Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

2011 ◽  
Author(s):  
Kyoung-Lim Suk ◽  
Chang-Kyu Chung ◽  
Kyung-Wook Paik
Keyword(s):  
Conductive Adhesives ◽  
Fine Pitch ◽  
Chip On Film

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

2012 ◽  
Vol 52 (6) ◽  
pp. 1182-1188 ◽  
Author(s):  
Kyoung-Lim Suk ◽  
Kyosung Choo ◽  
Sung Jin Kim ◽  
Jong-Soo Kim ◽  
Kyung-Wook Paik
Keyword(s):  
Metal Layer ◽  
Printed Circuits ◽  
Fine Pitch ◽  
Chip On Film

Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

2011 ◽  
Vol 51 (4) ◽  
pp. 851-859 ◽  
Author(s):  
Byeung-Gee Kim ◽  
Sang-Mok Lee ◽  
Yun-Song Jo ◽  
Sun-Chul Kim ◽  
Kyoung-Moo Harr ◽  
...  
Keyword(s):  
Conductive Adhesives ◽  
Fine Pitch

Characterization of nano-enhanced interconnect materials for fine pitch assembly

2014 ◽  
Vol 26 (1) ◽  
pp. 12-17 ◽  
Author(s):  
Yan Zhang ◽  
Janusz Sitek ◽  
Jing-yu Fan ◽  
Shiwei Ma ◽  
Marek Koscielski ◽  
...  
Keyword(s):  
Filler Content ◽  
Nano Particles ◽  
Differential Scanning Calorimetry Measurement ◽  
Conductive Adhesives ◽  
Scanning Calorimetry ◽  
Loading Test ◽  
Content Type ◽  
Fine Pitch ◽  
Silver Flakes ◽  
Silver Spheres

Purpose – Multiple fillers are adopted to study the filler influences on electrical and mechanical properties of the conductive adhesives. The performances of the developed nano-enhanced interconnect materials in printing process are also evaluated. The paper aims to discuss these issues. Design/methodology/approach – Micron-sized silver flakes are used as the basic fillers, and submicro- and nano-sized silver spheres and carbon nanotubes (CNTs) are adopted to obtain conductive adhesives with multiple fillers. Differential scanning calorimetry measurement is carried out to characterize the curing behavior of the samples with different fillers, four-probe method is used to obtain the bulk resistivity, shear test is conducted for adhesive strength, and environmental loading test is also involved. Furthermore, printing trials with different patterns have been carried out. Findings – The electrical resistivity of the adhesives with submicro-sized silver spheres does not monotonically change with the increasing sphere proportion, and there exists an optimized value for the ratio of silver flakes to spheres. Samples with relatively small amount of CNT additives show improved electrical properties, while their mechanical strengths tend to decrease. For the printing application, the adhesives with 18.3 volume% filler content behave much better than those with lower filler content of 6 percent. The presence of the nano-particles makes a slight improvement in the printing results. Research limitations/implications – More detailed printing performance and reliability test of the samples need to be carried out in the future. Originality/value – The conductive adhesives as interconnect materials exhibit some improved properties with optimized bimodal or trimodal fillers. The additive of the nano-fillers affects slightly on the printing quality of the bimodal conductive adhesives.

Nano-scale Conductive Films for High Performance Fine Pitch Interconnect

2007 ◽  
Vol 990 ◽  
Author(s):  
Yi Li ◽  
Myung Jin Yim ◽  
Kyung Sik Moon ◽  
ChingPing Wong
Keyword(s):  
High Performance ◽  
Electrical Conductance ◽  
Conductive Adhesives ◽  
Bonding Pressure ◽  
Nano Scale ◽  
Fine Pitch ◽  
Conductive Film ◽  
Joint Resistance ◽  
Conductive Fillers ◽  
Free Solder

ABSTRACTIn this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 100 nm) capability (NCF-like). Unlike typical ACF which requires 1–5 vol% of conductive fillers, the novel nano-scale conductive film only needs less than 0.1 vol% conductive fillers to achieve good electrical conductance in the z direction. The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film could be as low as 10−5 Ohm, even lower than the NCF and lead-free solder joints. The reliability of the nano-scale conductive film after high temperature and humidity test (85°C/85%RH) was also improved compared to the NCF joints. As such, a high performance, fine pitch conductive film was developed.

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