Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages

2004 ◽  
Author(s):  
H.Y. Zhang ◽  
D. Pinjala ◽  
Y.K. Joshi ◽  
T.N. Wong ◽  
K.C. Toh
Keyword(s):  
Flip Chip ◽  
Thermal Modeling ◽  
Ball Grid Array ◽  
Heat Sinks ◽  
Ball Grid Array Packages

scholarly journals Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls

2021 ◽  
Vol 18 (4) ◽  
pp. 183-189
Author(s):  
Vishnu V. B. Reddy ◽  
Jaimal Williamson ◽  
Suresh K. Sitaraman
Keyword(s):  
Flip Chip ◽  
Ultrasonic Inspection ◽  
Reference Sample ◽  
Ball Grid Array ◽  
Inspection System ◽  
Laser Ultrasonic ◽  
Fiber Array ◽  
Measurement Capability ◽  
Repeatability And Reproducibility ◽  
Ball Grid Array Packages

Abstract Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test.

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
S. B. Park ◽  
Rahul Joshi ◽  
Izhar Ahmed ◽  
Soonwan Chung
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Thermal Loading ◽  
Ball Grid Array ◽  
Element Analysis ◽  
Severe Condition ◽  
Experimental Stress Analysis ◽  
Computational Fluid Dynamics Analysis ◽  
Accelerated Thermal Cycling ◽  
Ball Grid Array Packages

Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always.

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