Study on the touch risk of high density packaging bonding wire under mechanical shock condition

2017 ◽  
Author(s):  
Hantian Gu ◽  
Ming Zhu ◽  
Wei Zhang ◽  
Hengjing Zhu ◽  
Lei Zhang
Keyword(s):  
High Density ◽  
Mechanical Shock ◽  
Shock Condition ◽  
Bonding Wire ◽  
High Density Packaging

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Guicui Fu ◽  
Maogong Jiang ◽  
Bo Wan ◽  
Yanruoyue Li ◽  
Cheng Ma
Keyword(s):  
Numerical Simulation ◽  
Risk Assessment ◽  
Vibration Frequency ◽  
Short Circuit ◽  
High Density ◽  
Mechanical Shock ◽  
Shock Condition ◽  
Bonding Wire ◽  
Bonding Wires ◽  
Hermetic Package

Long bonding wires may swing significantly and touch with adjacent ones, which will result in short circuit under mechanical condition, especially in aerospace applications. This may seriously affect the operational reliability of high-density hermetic package components. The aim of this paper is to assess the touch risk of high-density package component under mechanical shock condition. An experiment setup, which can obtain the touch critical load and detect the wires swing touch through voltage signal captured by oscilloscope, is designed and built. To obtain the vibration data of different bonding wire structures under different shock loads, numerical simulation models are established after verified by the experimental data. Additionally, initial swing amplitude model, vibration frequency model, and damped coefficient model are established based on the simulation and experiment data. Furthermore, wire swing touch risk assessment model is established in consideration of the distribution of wire structure and shock load deviation. Based on the verified numerical simulation model, vibration characteristic parameters, including the initial swing amplitude, vibration frequency, and damped coefficient, can be calculated by numerical simulation and experimental results. The proposed method can be used to assess bonding wire touch risk in high-density hermetic package quantitatively. Potential touch risk, which cannot be reflected by failure analysis of structure damage after test, can also be detected by the electronic measurement designed in this paper. The proposed method can effectively reflect short circuit between long bonding wires of hermetic package in large shock applications, such as transport and launch.

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

2005 ◽  
Vol 297-300 ◽  
pp. 837-843
Author(s):  
Takashi Hasegawa ◽  
Masumi Saka
Keyword(s):  
Current Density ◽  
Solder Bump ◽  
High Density ◽  
Solder Bumps ◽  
Multi Phase ◽  
High Density Packaging

Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.

Photosensitive Dielectric Film Developed Using a Polymer Blend

1992 ◽  
Vol 264 ◽  
Author(s):  
M. Tani ◽  
S. Miyahara ◽  
E. Horikoshi ◽  
K. Natori ◽  
T. Sato
Keyword(s):  
Polymer Blend ◽  
Dielectric Film ◽  
High Density ◽  
Passivation Layer ◽  
New Materials ◽  
Photosensitive Film ◽  
High Density Packaging

AbstractWe developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.

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