Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

2012 ◽  
Author(s):  
Yu-Min Lin ◽  
Chau-Jie Zhan ◽  
Kuo-Shu Kao ◽  
Chia-Wen Fan ◽  
Su-Ching Chung ◽  
...  
Keyword(s):  
Low Temperature ◽  
Solder Bump ◽  
Conductive Adhesive ◽  
Low Temperature Bonding ◽  
3D Chip Stacking

Materials, processing and reliability of low temperature bonding in 3D chip stacking

2018 ◽  
Vol 750 ◽  
pp. 980-995 ◽  
Author(s):  
Liang Zhang ◽  
Zhi-quan Liu ◽  
Sinn-Wen Chen ◽  
Yao-dong Wang ◽  
Wei-Min Long ◽  
...  
Keyword(s):  
Low Temperature ◽  
Materials Processing ◽  
Low Temperature Bonding ◽  
3D Chip Stacking

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

Ultra-low temperature curable nano-silver conductive adhesive for piezoelectric composite material

2018 ◽  
Vol 529 ◽  
pp. 9-15 ◽  
Author(s):  
Chao Yan ◽  
Qingwei Liao ◽  
Xingli Zhou ◽  
Likun Wang ◽  
Chao Zhong ◽  
...  
Keyword(s):  
Composite Material ◽  
Low Temperature ◽  
Conductive Adhesive ◽  
Piezoelectric Composite ◽  
Nano Silver
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