Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
Keyword(s):
1999 ◽
Vol 119
(12)
◽
pp. 1554-1555
2012 ◽
Vol E95.C
(12)
◽
pp. 1864-1871
◽
Keyword(s):
1991 ◽
Vol 1991
(170)
◽
pp. 483-491
◽