Compliant interconnects for reduced cost of a ceramic ball grid array carrier

Author(s):  
Maaike M. V. Taklo ◽  
Andreas Larsson ◽  
Astrid-Sofie B. Vardoy ◽  
Helge Kristiansen ◽  
Lars Hoff ◽  
...  
Keyword(s):  
2017 ◽  
Author(s):  
S. H. B. S. Badri ◽  
M. H. A. Aziz ◽  
N. R. Ong ◽  
Z. Sauli ◽  
J. B. Alcain ◽  
...  

1999 ◽  
Author(s):  
Stephen A. McKeown ◽  
Chittaranjan Sahay

Abstract Paper describes the effect of solder volume on solder life based on linear finite element analysis using ANSYS. The results indicate an optimal volume for the solder life. Any increase or decrease in the solder volume from the optimum volume decreases the fatigue life of solder joints. Solder joint life was also experimentally determined for the same temperature excursion with a 2-hour thermal cycle. The experimental results compare well with the results estimated by finite element modeling. Studies for one elastic-plastic analysis has also been carried out. Initial results indicate substantial increase in strain concentration factor.


2003 ◽  
Vol 43 (2) ◽  
pp. 307-318 ◽  
Author(s):  
Bart Vandevelde ◽  
Dominiek Degryse ◽  
Eric Beyne ◽  
Eric Roose ◽  
Dorina Corlatan ◽  
...  

2003 ◽  
Vol 32 (12) ◽  
pp. 1421-1425 ◽  
Author(s):  
Mukta Farooq ◽  
Charles Goldsmith ◽  
Ray Jackson ◽  
Gregory Martin

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