Characterization of Polymer Dielectrics for High-Density Electronic Packaging

1990 ◽  
Vol 203 ◽  
Author(s):  
David W. Wang ◽  
Ho-Ming Tong
Keyword(s):  
High Density ◽  
Multichip Modules ◽  
Circuit Boards ◽  
Plasma Etch ◽  
Materials Properties ◽  
Thermomechanical Characteristics ◽  
Low Dielectric ◽  
Polymer Dielectrics ◽  
And Function ◽  
Film Dielectric

ABSTRACTBecause of rapid advances in semiconductor technology, polymer dielectrics are finding widespread use in high-density packaging to improve performance and processability. Notable among these materials are polyimides, benzocyclobutene resins, and fluoropolymer containing composites.Polyimides have been used extensively for chip passivation and first-level packaging. Benzocyclobutenes, processed as conventional thermosets, are being investigated as thin film dielectric for use in multichip modules. A silicon containing derivative can be used as a plasma etch stop. Polytetrafluoroethylene is used either as matrix or reinforcement in circuit boards to produce a low dielectric constant composite.Knowledge of materials properties is crucial to ensure the reliability and function of products incorporating these polymers. In this article, a few selected characterization techniques for the determination of important materials properties such as solvent diffusion, plasma etch rate, and thermomechanical characteristics will be discussed.

The Measurement of Triaxial Residual Stress in Polymer-Coated Aluminum Circuitry in Microchip Modules

1992 ◽  
Vol 36 ◽  
pp. 231-236
Author(s):  
Cyrus E. Crowder ◽  
Michael J. Radler ◽  
Paul Townsend
Keyword(s):  
Residual Stress ◽  
Thermal Expansion ◽  
Dielectric Permittivity ◽  
Residual Stresses ◽  
Maximum Density ◽  
High Density ◽  
Electronic Systems ◽  
Multichip Modules ◽  
Low Dielectric ◽  
Dielectric Permittivity And Loss

The development of high density interconnection (HDI) technology in multichip modules (MCM's) will establish a new level in the hierarchy of electronic systems. The modules use organic insulating layers which, because of their low dielectric permittivity and loss, enable circuits with maximum density and speed. However, differences in the coefficients of thermal expansion (CTE's) for the insulating layers, the interconnects, and the substrates, produce residual stresses in the various components during processing. These stresses must be understood to engineer reliable designs for MCM's.

Control of Thin Film Materials Properties Used in High Density Multichip Interconnect

1989 ◽  
Vol 154 ◽  
Author(s):  
J.J.H. Rechell
Keyword(s):  
Thin Film ◽  
Process Development ◽  
Chemical Properties ◽  
High Density ◽  
Internal Stresses ◽  
Multichip Modules ◽  
Materials Properties ◽  
Physico Chemical ◽  
Substrate Properties ◽  
Organic Dielectric

AbstractMost literature on High Density Multichip Interconnect (HDMI) focuses almost exclusively on processing of the organic dielectric. Nevertheless, it is only one of the components in High Density Multichip Modules.Substrate properties, metal dielectric adhesion, internal stresses in the various films, and many other physico-chemical properties of the materials, can all be affected by neighbouring layers or process parameters improperly identified. Thus, in the course of process development, the real causes of difficulties and observed phenomenas can easily be misconstrued.This paper reviews some of the relationships between the properties of the thin film metallization and their effects on the dielectric layers. It also points out to some of the difficulties that can occur when treating the dielectric and the metallic layers as separate issues.

scholarly journals Effect of acylglyceride content on the structure and function of reconstituted high density lipoprotein particles

2001 ◽  
Vol 42 (1) ◽  
pp. 79-87 ◽  
Author(s):  
Sylvie Braschi ◽  
Cynthia R. Coffill ◽  
Tracey A-M. Neville ◽  
Darren M. Hutt ◽  
Daniel L. Sparks
Keyword(s):  
High Density Lipoprotein ◽  
Density Lipoprotein ◽  
Structure And Function ◽  
High Density ◽  
Lipoprotein Particles ◽  
And Function

High-density lipoprotein delivered after myocardial infarction increases cardiac glucose uptake and function in mice

2017 ◽  
Vol 9 (411) ◽  
pp. eaam6084 ◽  
Author(s):  
Sarah E. Heywood ◽  
Adele L. Richart ◽  
Darren C. Henstridge ◽  
Karen Alt ◽  
Helen Kiriazis ◽  
...  
Keyword(s):  
Myocardial Infarction ◽  
High Density Lipoprotein ◽  
Glucose Uptake ◽  
Density Lipoprotein ◽  
High Density ◽  
And Function

Advanced Build-up Materials for High Speed Transmission Application

2018 ◽  
Vol 2018 (1) ◽  
pp. 000305-000309 ◽  
Author(s):  
Shiro Tatsumi ◽  
Shohei Fujishima ◽  
Hiroyuki Sakauchi
Keyword(s):  
High Speed ◽  
Printed Circuit Boards ◽  
Transmission Loss ◽  
Coefficient Of Thermal Expansion ◽  
Strip Line ◽  
Circuit Boards ◽  
Additive Process ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Transmission Speed

Abstract Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. Our insulation materials are used in a semi-additive process (SAP) with low dielectric loss tangent, smooth resin surface after desmear, and good insulation reliability. Actually, the transmission loss of strip line substrates and Cu surface roughness impact on transmission loss were measured using our materials. Furthermore, low dielectric molding film with low coefficient of thermal expansion (CTE) and low Young's modulus are introduced.

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