Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration

2019 ◽  
Author(s):  
Matthias Wietstruck ◽  
Sebastian Schulze ◽  
Bernhard Rebhan ◽  
Peter Kerepesi ◽  
Helmut Kurz ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Alignment Accuracy ◽  
Heterogeneous Integration ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Sige Bicmos

Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform

2021 ◽  
Author(s):  
Tc Chai ◽  
David Ho ◽  
Sc Chong ◽  
Ps Sharon Lim ◽  
Hy Hsiao ◽  
...  
Keyword(s):  
Heterogeneous Integration ◽  
Wafer Level ◽  
Wafer Level Packaging

Wafer level packaging compatible with millimeter-wave antenna

2012 ◽  
Vol 173 (1) ◽  
pp. 238-243 ◽  
Author(s):  
E. Herth ◽  
S. Seok ◽  
N. Rolland ◽  
T. Lasri
Keyword(s):  
Millimeter Wave ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Wave Antenna ◽  
Millimeter Wave Antenna
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