coating Thickness ◽  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Aluminum Surface ◽  
Anodized Aluminum ◽  
Contact Conductance ◽  
Surface Measurements

An experimental investigation was conducted to determine the thermal contact conductance and effective thermal conductivity of anodized coatings. One chemically polished Aluminum 6061-T6 test specimen and seven specimens with anodized coatings varying in thickness from 60.9 μm to 163.8 μm were tested while in contact with a single unanodized aluminum surface. Measurements of the overall joint conductance, composed of the thermal contact conductance between the anodized coating and the bare aluminum surface and the bulk conductance of the coating material, indicated that the overall joint conductance decreased with increasing thickness of the anodized coating and increased with increasing interfacial load. Using the experimental data, a dimensionless expression was developed that related the overall joint conductance to the coating thickness, the surface roughness, the interfacial pressure, and the properties of the aluminum substrate. By subtracting the thermal contact conductance from the measured overall joint conductance, estimations of the effective thermal conductivity of the anodized coating as a function of pressure were obtained for each of the seven anodized specimens. At an extrapolated pressure of zero, the effective thermal conductivity was found to be approximately 0.02 W/m-K. In addition to this extrapolated value, a single expression for predicting the effective thermal conductivity as a function of both the interface pressure and the anodized coating thickness was developed and shown to be within ±5 percent of the experimental data over a pressure range of 0 to 14 MPa.

scholarly journals Thermal Contact Conductance at Low Contact Pressures

2004 ◽  
Vol 18 (1) ◽  
pp. 37-44 ◽  
Author(s):  
Fernando H. Milanez ◽  
Michael M. Yovanovich ◽  
Marcia B. H. Mantelli
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
Contact Pressures

Thermal Contact Resistance Modeling of Non-Flat, Roughened Surfaces With Non-Metallic Coatings

2000 ◽  
Vol 123 (1) ◽  
pp. 11-23 ◽  
Author(s):  
E. E. Marotta ◽  
L. S. Fletcher ◽  
Thomas A. Dietz
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Metallic Coatings ◽  
Thermomechanical Model ◽  
Contact Conductance ◽  
Flat Surfaces ◽  
Resistance Modeling ◽  
Aluminum Substrates

Essentially all models for prediction of thermal contact conductance or thermal contact resistance have assumed optically flat surfaces for simplification. A few thermal constriction models have been developed which incorporate uncoated, optically non-flat surfaces based on the bulk mechanical properties of the material. Investigations have also been conducted which incorporate the thermophysical properties of metallic coatings and their effective surface microhardness to predict the overall thermal contact conductance. However, these studies and subsequent models have also assumed optically flat surfaces; thus, the application of these models to optically non-flat, coated surface conditions is not feasible without modifications. The present investigation develops a thermomechanical model that combines both microscopic and macroscopic thermal resistances for non-flat, roughened, surfaces with non-metallic coatings. The thermomechanical model developed as a result of this study predicts the thermal contact resistance of several non-metallic coatings deposited on metallic aluminum substrates quite well.

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