Intermetallic Compound Formation in Au/Al Thermosonic Wire Bonding During High Temperature Annealing at 150 �C as a Function of Wire Material

2006 ◽  
Author(s):  
R. Klengel ◽  
H. Knoll ◽  
M. Petzold ◽  
M. Wohnig ◽  
Lutz Schrapler
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Wire Bonding ◽  
High Temperature Annealing ◽  
Compound Formation ◽  
Wire Material ◽  
Intermetallic Compound Formation ◽  
Thermosonic Wire Bonding

Features of Regularities of Ni3Al Intermetallic Compound High-Temperature Synthesis in a Powder Mixture (3Ni + Al) under Pressure

2018 ◽  
Vol 938 ◽  
pp. 41-45
Author(s):  
K.O. Akimov ◽  
E.N. Boyangin ◽  
Vladimir E. Ovcharenko
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Powder Mixture ◽  
Exothermic Reaction ◽  
Strength Properties ◽  
Grain Structure ◽  
Temperature Synthesis ◽  
Compound Formation ◽  
High Temperature Synthesis ◽  
Intermetallic Compound Formation

The results of investigation of the time and power parameters influence of high-temperature synthesis under pressure on the grain structure formation and strength properties of the Ni3Al intermetallic compound are presented and discussed. Dependences of the grain size in the intermetallic compound synthesized under pressure and its strength properties on the value of the preload on the initial powder mixture (3Ni + Al) and on the delay time of pressure application to the thermoreacting system were determined from the time of initiation of intermetallic compound formation volumetric exothermic reaction.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation

Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition

1998 ◽  
Vol 13 (1) ◽  
pp. 37-44 ◽  
Author(s):  
C. Y. Liu ◽  
K. N. Tu
Keyword(s):  
Free Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Driving Force ◽  
Alloy Composition ◽  
Wetting Angle ◽  
Compound Formation ◽  
Side Band ◽  
Intermetallic Compound Formation ◽  
Pure Sn

We have investigated the wetting angle, side band growth, and intermetallic compound formation of seven SnPb alloys on Cu ranging from pure Sn to pure Pb. The wetting angle has a minimum near the middle composition and increases toward pure Sn and pure Pb, but the side band growth has a maximum near the middle composition. The intermetallic compounds formed are Cu6Sn5 and Cu3Sn for the eutectic and high-Sn alloys, yet for the high-Pb alloys, only Cu3Sn can be detected. While no intermetallic compound forms between Cu and pure Pb, the latter nevertheless wets the former with an angle of 115°. The driving force of a wetting reaction, which may be affected by the free energy gain in compound formation, is discussed by assuming that rate of compound formation is fast.

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