Characterization of Intermetallic Compound Formation and Copper Diffusion of Copper Wire Bonding

2006 ◽  
Author(s):  
Shawn Zhang ◽  
C. Chen ◽  
R. Lee ◽  
A.K.M. Lau ◽  
P.P.H. Tsang ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Copper Wire ◽  
Wire Bonding ◽  
Compound Formation ◽  
Copper Diffusion ◽  
Intermetallic Compound Formation ◽  
Copper Wire Bonding

Investigation on copper diffusion depth in copper wire bonding

2011 ◽  
Vol 51 (1) ◽  
pp. 166-170 ◽  
Author(s):  
Catherine H. Chen ◽  
Shawn X. Zhang ◽  
S.W. Ricky Lee ◽  
Lebbai Mohamed
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Copper Diffusion ◽  
Copper Wire Bonding ◽  
Diffusion Depth

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation
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