Electrical characterization of through silicon vias (TSVs) with an on chip bus driver for 3D IC integration

2012 ◽  
Author(s):  
S. S. Sheu ◽  
Z. H. Lin ◽  
C. S. Lin ◽  
J. H. Lau ◽  
S. H. Lee ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Bus Driver ◽  
On Chip ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

HIGH FREQUENCY ELECTRICAL CHARACTERIZATION OF 3D SIGNAL/GROUND THROUGH SILICON VIAS

2014 ◽  
Vol 47 ◽  
pp. 71-75 ◽  
Author(s):  
Steve Adamshick ◽  
Robert Carroll ◽  
Megha Rao ◽  
Douglas La Tuplie ◽  
Seth Kruger ◽  
...  
Keyword(s):  
High Frequency ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Silicon Vias

Electrical Characterization of Coaxial Silicon–Insulator–Silicon Through-Silicon Vias: Theoretical Analysis and Experiments

2016 ◽  
Vol 63 (12) ◽  
pp. 4880-4887 ◽  
Author(s):  
Zhiming Chen ◽  
Miao Xiong ◽  
Bohao Li ◽  
An'an Li ◽  
Yangyang Yan ◽  
...  
Keyword(s):  
Theoretical Analysis ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Silicon Vias
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