scholarly journals Properties and Microstructures of Sn-Bi-X Lead-Free Solders

2016 ◽  
Vol 2016 ◽  
pp. 1-15 ◽  
Author(s):  
Fan Yang ◽  
Liang Zhang ◽  
Zhi-quan Liu ◽  
Su-juan Zhong ◽  
Jia Ma ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Rare Earth ◽  
Intermetallic Compounds ◽  
Melting Temperature ◽  
Fatigue Resistance ◽  
Low Cost ◽  
Eutectic Point ◽  
Lead Free ◽  
Melting Characteristic ◽  
Lead Free Solders

The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

2010 ◽  
Vol 654-656 ◽  
pp. 2450-2454 ◽  
Author(s):  
De Kui Mu ◽  
Hideaki Tsukamoto ◽  
Han Huang ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Nickel Content ◽  
Lead Free ◽  
Lead Free Solder ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

scholarly journals Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly

2019 ◽  
Vol 16 (1) ◽  
pp. 79-94
Author(s):  
Rizk Mostafa Shalaby ◽  
Fatma Elzahraa Ibrahim ◽  
Mostafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Rare Earth ◽  
Earth Element ◽  
Low Cost ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal And Mechanical Properties ◽  
Electronic Assembly ◽  
Free Solder

This work methodically concentrated on the effect of a trace amount of rare earth element terbium, Tb (0.1, 0.2, 0.3, 0.4 and 0.5 wt. %) on the properties of eutectic Sn-3.5 wt. %Ag were studied. The results indicated that addition of Tb rare earth can be refined the microstructure of the solder and intermetallic compound (IMC) Ag3Sn phase appeared in the solder matrix. Add a few quantity of rare earth Tb enhances the hardness and strength of eutectic Sn-Ag lead free solder joint. Also, results indicate that adding Tb to the eutectic Sn-3.5Ag remarkably enhances solderability, reliability, thermal and mechanical properties. It is also found that increasing in mechanical strength can depend on crystalline size refining in addition to some regular precipitates from IMC, Ag3Sn.

The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders

2013 ◽  
Vol 800 ◽  
pp. 265-270 ◽  
Author(s):  
Kang I Chen ◽  
Shou Chang Cheng ◽  
Chin Hsiang Cheng
Keyword(s):  
Mechanical Properties ◽  
Tensile Properties ◽  
Melting Temperature ◽  
Eutectic Structure ◽  
Lead Free ◽  
Microstructures And Mechanical Properties ◽  
Lead Free Solders

The melting temperature, microstructures, and mechanical properties of the Sn-Zn-0.5Ag-0.5Ga, Sn-Zn-0.5Ag-0.45Al and Sn-Zn-0.5Ga-0.45Al lead-free solders were investigated. The results indicate that the addition of 0.5 wt% Ag to the Sn-Zn based alloys destroy the eutectic structure and results in the formation of Ag-Zn compound and hypoeutectic structure. The variation in the microstructure lowers the UTS. By the addition of Al the UTS and elongation of the 0.5Ag-0.45Al alloy can be decreased due to the Al diffused to the interface of the Ag-Zn compound/Sn-Zn eutectic structure to form Al-Zn compound. The 0.5Ga-0.45Al alloy shows a typical eutectic structure with the light contract β-Sn and the darker needle-like phase, as well as a small amount of Al-Zn phase with a near diamond shape. Gallium uniformly distributes in the Sn matrix and Zn rich phases. The 0.5Ga-0.45Al solder had the highest UTS and elongation, while 0.5Ag-0.45Al had the lowest UTS and elongation. The results indicate that Ga and Al exhibits prominent influence on the microstructure as well as the mechanical properties of the solders.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

2008 ◽  
Vol 18 (4) ◽  
pp. 814-818 ◽  
Author(s):  
Zong-jie HAN ◽  
Song-bai XUE ◽  
Jian-xin WANG ◽  
Xin ZHANG ◽  
Liang ZHANG ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Diode Laser ◽  
Lead Free ◽  
Soldering Technology ◽  
Laser Soldering ◽  
Lead Free Solders

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Microstructures and mechanical properties of Sn–8.55Zn–0.45Al–XAg solders

2003 ◽  
Vol 18 (7) ◽  
pp. 1528-1534 ◽  
Author(s):  
Chia-Wei Huang ◽  
Kwang-Lung Lin
Keyword(s):  
Mechanical Properties ◽  
Thermal Analysis ◽  
Tensile Strength ◽  
Melting Point ◽  
Eutectic Temperature ◽  
Lead Free ◽  
Eutectic Solder ◽  
Microstructures And Mechanical Properties ◽  
Lead Free Solders

The microstructure, melting point, and mechanical properties of Sn–8.55Zn–0.45Al–XAg lead-free solders were investigated. The Ag content of the solders investigated was 0–3 wt.%. The results indicate that the AgZn3 and Ag5Zn8 compounds are formed at the addition of Ag to Sn–8.55Zn–0.45Al solders. The adding of Ag also results in the formation of hypoeutectic structure, increasing the melting point of the solders and decreasing the ductility. Results of thermal analysis reveal that the Sn–8.55Zn–0.45Al–XAg solder has eutectic temperature at 198 °C when the addition of Ag is 0.5 wt.%. The eutectic solder exhibits greater tensile strength and higher ductility than the 63–Sn–37Pb solder.

scholarly journals Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

2015 ◽  
Vol 60 (2) ◽  
pp. 1511-1515 ◽  
Author(s):  
E. Nagy ◽  
F. Kristaly ◽  
A. Gyenes ◽  
Z. Gacsi
Keyword(s):  
Intermetallic Compounds ◽  
Diffraction Method ◽  
Lead Free ◽  
Structural Behaviour ◽  
Cu Content ◽  
Soldering Process ◽  
Cu Alloys ◽  
Complex Structural ◽  
Interfacial Intermetallic Compounds ◽  
Lead Free Solders

Abstract Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint. In the soldering process of Sn-Cu alloys, Cu6Sn5 intermetallic compounds are formed. The complex structural behaviour of Cu6Sn5 IMC is temperature- and composition-dependent and it is long since subject to scientific research. The Cu6Sn5 phase basically exists in two crystal structures: hexagonal η-Cu6Sn5 (at temperatures above 186°C) and monoclinic η’-Cu6Sn5 (at lower temperatures). In the presence of Ni in the solder, the η-η’ transformation does not occur, therefore, the η-Cu6Sn5 phase remains stable. In this study the role of Ni in the (Cu,Ni)6Sn5 intermetallic compound in Sn-Cu lead-free solders was examined. Sn-Cu alloys with different Cu content (0.5 to 1 mass%) were modified through Ni addition. The morphology of the intermetallic compounds of the modified Sn-Cu alloys was investigated by optical microscopy (OM) and scanning electron microscopy (SEM), the IMC phases were examined with X-ray diffraction method (XRD).

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