Study of a silica glass SiO2-Na2O refractive index to fabrication of fiber optic with Brewster method

<p align="justify">One of the critical parameters in the fabrication of fiber optic is refractive index value from the fiber optic material. That is because the main requirement phase of critical angle on the fiber optic waveguide is a core refractive index higher than the cladding. Therefore, refractive index values must be calculated first. The research aim is to study refractive index value of fiber optic material on the fiber optic fabrication. Refractive index value determined by using the brewster method. For this aim, the first step is an establish glass silica to a thin plate. Then thin plate inserts to the sketch of brewster experiment. The brewster method has the aim to determine the reflectance value of the light on transfer magnetic (TM) polarization. The Brewster angle determined by searching the minimum reflectance value of the light on this TM polarization. In this research, the brewster angle obtained by 55.333 degrees. This brewster angle used to calculate the refractive index value from the fiber optic material glass silica. The result of refractive index value at 1.446.</p>

Fabrication Processes of SOI Structure for Optical Nonreciprocal Devices

Fabrication processes of a magneto-optic waveguide with a Si guiding layer for an optical isolator employing a nonreciprocal guided-radiation mode conversion are investigated. The optical isolator is constructed on a silicon-on-insulator (SOI) structure. The magneto-optic waveguide is fabricated by bonding the Si guiding layer with a cerium-substituted yttrium iron garnet (Ce:YIG). The relationship of waveguide geometric parameters is determined at a wavelength of 1550 nm. The results show that larger tolerance for isolator operation can be obtained at smaller gaps between Si and Ce:YIG. Bonding processes including photosensitive adhesive bonding and surface activated bonding are then compared. It is found that the surface activated bonding process is easier to control and more promising than the photosensitive adhesive bonding.