Thin polymer dry-film dielectric material and a process for 10 um interlayer vias in high density organic and glass interposers

2014 ◽  
Author(s):  
Yuya Suzuki ◽  
Yutaka Takagi ◽  
Venky Sundaram ◽  
Rao Tummala
Keyword(s):  
Dielectric Material ◽  
High Density ◽  
Thin Polymer ◽  
Film Dielectric ◽  
Dry Film

Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000361-000364
Author(s):  
Keith Best ◽  
Ognian Dimov ◽  
Sudmun Habib ◽  
Sanjay Malik
Keyword(s):  
Dielectric Material ◽  
Dielectric Materials ◽  
High Density ◽  
Thermal Shrinkage ◽  
Seed Formation ◽  
Mechanical And Electrical Properties ◽  
Advanced Packaging ◽  
Negative Tone ◽  
The Cost ◽  
Dry Film

Abstract This paper presents a new dielectric material capable of resolving 2 to 3μm features that are required for high density advanced packaging applications. The material is applied in dry film format to be conducive to panel-level processing. The material can be processed at temperatures below 170°C and total thermal shrinkage is below 5%, resulting in exceptionally low stress of 11 MPa. The film is thermally stable at temperatures up to 350°C. Mechanical and electrical properties of the material are state of the art. As the demand for high density packages increases, so will the pressure to lower the cost of manufacturing. Migrating from wafers to large non-circular panels offers several key cost advantages. There are multiple technical challenges that need to be addressed before commercial viability of panel scale manufacturing can be established. A new class of novel dielectric materials will be needed that can be processed at low temperatures and demonstrate low shrinkage to minimize warpage. In this study, 2 to 3μm patterns were successfully formed using i-line stepper exposure conditions. The process started by laminating a 510mm × 515mm panel with highly photosensitive dielectric film. The laminated panels were exposed at a nominal dose of 125 mJ/cm2. Fine negative tone patterns were created after development. For the metallization of the layer, the seed layer was deposited with titanium-copper sputtering. After the seed formation, trenches were filled with copper by an electrolytic plating process.

scholarly journals On the drying kinetics of non-spherical particle-filled polymer films: A numerical study

2021 ◽  
Author(s):  
Víctor Gracia ◽  
Philip Scharfer ◽  
Wilhelm Schabel
Keyword(s):  
Aspect Ratio ◽  
Numerical Study ◽  
Polymer Particle ◽  
Concentration Profiles ◽  
Material System ◽  
Particle Mobility ◽  
Alcohol Water ◽  
Thin Polymer ◽  
Dry Film

During the coating and drying of thin polymer-particle composites, the particle geometry has a big impact on the prediction of concentration profiles in the dry film. In this work, a plate-like geometry is used to evaluate the mass transport of the particles with the aspect ratio as a variable. The experimental determination of the viscosity and sedimentation rates allows to simulate concentration profiles in the wet film while drying. A previous simulation model was automatized to describe the drying of the plate-like particles-polyvinyl alcohol-water material system using COMSOL with the initial concentration, aspect ratio, Péclet number, and Sedimentation number as input parameters. The results are summarized in drying regime maps, which show an increase of the evaporation regime, when the aspect ratio decreases due to lower particle mobility. This shows the importance of the geometry while predicting the particle distribution in the dry film and designing coating and drying processes.

Microvia Formation in 5- $\mu \text{m}$ -Thick Dry-Film Dielectric by Ozone Etch Processes

2017 ◽  
Vol 7 (12) ◽  
pp. 2073-2078
Author(s):  
Yuya Suzuki ◽  
Eric Snyder ◽  
Chengxiang Ji ◽  
Steve Walther ◽  
Atul Gupta ◽  
...  
Keyword(s):  
Film Dielectric ◽  
Dry Film

Integrated Thin Film Capacitor Arrays Utilizing Sol-Gel Derived Ferroelectrics

1999 ◽  
Vol 596 ◽  
Author(s):  
David Liu ◽  
Steve Makl ◽  
Robert H. Heistand
Keyword(s):  
Thin Film ◽  
Large Scale ◽  
Dielectric Material ◽  
Low Cost ◽  
Sol Gel ◽  
Capacitance Measurement ◽  
Frequency Independent ◽  
Film Dielectric ◽  
Independent Behavior ◽  
Capacitor Arrays

AbstractNiobium-doped lead zircomate titanate (PNZT) thin film dielectric material has been produced on a large scale using a thick-coating sol-gel process. The material has been applied to the fabrication of commercial integrated capacitor array devices. Compared to conventional processes, this low-cost, long-shelf-life procedure had at least a 4-fold processing time enhancement. The specific capacitance of 2500 nF/cm2 and integrated density of over 200 component/cm2 have been demonstrated. The frequency domain capacitance measurement of integrated PNZT capacitors exhibits a frequency-independent behavior up to 2 GHz when a DC bias is applied. Leakage-voltage dependence follows the space-charge-limited-current (SCLC) mechanism. The fabricated integrated capacitor arrays pass the industrial standard of reliability for discrete multilayer capacitors.

scholarly journals Perylene bisbenzimidazole nonlinear dielectric material for energy storage

RSC Advances ◽  
2019 ◽  
Vol 9 (1) ◽  
pp. 361-364 ◽  
Author(s):  
Samuel J. Hein ◽  
Carine Edder ◽  
Marta Kowalczyk ◽  
Andrey Borzenko ◽  
Lev Mourokh ◽  
...  
Keyword(s):  
Energy Storage ◽  
Organic Molecule ◽  
Dielectric Material ◽  
High Density ◽  
Nonlinear Dielectric

We synthesized and characterized an organic molecule which can serve as a unit for high-density energy storage.

Characterization of Polymer Dielectrics for High-Density Electronic Packaging

1990 ◽  
Vol 203 ◽  
Author(s):  
David W. Wang ◽  
Ho-Ming Tong
Keyword(s):  
High Density ◽  
Multichip Modules ◽  
Circuit Boards ◽  
Plasma Etch ◽  
Materials Properties ◽  
Thermomechanical Characteristics ◽  
Low Dielectric ◽  
Polymer Dielectrics ◽  
And Function ◽  
Film Dielectric

ABSTRACTBecause of rapid advances in semiconductor technology, polymer dielectrics are finding widespread use in high-density packaging to improve performance and processability. Notable among these materials are polyimides, benzocyclobutene resins, and fluoropolymer containing composites.Polyimides have been used extensively for chip passivation and first-level packaging. Benzocyclobutenes, processed as conventional thermosets, are being investigated as thin film dielectric for use in multichip modules. A silicon containing derivative can be used as a plasma etch stop. Polytetrafluoroethylene is used either as matrix or reinforcement in circuit boards to produce a low dielectric constant composite.Knowledge of materials properties is crucial to ensure the reliability and function of products incorporating these polymers. In this article, a few selected characterization techniques for the determination of important materials properties such as solvent diffusion, plasma etch rate, and thermomechanical characteristics will be discussed.

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