Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range

2016 ◽  
Author(s):  
Nianjun Fu ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Plastic Strain ◽  
Strain Range ◽  
Cyclic Stress ◽  
Lead Free ◽  
Lead Free Solder ◽  
Plastic Strain Range ◽  
Strain Behavior ◽  
Free Solder ◽  
Effects Of Aging ◽  
Temperature Strain

Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders

2019 ◽  
Author(s):  
Mohammad Ashraful Haq ◽  
Mohd Aminul Hoque ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Strain Range ◽  
Peak Stress ◽  
Cyclic Stress ◽  
Lead Free ◽  
Stress Strain ◽  
Plastic Strain Range ◽  
Strain Behavior ◽  
Loop Area ◽  
Prior Aging ◽  
Lead Free Solders

Abstract In temperature changing environments, solder joints often experience fatigue failure due to cyclic mechanical stresses and strains induced by mismatches in the coefficients of thermal expansion. These stresses and strains lead to damage accumulation and contribute to the crack initiation, crack propagation, and eventually to failure. In this study, we have investigated the cyclic stress-strain behavior of SAC305 and SAC_Q reflowed lead free solders that occur at various testing temperatures and with various prior aging conditions. Lead free solder uniaxial test specimens with circular cross-section have been prepared using vacuum suction method and then were aged for 0 to 20 days at 125 °C. The samples were then subjected to cyclic stress-strain loading using a Micro-mechanical tester at different testing temperatures from T = 25 C to T = 100 C. The evolution of hysteresis loops with duration of prior aging was characterized by measuring the strain energy density dissipated per cycle (loop area), peak stress, and plastic strain range. It was observed that aging degrades the mechanical fatigue properties due to microstructural coarsening. At elevated temperatures, a drop in the loop area and peak stress and an increase in the plastic strain range for both lead free reflowed solder materials were obtained. In addition, SAC_Q samples had a higher loop area and peak stress compared to SAC305.

scholarly journals The Influences Which Constitutive Models for Lead-Free Solder Alloys in General FEA Programs Give to Accumulated Inelastic Strain Behavior

2016 ◽  
Vol 5 (4) ◽  
pp. 266-274
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Masaaki TAKABE ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI ◽  
...  
Keyword(s):  
Constitutive Models ◽  
Inelastic Strain ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Strain Behavior ◽  
Free Solder

G0300101 Proposal of Acquisition Way of Inelastic Strain Range Using Lead-Free Solder Lap Joint Type Shear Specimen

2015 ◽  
Vol 2015 (0) ◽  
pp. _G0300101--_G0300101-
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Yoshinori EBIHARA ◽  
Jyo SHIMURA
Keyword(s):  
Strain Range ◽  
Inelastic Strain ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lap Joint ◽  
Shear Specimen ◽  
Free Solder

Low-Cycle Fatigue of AISI 1010 Steel at Temperatures up to 1200°F (649°C)

1977 ◽  
Vol 99 (3) ◽  
pp. 432-443 ◽  
Author(s):  
C. E. Jaske
Keyword(s):  
Plastic Strain ◽  
Fatigue Resistance ◽  
Stress Amplitude ◽  
Low Cycle Fatigue ◽  
Strain Range ◽  
Cyclic Stress ◽  
Cyclic Life ◽  
Stress Strain ◽  
Plastic Strain Range ◽  
Tensile Hold

This program was undertaken to develop isothermal low-cycle fatigue information for AISI 1010 steel in air. Such information is needed to help predict acceptable conditions for equipment and structures operating at elevated temperatures. Tensile properties and cyclic stress-strain behavior were also developed. For lives between 103 and 106 cycles to failure, fatigue curves were developed at 70, 400, 600, 800, 1000, and 1200°F (21, 204, 316, 427,538, and 649°C). Data for these curves were obtained from constant-amplitude, fully reversed strain-cycling tests of axially loaded specimens. Results from the same experiments were used to define cyclic stress-strain curves at each of the above temperatures. Dynamic strain aging caused a maximum amount of cyclic hardening at 600°F (316°C). In terms of stress amplitude, the maximum fatigue strength was at 600°F (316°C). In terms of either total strain range or plastic strain range, the maximum fatigue resistance was at 400°F (204°C). At temperaures above 600°F (316°C), fatigue resistance decreased as temperature increased. Tensile hold periods caused a significant reduction in cyclic life at 800 and 1000°F (427 and 538°C) but had no noticeable effect on cyclic life at 600°F (316°C). Fatigue resistance was quantified in terms of power functions relating fatigue life to both plastic strain range and stress amplitude, and cyclic stress-strain response was quantified in terms of a power function relating stress amplitude to plastic strain amplitude. The method of strain-range partitioning provided good cyclic life predictions for the limited number of tensile hold-time experiments, although other types of hold periods were not evaluated.

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

2008 ◽  
Vol 130 (1) ◽  
Author(s):  
Wen-Ren Jong ◽  
Hsin-Chun Tsai ◽  
Hsiu-Tao Chang ◽  
Shu-Hui Peng
Keyword(s):  
Low Temperature ◽  
Shear Strain ◽  
Solder Joints ◽  
Strain Range ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Free Solder ◽  
Plastic Creep

In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies are investigated by Taguchi method. The orthogonal arrays of L16 is applied to examine the shear strain effects of solder joints under five temperature loading parameters of the temperature ramp rate, the high and low temperature dwells, and the dwell time of both high and low temperatures by means of three simulated analyses of creep, plastic, and plastic-creep behavior on the WLCSP assemblies. It is found that the temperature dwell is the most significant factor on the effects of shear strain range from these analyses. The effect of high temperature dwell on the shear strain range is larger than that of low temperature dwell in creep analysis, while the effect of high temperature dwell on the shear strain range is smaller than that of low temperature dwell in both plastic and plastic-creep analyses.

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