Polyimide Fine-via Etching and Low-damage Surface-modification Process For High-density Fan-out Wafer Level Package

2020 ◽  
Author(s):  
Yasuhiro Morikawa ◽  
Daisuke Hironiwa ◽  
Takahide Murayama
Keyword(s):  
Surface Modification ◽  
High Density ◽  
Wafer Level ◽  
Modification Process ◽  
Wafer Level Package

Growth of Silicon Films Onto Fluororesin Surface by ArF Excimer Laser

1993 ◽  
Vol 334 ◽  
Author(s):  
T. Miyokawa ◽  
M. Okoshi ◽  
K. Toyoda ◽  
M. Murahara
Keyword(s):  
Surface Roughness ◽  
Surface Modification ◽  
Excimer Laser ◽  
High Density ◽  
Silicon Films ◽  
Chemical Compositions ◽  
Xps Analysis ◽  
Modification Process ◽  
Arf Excimer Laser ◽  
Mixed Gases

AbstractSilicon films were deposited on a fluororesin surface. The process was divided into two steps: surface modification process and silicon CVD onto the modified parts. In the modification process, SiH4 and B(CH3)3 mixed gases were used with ArF excimer laser. Fluorine atoms of the surface were pulled out by boron atoms which were photo—dissociated from B(CH3)3 and were replaced with silicon atoms released from SiH4. In the CVD process, SiH4 gas was used with high—density excited ArF excimer laser. Silicon films were deposited onto the nuclei by photodecomposition of SiH4.Chemical compositions of the modified layers and the deposited parts were inspected by XPS analysis. 1000 Å thickness of the deposited silicon films was confirmed by the surface roughness interference–meter.

High Density Copper Bump Technology Integrated With Wafer Level Package

2019 ◽  
Vol 16 (7) ◽  
pp. 15-21 ◽  
Author(s):  
Xiang Zeng ◽  
Patty Chang-Chien ◽  
Chi Cheung ◽  
G Akerling ◽  
Rosie Johnson ◽  
...  
Keyword(s):  
High Density ◽  
Wafer Level ◽  
Wafer Level Package
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