Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

2012 ◽  
Author(s):  
J. Roullard ◽  
A. Farcy ◽  
S. Capraro ◽  
T. Lacrevaz ◽  
C. Bermond ◽  
...  
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Interconnect Routing

High-power InAlAs/InGaAs Schottky barrier photodiodes for analog microwave signal transmission

2022 ◽  
Vol 43 (1) ◽  
pp. 012302
Author(s):  
K. S. Zhuravlev ◽  
A. L. Chizh ◽  
K. B. Mikitchuk ◽  
A. M. Gilinsky ◽  
I. B. Chistokhin ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Transmission Lines ◽  
High Power ◽  
High Speed ◽  
Signal Transmission ◽  
Mesa Structure ◽  
Microwave Characterization ◽  
Absorbing Layer ◽  
Analog Transmission

Abstract The design, manufacturing and DC and microwave characterization of high-power Schottky barrier InAlAs/InGaAs back-illuminated mesa structure photodiodes are presented. The photodiodes with 10 and 15 μm mesa diameters operate at ≥40 and 28 GHz, respectively, have the output RF power as high as 58 mW at a frequency of 20 GHz, the DC responsivity of up to 1.08 A/W depending on the absorbing layer thickness, and a photodiode dark current as low as 0.04 nA. We show that these photodiodes provide an advantage in the amplitude-to-phase conversion factor which makes them suitable for use in high-speed analog transmission lines with stringent requirements for phase noise.

Modeling and Optimization Design of Signal Interconnect Channel Considering Signal Integrity in Three Dimensional Integrated Circuits

2021 ◽  
Vol 16 (5) ◽  
pp. 773-780
Author(s):  
Bing-Jie Li ◽  
Zhen-Song Li ◽  
Yan-Ping Zhao ◽  
Zheng-Wang Li ◽  
Min Miao
Keyword(s):  
Performance Optimization ◽  
High Speed ◽  
Optimization Design ◽  
Channel Model ◽  
Transmission Loss ◽  
Coupling Effect ◽  
Signal Integrity ◽  
Signal Transmission ◽  
Equivalent Circuit Model ◽  
Transmission Performance

The signal integrity (SI) analysis of a high-speed signal interconnect channel composed of through silicon vias (TSVs) and horizontal re-distribution layers (RDL) is carried out, and the problems of SI, such as transmission loss, crosstalk and coupling effect in the transmission channel, are analyzed and studied. These signal integrity issues are considered in this paper, a signal interconnect channel model is proposed and the equivalent circuit model is deduced as well. Compared with the traditional one, this interconnect channel model has better performance in SI. Further sweep frequency analysis is carried out for different material parameters to achieve signal transmission performance optimization aimed at this model. Test samples of the proposed signal interconnect channel model are designed and fabricated according to the process index, and measured to verify the actual transmission performance. The design and optimization rule of high-speed signal interconnect channel are summarized which proved that the proposed structure has more advantages in signal transmission performance, and has important guiding significance for practical design.

PCB implementation techniques and evaluations for 10 Gbit/s high-speed signal transmission

2005 ◽  
Vol 88 (7) ◽  
pp. 39-49 ◽  
Author(s):  
Hidehiro Toyoda ◽  
Shinji Nishimura ◽  
Hisaaki Kanai ◽  
Hitoshi Kudou ◽  
Harumitsu Tanaka
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Implementation Techniques

scholarly journals Core-Shell Sr2CeO4@SiO2 Filled COC‑Based Composites with Low Dielectric Loss for High-Frequency Substrates

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4006
Author(s):  
Qinlong Wang ◽  
Hao Wang ◽  
Caixia Zhang ◽  
Qilong Zhang ◽  
Hui Yang
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Frequency ◽  
High Speed ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Signal Transmission ◽  
Sol Gel ◽  
Normal Operation ◽  
Core Shell

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/℃. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 001057-001067
Author(s):  
Darryl Kostka ◽  
Antonio Ciccomancini Scogna
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Form Factors ◽  
Point Of View ◽  
Electromagnetic Modeling ◽  
Electromagnetic Simulations ◽  
Full Wave ◽  
3D Ics ◽  
Silicon Vias ◽  
Delivery Networks

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view. The goal of this paper is to electrically model TSVs and 3D interposers by means of three 3D full wave electromagnetic simulations. A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented.

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