Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates

2002 ◽  
Author(s):  
Hilyung-Jin Yim ◽  
Kyung-Wook Paik
Keyword(s):  
Flip Chip ◽  
Organic Substrates ◽  
Conductive Adhesives ◽  
Conducting Filler

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

2005 ◽  
Vol 127 (2) ◽  
pp. 86-90 ◽  
Author(s):  
Woon-Seong Kwon ◽  
Myung-Jin Yim ◽  
Kyung-Wook Paik ◽  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Thermal Cycling ◽  
Thermal Deformation ◽  
Flip Chip ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Acoustic Microscopy ◽  
Moire Interferometry ◽  
Organic Substrates ◽  
Conductive Adhesives ◽  
Reliability Performance

One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy investigation was performed for tested assemblies. To elucidate the effects of ACF material properties and DNP on the thermal cycling reliability of ACF assembly, Weibull analysis for the lifetime estimation of ACF joint was performed, and compared with thermal deformations of ACF flip chip assembly investigated by moire´ interferometry. Results indicate that the properties of ACF have a significant role in the thermal deformation and reliability performance during thermal cycling testing. Therefore, optimized ACF properties can enhance ACF package reliability during thermal cycling regime.

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

1999 ◽  
Vol 2 (3) ◽  
pp. 263-269 ◽  
Author(s):  
F.G Shi ◽  
Mikrajuddin Abdullah ◽  
S Chungpaiboonpatana ◽  
K Okuyama ◽  
C Davidson ◽  
...  
Keyword(s):  
Size Distribution ◽  
Electrical Conduction ◽  
Conductive Adhesives ◽  
Conducting Filler ◽  
Filler Particles

Low Stress Under Bump Metallizations for Direct Chip Attach

1998 ◽  
Vol 555 ◽  
Author(s):  
P. Su ◽  
T. M. Korhonen ◽  
S. J. Hong ◽  
M. A. Korhonen ◽  
C. Y. Li
Keyword(s):  
Flip Chip ◽  
Semiconductor Industry ◽  
Organic Substrate ◽  
Organic Substrates ◽  
Under Bump Metallization ◽  
Interfacial Failure ◽  
Stress Measurements ◽  
Rapid Reaction

AbstractIn order to use a flip chip method for bonding the Si chip directly to an organic substrate, compatible under bump metallization (UBM) must be available. Conventional schemes with a copper-based solderable layer are not well compatible with the high-tin solders (such as eutectic Pb-Sn) used with organic substrates. This is due to the rapid reaction between Sn and Cu which depletes the UBM of copper. Ni-based schemes exhibit slower reaction with the solder and have been identified by the semiconductor industry as preferable replacements to Cu-based UBM's. However, Ni-containing metallurgies are often associated with high stresses, which results in poor practical adhesion between the silicon chip and the metallization, leading to interfacial failure during fabrication or service. In this research, several nickel-containing UBM schemes are studied experimentally. Stress measurements are made for each metallization before patterning of UBM pads. An optimal Ni concentration for the UBM is suggested based on the results from this study.

Advanced Microelectronics Packaging Solutions for Miniaturized Medical Devices

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001963-001976
Author(s):  
Rabindra Das ◽  
Steven Rosser ◽  
Frank Egitto
Keyword(s):  
Flip Chip ◽  
New Technologies ◽  
High Reliability ◽  
Present Report ◽  
Flexible Substrate ◽  
System Level ◽  
Organic Substrates ◽  
Internal Layers ◽  
Microelectronics Packaging ◽  
Wide Range

The wide range of applications for medical electronics drives unique requirements that can differ significantly from commercial & military electronics. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller die pad pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present report, key enablers for achieving reduction in size, weight, and power (SWaP) in electronic packaging for a variety of medical applications are discussed. Advanced microelectronics packaging solutions with embedded passives are enabling SWaP reductions. Implementation of these solutions has realized up to 27X reduction in physical size for existing PWB assemblies, with significant reductions in weight. Shorter interconnects can also reduce or eliminate the need for termination resistors for some net topologies. Successful miniaturized products integrate the following design techniques and technologies: component footprint reduction, thin high density interconnects substrate technologies, I/O miniaturization and IC assembly capabilities. This paper presents fabrication and electrical characterization of embedded actives and passives on organic multilayered substrates. We have designed and fabricated several printed wiring board (PWB) and flip-chip package test vehicles focusing on embedded chips, resistors, and capacitors. Embedded passive technology further enhances miniaturization by enabling components to be moved from the surface of the substrate to its internal layers. The use of thin film resistor material allows creating individual miniaturized buried resistors. These resistors provide additional length and width reduction with negligible increases to the overall substrate and module (SiP) height. Resistor values can vary from 5 ohm to 50 Kohm with tolerances from 5 to 20% and areas as small as 0.2 mm2. The embedded resistors can be laser trimmed to a tolerance of <5% for applications that require tighter tolerance. The electrical properties of embedded capacitors fabricated from polymer-ceramic nanocomposites showed a stable capacitance and low loss over a wide frequency and temperature range. A few test vehicles were assembled to do system level analysis. Manufacturing methods and materials for producing advanced organic substrates and flex along with ultra fine pitch assemblies are discussed. A case study detailing the fabrication of a flexible substrate for use in an intravascular ultrasound (IVUS) catheter demonstrates how the challenges of miniaturization are met. These challenges include use of ultra-thin polymer films, extreme fine-feature circuitization, and assembly processes to accommodate die having reduced die pad pitch. In addition, new technologies for embedding a variety of active chips are being developed. A variety of active chips, including a chip having dimensions of one millimeter square, have been embedded and electrically connected to develop high performance packages.

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