Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves

2004 ◽  
Author(s):  
J.C.C. Lo ◽  
S.W.R. Lee ◽  
S.H.K. Lee ◽  
J.S. Wu ◽  
M.M.F. Yuen
Keyword(s):  
Optical Fibers ◽  
Low Viscosity ◽  
Passive Alignment

Passive Alignment of Optical Fiber in a V-Groove With Low Viscosity Epoxy Flow

2003 ◽  
Author(s):  
Jeffery C. C. Lo ◽  
C. S. Yung ◽  
S. W. Ricky Lee ◽  
Steve H. K. Lee ◽  
J. S. Wu ◽  
...  
Keyword(s):  
Optical Fiber ◽  
Optical Fibers ◽  
Processing Time ◽  
Cover Plate ◽  
Manufacturing Cost ◽  
Optoelectronic Packaging ◽  
Low Viscosity ◽  
Epoxy Dispensing ◽  
A New Technique ◽  
Passive Alignment

The alignment of optical fibers is very critical in optoelectronic packaging. A slight offset in any direction may severely affect the performance of the photonic device. Recently, passive alignment of optical fibers has attracted substantial attention due to its lower manufacturing cost and faster processing time when compared with active alignment. For conventional passive alignment, the position of each optical fiber is defined by the geometry of a V-groove. The epoxy is dispensed from the top of the V-groove and another cover plate is usually required to press the fiber against the walls of the V-groove. In the present study, a new technique for epoxy dispensing is developed. Instead of being applied from the top of the V-groove, some low viscosity epoxy is dispensed in a “canal” first. The epoxy fills an adjacent “reservoir” and then flows into the V-groove. Subsequently the epoxy flow runs through the gap between the optical fiber and the V-groove walls. It is observed that the flow of epoxy can align the optical fiber by the surface tension. Once the optical fiber is aligned and the epoxy is cured, more epoxy is applied in a glob-top manner to mechanical enhancement. In this paper, the configuration of the V-groove and associated features, the epoxy dispensing process, and the results of alignment are presented in details.

UV Laser Bonding of Optical Devices on Polymers

2008 ◽  
Vol 580-582 ◽  
pp. 459-462 ◽  
Author(s):  
Joo Han Kim ◽  
Hyang Tae Kim ◽  
Chul Ku Lee
Keyword(s):  
Optical Fibers ◽  
Uv Light ◽  
Uv Curing ◽  
Spot Size ◽  
High Viscosity ◽  
Optical Devices ◽  
Optical Systems ◽  
Bonding Layer ◽  
Low Viscosity ◽  
Laser Bonding

UV curing adhesives have been introduced for bonding various materials at a room temperature. It has the advantage of putting minimum thermal load on the system; however, it is not suitable for precision bonding of micro systems such as micro optical devices because of its high viscosity and poor control of the UV light source. In the present work, a laser-curing bonding process of micro optical devices with a low-viscosity UV polymer adhesive has been developed. A focused Nd:YVO4 laser beam with a spot size of 30 µm with a laser power of 100 ~ 700 mW is used for curing a UV adhesive locally. A thin bonding layer with a thickness of a few hundred nanometers without any thermal effects can be obtained for precision laser bonding for optical fibers. Experimental results are provided and the process characteristics have been discussed. Moreover, potential applications in the field of micro optical systems are introduced as well.

A Novel Injection-Molded Precision Plastic Platform for the Passive Alignment of a Polymer Waveguide Film and Optical Fibers

1998 ◽  
Vol 37 (Part 1, No. 6B) ◽  
pp. 3727-3729 ◽  
Author(s):  
Yasuaki Tamura ◽  
Makoto Hikita ◽  
Yoshito Shuto ◽  
Michiyuki Amano ◽  
Satoru Tomaru ◽  
...  
Keyword(s):  
Optical Fibers ◽  
Polymer Waveguide ◽  
Injection Molded ◽  
Passive Alignment

Through-etched silicon carriers for passive alignment of optical fibers to surface-active optoelectronic components

2000 ◽  
Vol 82 (1-3) ◽  
pp. 245-248 ◽  
Author(s):  
Johan Holm ◽  
Henrik Åhlfeldt ◽  
Magnus Svensson ◽  
Christian Vieider
Keyword(s):  
Optical Fibers ◽  
Etched Silicon ◽  
Surface Active ◽  
Passive Alignment

Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes

2003 ◽  
Author(s):  
H. De Pauw ◽  
J. De Baets ◽  
J. Vanfleteren ◽  
A. Van Calster
Keyword(s):  
High Precision ◽  
Optical Fibers ◽  
Data Transmission ◽  
Wet Etching ◽  
Minimal Distance ◽  
Optical Interconnections ◽  
Rf Amplifier ◽  
Passive Alignment ◽  
Transmission Speed ◽  
Low Refractive Index

An ongoing trend in packaging technology is the introduction of optical interconnections to cope with the problems of increased data transmission speed and the raised interconnection density. Hence, improving packaging and interconnection technologies is only viable if the aspects of optical interfaces and opto-electronic (O/E) components are considered. In this paper, we will demonstrate an MCM-D technology with O/E features. We achieved to integrate high-precision V-grooves for alignment and fixation of the optical fibers into a standard MCM-D technology. The V-groove shape of the fiber fixation structures is a result of the anisotropic etching of (100) silicon by means aqueous KOH. The technology aspects of this aggressive wet etching step are discussed as well as the optimisation results of a suitable KOH masking layer: a low refractive index PECVD nitride. The extension of an MCM-D technology with V-grooves generates the possibility to integrate side-emitting O/E components and fibers with the electronics on the same MCM-Si motherboard. This implies a more dense and compact motherboard with the potential of obtaining higher bandwidths due to the minimal distance between optics and electronics. Additionally, low coupling losses between O/E components and fibers are obtained by means of passive alignment as the accuracy of the V-grooves in silicon allow us to place the fibers with high precision. The feasibility of this optics-extended MCM-D technology will be shown in the example of O/E measurement probes. In the fabrication process of such O/E measurement probes, we will focus on the multilayer MCM-D motherboard extended with V-grooves, on the FC mounting of both RF-amplifier chip and laserdiode, and on the alignment of the fiber.

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