A 232-channel retinal vision prosthesis with a miniaturized hermetic package

2012 ◽  
Author(s):  
J. S. Ordonez ◽  
M. Schuettler ◽  
M. Ortmanns ◽  
T. Stieglitz
Keyword(s):  
Hermetic Package

The impact of oxygen content on the reliability of Au-20Sn solder hermetic package

Vacuum ◽  
2020 ◽  
Vol 181 ◽  
pp. 109754
Author(s):  
Liujue Wang ◽  
Songbai Xue ◽  
Yaowei Lin ◽  
Hongneng Chen
Keyword(s):  
Oxygen Content ◽  
The Impact ◽  
Hermetic Package

A fluxless bonding process using AuSn or Indium for a miniaturized hermetic package

2009 ◽  
Author(s):  
Marion Volpert ◽  
Christophe Kopp ◽  
Julien Routin ◽  
Adrien Gasse ◽  
Stephane Bernabe ◽  
...  
Keyword(s):  
Bonding Process ◽  
Fluxless Bonding ◽  
Hermetic Package

Hermetic Packaging of Micro Scanner for Laser Display Applications

2005 ◽  
Author(s):  
Won Kyoung Choi ◽  
Moon Gi Cho ◽  
Sun Kyoung Seo ◽  
Hyuck Mo Lee ◽  
Byung Gil Jeong ◽  
...  
Keyword(s):  
Shear Strength ◽  
Good Adhesion ◽  
Raster Scanning ◽  
Hermetic Packaging ◽  
Laser Display ◽  
Hermetic Sealing ◽  
Experiment Method ◽  
Environmental Variations ◽  
Long Lifetime ◽  
Hermetic Package

Laser display technologies have been developed for an excellent expression of natural color, low power consumption and a long lifetime compared to other advanced displays, such as LCD, PDP and other projection type displays. The micro scanner is one of the key devices to make possible the raster scanning type laser projection displays. And the hermetic package of the micro scanner should be required for the protection from the environmental variations so as to keep the driving behavior uniform. Hermetic package can be ensured when the package is sealed hermetically without generating any outgases in the cavity. Thus, the hermetic sealing process was optimized through DOE (Design of Experiment) method using the Sn-In-Ag solder alloys instead of adhesives. And the characterizations of the packages were carried out in terms of hermeticity, shear strength, and interface microstructures. As a result, we’ve got about 2E−9 atm cc/sec He leak rate, which is low enough to pass the standard (MIL-STD-883E). Shear strength was as high as ∼80 MPa. The C-mode SAM images showed the continuous sealing area without any voids. In addition, the interfacial microstructures revealed good adhesion to the both parts, the glass lid and the ceramic package.

High Performance Hermetic Package For LiNbO 3 Electro-Optic Waveguide Devices

1989 ◽  
Author(s):  
K. R. Preston ◽  
B. M. Macdonald ◽  
R. A. Harmon ◽  
C. W. Ford ◽  
R. N. Shaw ◽  
...  
Keyword(s):  
High Performance ◽  
Waveguide Devices ◽  
Electro Optic ◽  
Optic Waveguide ◽  
Hermetic Package

Composition and Form: How Feedthrough Design Affects Package Hermeticity

2014 ◽  
Vol 2014 (1) ◽  
pp. 000538-000543
Author(s):  
Richard R. Share
Keyword(s):  
Optimal Design ◽  
Thermal Shock ◽  
Structural Integrity ◽  
Force Model ◽  
Design Features ◽  
Track Record ◽  
Inherent Vulnerability ◽  
Ceramic Insulators ◽  
Hermetic Package

Ceramic-insulated feedthroughs have been in use in microelectronic packages for decades. Their track record is generally good, but not unblemished. This is because ceramic insulators tend to crack under stress - the stress of assembly temperatures, thermal shock screening and fine leak pressurization. The cracks often propagate to surface termination, forming leak paths and rendering afflicted packages non-hermetic. Package manufacturers have long battled this phenomenon and developed a number of creative designs that attempt to prevent, minimize and/or contain this inherent vulnerability. Yet it persists. To successfully prevent this undesired effect, the factors causal to its origination must be identified, understood and eliminated. That is to say, the effects of the constituent components or parts – the package wall, insulator, conductor and brazes – in summation and subtraction, in function and failure, on the integrity and reliability of the whole must be understood in order to design a package robust to thermal and pressural excursions. The optimal design will consist of components with complimentary properties of composition and form; properties that in interaction with one another multiplicatively enhance package robustness and reliability. Any other design will be vulnerable to failure. Herein, the effects of the component properties of composition and form on the structural integrity, reliability and hermeticity of metal cases employing ceramic insulators will be discussed, the primary factors causal to contemporary feedthrough hermeticity failures will be introduced in the form of a simplified force model, an optimization case study will be presented in brief, and currently utilized design features will be objectively compared and assessed.

Wafer-Lever Hermetic Package with Through-Wafer Interconnects

2007 ◽  
Vol 36 (2) ◽  
pp. 105-109 ◽  
Author(s):  
Wang Yu-Chuan ◽  
Zhu Da-Peng ◽  
Xu Wei ◽  
Le Luo
Keyword(s):  
Hermetic Package
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