Reliability enhancement of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs)

2009 ◽  
Author(s):  
Sangyong Lee ◽  
Jong Min Jang ◽  
Woong Sun Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Embedded Capacitors ◽  
Printed Circuit ◽  
Embedded Capacitor ◽  
Reliability Enhancement

Assessment of stability and reliability of embedded components in printed circuit boards

Circuit World ◽  
2017 ◽  
Vol 43 (1) ◽  
pp. 19-26 ◽  
Author(s):  
Wojciech Steplewski ◽  
Andrzej Dziedzic ◽  
Janusz Borecki ◽  
Tomasz Serzysko
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Environmental Conditions ◽  
Printed Circuit Boards ◽  
Thermal Exposure ◽  
Circuit Boards ◽  
Content Type ◽  
Embedded Capacitors ◽  
Printed Circuit ◽  
Thin Film Resistors

Purpose The purpose of this paper is to investigate the basic functional parameters of passive embedded components in printed circuit boards (PCBs) under environmental exposures such as thermal-humidity and thermal exposure. Design/methodology/approach The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon–silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. The capacitors and thin- and thick-film resistors were tested in the climatic chamber in conditions of thermal-humidity exposure at 85°C and 85 per cent RH for 500 h. The embedded inductors were tested in two different environmental conditions: thermal-humidity exposure at 60°C and 95 per cent RH, and thermal exposure at 150°C and additionally at the temperature in the range of +25°C to +150°C. Findings Studies show that in the case of embedded capacitors, the changes caused by exposure to thermal-humidity are durable and lead to the capacity increase. The embedded thin-film resistors behave in the same manner, whereas the thick-film resistors were the least resistant to the conditions of exposure. Most of the polymer thick-film resistors have been damaged. The changes of coils' properties during aging are small, and what is most important is that, after some time of exposure, their parameters stabilize at a particular level. The changes resulting from the increase in temperature are typically related to the change of material resistance (Cu) of which coils are made, and as such, they cannot be avoided but they can be predicted. Research limitations/implications The realized studies allowed determination of the properties of the embedded passive elements with respect to specific environmental exposures. The studies show that embedded resistors can be used interchangeably with chip passive elements. It allows saving the area on the surface of PCB, occupied by these passive elements, for assembly of active elements integrated circuits (ICs) and thus enabling the miniaturization of electronic devices. Originality/value The knowledge about the behavior of the operating parameters of embedded components, considering the environmental conditions, allows for development of more complex systems with integrated PCBs.

Reactance components embedded in printed circuit boards

Circuit World ◽  
2015 ◽  
Vol 41 (3) ◽  
pp. 125-132 ◽  
Author(s):  
Wojciech Stęplewski ◽  
Andrzej Dziedzic ◽  
Adam Kłossowicz ◽  
Paweł Winiarski ◽  
Janusz Borecki ◽  
...  
Keyword(s):  
Loss Tangent ◽  
Radio Frequency Identification ◽  
Printed Circuit Boards ◽  
Elevated Temperatures ◽  
Magnetic Core ◽  
Circuit Boards ◽  
Magnetic Composites ◽  
Content Type ◽  
Embedded Capacitors ◽  
Printed Circuit

Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance. Findings – Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined. Originality/value – The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).

Thermal stability analysis of passive components embedded into printed circuit boards

Circuit World ◽  
2018 ◽  
Vol 44 (1) ◽  
pp. 29-36
Author(s):  
Wojciech Stęplewski ◽  
Andrzej Dziedzic ◽  
Kamil Janeczek ◽  
Aneta Araźna ◽  
Krzysztof Lipiec ◽  
...  
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Content Type ◽  
Temperature Changes ◽  
Embedded Capacitors ◽  
Printed Circuit ◽  
Embedded Passives ◽  
Thin Film Resistors

Purpose The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic properties of embedded passives was analyzed. The main reason for these investigations was to determine functionality of passives for space application. Design/methodology/approach The investigations were based on the thin-film resistors made of Ni-P alloy, thick-film resistors made of carbon or carbon-silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. Prepared samples were examined under the influence of a constant elevated temperature (100, 130 or 160°C) in a long period of time (minimum of 30 h), thermal cycles (from −40 to +85°C) or thermal shocks (from −40 to +105°C or from −40 to +125°C). Findings The achieved results revealed that resistance drift became bigger when the samples were treated at a higher constant temperature. At the same time, no significant difference in change in electrical properties for 50 and 100 Ω resistors was noticed. For all the tests, resistance change was below 2 per cent regardless of a value of the tested resistors. Conducted thermal shock studies indicate that thin-film resistors, coils and some thick-film resistors are characterized by minor variations in basic parameters. Some of the inks may show considerable resistance variations with temperature changes. Significant changes were also exhibited by embedded capacitors. Originality/value The knowledge about the behavior of the operating parameters of embedded components considering environmental conditions allow for development of more complex systems with integrated printed circuit boards.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit
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