2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications

TOTAL DOCUMENTS

161

(FIVE YEARS 0)

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Published By IEEE

9781538612385

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Physically derived micro-modeling circuit for loop antenna of arbitrary shape

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277041 ◽

2017 ◽

Author(s):

Yuhang Dou ◽

Ke-Li Wu

Keyword(s):

Arbitrary Shape ◽

Loop Antenna ◽

Micro Modeling

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Parallel restricted polling control for wireless sensor networks with busy state

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277060 ◽

2017 ◽

Cited By ~ 1

Author(s):

Zhijun Yang ◽

Yangyang Sun

Keyword(s):

Wireless Sensor Networks ◽

Sensor Networks ◽

Wireless Sensor

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The radiation characterization analysis of dielectric antenna based on S-PEEC model

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276989 ◽

2017 ◽

Author(s):

Yang Jiang ◽

Yuhang Dou ◽

Ke-Li Wu

Keyword(s):

Dielectric Antenna

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A high-isolation ku-band SPDT switch in 0.35μm SiGe BiCMOS technology

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276986 ◽

2017 ◽

Author(s):

Zhe Fan ◽

Kaixue Ma ◽

Shouxian Mou ◽

Fanyi Meng

Keyword(s):

High Isolation ◽

Bicmos Technology ◽

Sige Bicmos ◽

Ku Band

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Comparison of thermal stress under TCT between SiC and Si power devices using direct chip-bonding with ag sintered layer on Cu plate

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276946 ◽

2017 ◽

Author(s):

Masaki Kanemoto ◽

Masaaki Aoki ◽

Akihiro Mochizuki ◽

Yoshio Murakami ◽

Mutsuharu Tsunoda ◽

...

Keyword(s):

Thermal Stress ◽

Power Devices ◽

Sintered Layer

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A compact filtering power divider based on SIW triangular cavities

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276951 ◽

2017 ◽

Cited By ~ 2

Author(s):

Yujie Wang ◽

Chunxia Zhou ◽

Kang Zhou ◽

Wen Wu

Keyword(s):

Power Divider

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Copyright page

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277064 ◽

2017 ◽

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Thermal fatigue life analysis of defective solder joints based on engelmaier fatigue model

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277021 ◽

2017 ◽

Author(s):

Jianwei Zuo ◽

Guicui Fu ◽

Yutai Su ◽

Maogong Jiang

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Solder Joints ◽

Thermal Fatigue Life ◽

Fatigue Model ◽

Life Analysis ◽

Fatigue Life Analysis

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Research on self-powered short-circuit fault alarming system in power grid

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277053 ◽

2017 ◽

Author(s):

Shulin Liu ◽

Dandan Xu

Keyword(s):

Short Circuit ◽

Power Grid ◽

Self Powered ◽

Short Circuit Fault

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A novel tapered HTS microstrip bandstop EBG structure

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276973 ◽

2017 ◽

Cited By ~ 1

Author(s):

Yan Li ◽

Xiao-chun Li ◽

Jun-fa Mao

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2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Physically derived micro-modeling circuit for loop antenna of arbitrary shape

Parallel restricted polling control for wireless sensor networks with busy state

The radiation characterization analysis of dielectric antenna based on S-PEEC model

A high-isolation ku-band SPDT switch in 0.35μm SiGe BiCMOS technology

Comparison of thermal stress under TCT between SiC and Si power devices using direct chip-bonding with ag sintered layer on Cu plate

A compact filtering power divider based on SIW triangular cavities

Copyright page

Thermal fatigue life analysis of defective solder joints based on engelmaier fatigue model

Research on self-powered short-circuit fault alarming system in power grid

A novel tapered HTS microstrip bandstop EBG structure

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications