Wafer Form Warpage Characterization Based on Composite Factors Including Passivation Films, Re-Distribution Layers, Epoxy Molding Compound Utilized in Innovative Fan-Out Package

2017 ◽  
Author(s):  
Cheng-Hsiang Liu ◽  
Lu-Yi Chen ◽  
Chang-Lun Lu ◽  
Hung-Chi Chen ◽  
Cheng-Yi Chen ◽  
...  
Keyword(s):  
Epoxy Molding Compound ◽  
Molding Compound

Warpage Control Method in Epoxy Molding Compound

2020 ◽  
Author(s):  
Wei Tan ◽  
Cheng Cheng ◽  
Hongjie Liu ◽  
Yangyang Duan ◽  
Linlin Liu ◽  
...  
Keyword(s):  
Control Method ◽  
Epoxy Molding Compound ◽  
Molding Compound

Characterization of the rheological properties of a fast-curing epoxy-molding compound

1997 ◽  
Vol 41 (2) ◽  
pp. 177-195 ◽  
Author(s):  
Sejin Han ◽  
K. K. Wang ◽  
C. A. Hieber ◽  
C. Cohen
Keyword(s):  
Rheological Properties ◽  
Epoxy Molding Compound ◽  
Molding Compound

scholarly journals Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

ACS Omega ◽  
2021 ◽  
Author(s):  
Naoaki Tsurumi ◽  
Yuta Tsuji ◽  
Noriyuki Masago ◽  
Kazunari Yoshizawa
Keyword(s):  
Adhesive Interaction ◽  
Epoxy Molding Compound ◽  
Molding Compound
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