Advanced Microelectronics Packaging Solutions for Miniaturized Medical Devices

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001963-001976
Author(s):  
Rabindra Das ◽  
Steven Rosser ◽  
Frank Egitto
Keyword(s):  
Flip Chip ◽  
New Technologies ◽  
High Reliability ◽  
Present Report ◽  
Flexible Substrate ◽  
System Level ◽  
Organic Substrates ◽  
Internal Layers ◽  
Microelectronics Packaging ◽  
Wide Range

The wide range of applications for medical electronics drives unique requirements that can differ significantly from commercial & military electronics. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller die pad pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present report, key enablers for achieving reduction in size, weight, and power (SWaP) in electronic packaging for a variety of medical applications are discussed. Advanced microelectronics packaging solutions with embedded passives are enabling SWaP reductions. Implementation of these solutions has realized up to 27X reduction in physical size for existing PWB assemblies, with significant reductions in weight. Shorter interconnects can also reduce or eliminate the need for termination resistors for some net topologies. Successful miniaturized products integrate the following design techniques and technologies: component footprint reduction, thin high density interconnects substrate technologies, I/O miniaturization and IC assembly capabilities. This paper presents fabrication and electrical characterization of embedded actives and passives on organic multilayered substrates. We have designed and fabricated several printed wiring board (PWB) and flip-chip package test vehicles focusing on embedded chips, resistors, and capacitors. Embedded passive technology further enhances miniaturization by enabling components to be moved from the surface of the substrate to its internal layers. The use of thin film resistor material allows creating individual miniaturized buried resistors. These resistors provide additional length and width reduction with negligible increases to the overall substrate and module (SiP) height. Resistor values can vary from 5 ohm to 50 Kohm with tolerances from 5 to 20% and areas as small as 0.2 mm2. The embedded resistors can be laser trimmed to a tolerance of <5% for applications that require tighter tolerance. The electrical properties of embedded capacitors fabricated from polymer-ceramic nanocomposites showed a stable capacitance and low loss over a wide frequency and temperature range. A few test vehicles were assembled to do system level analysis. Manufacturing methods and materials for producing advanced organic substrates and flex along with ultra fine pitch assemblies are discussed. A case study detailing the fabrication of a flexible substrate for use in an intravascular ultrasound (IVUS) catheter demonstrates how the challenges of miniaturization are met. These challenges include use of ultra-thin polymer films, extreme fine-feature circuitization, and assembly processes to accommodate die having reduced die pad pitch. In addition, new technologies for embedding a variety of active chips are being developed. A variety of active chips, including a chip having dimensions of one millimeter square, have been embedded and electrically connected to develop high performance packages.

Miniaturization of Electronic Substrates for Medical Device Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 000186-000191 ◽  
Author(s):  
Frank D. Egitto ◽  
Rabindra N. Das ◽  
Glen E. Thomas ◽  
Susan Bagen
Keyword(s):  
High Speed ◽  
High Reliability ◽  
Present Report ◽  
Flexible Substrate ◽  
Organic Substrates ◽  
Active Devices ◽  
Fine Pitch ◽  
Speed Performance ◽  
Device Applications

The medical industry is clearly and urgently in need of development of advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for handheld, portable, in vivo, and implantable devices. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller die pad pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present report, key enablers for achieving reduction in size, weight, and power (SWaP) in electronic packaging for a variety of medical applications are discussed. These enablers include materials selection, embedded passives and active devices, System-in-Package (SiP) designs, and flex circuits. Manufacturing methods and materials for producing advanced organic substrates and flex along with ultra fine pitch assemblies are discussed. A case study detailing the fabrication of a flexible substrate for use in an intravascular ultrasound (IVUS) catheter demonstrates how the challenges of miniaturization are met. These challenges include use of ultra-thin polymer films, extreme fine-feature circuitization, and assembly processes to accommodate die having reduced die pad pitch.

Development of Lead Free Plating Chemical for Various Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000944-000967
Author(s):  
Takeshi Hatta ◽  
Atsushi Ishikawa ◽  
Takuma Katase ◽  
Akihiro Masuda
Keyword(s):  
Chemical Stability ◽  
High Speed ◽  
Flip Chip ◽  
New Technologies ◽  
High Reliability ◽  
Lead Free ◽  
Current Status ◽  
Chip Technology ◽  
Solder Bumps ◽  
Pure Sn

Flip chip connection has been applied to a lot of applications to shorten the connection length for high performance. Solder bumping is one of the key technologies for flip chip connection, and its quality strongly brings large impact on the reliability after packaging. Electroplating is one of the methods to form solder bumps. And Sn-Ag is considered as the first candidate of lead free alloy for electroplating method. We have released Sn-Ag plating chemical and it has been used by many customers in the world. In the future, flip chip technology will progress to further miniaturization and high integration with the new technologies such as Cu pillar and Through Silicon Via (TSV). At that time, further variations of alloys are necessary for electroplating method to meet various requirements. Even for Sn-Ag plating chemical, higher plating rate is required to improve productivity in mass production. In this time, we have developed new Sn-Ag high speed plating chemical based on our conventional technology. Furthermore, we have succeeded to develop Pure Sn and Sn-Cu chemicals for bumping method to meet customer's requirement. Sn-Cu is considered as a good candidate for bumping alloy to achieve high reliability, but the chemical stability is not so good. Therefore, we successfully modified the Sn-Cu chemical and extended chemical stability. We will update our current status about high speed Sn-Ag plating chemical and other chemicals like Sn-Cu and pure Sn in this time. By using these binary alloy chemicals, we are able to produce Sn-Ag-Cu solder bumps by stacking Sn-Ag and Sn-Cu. And it can bring further variation for bumping alloys.

Application Analysis of Functional Ceramics Materials

2013 ◽  
Vol 373-375 ◽  
pp. 1975-1978
Author(s):  
Tao Ping Yan
Keyword(s):  
Integrated Circuits ◽  
Mobile Communications ◽  
High Performance ◽  
New Technologies ◽  
High Reliability ◽  
High Tech ◽  
National Defense ◽  
Modern Development ◽  
Wide Range ◽  
Functional Ceramics

A wide range of functional ceramics, a wide range of uses. It is the electronic information, integrated circuits, mobile communications, energy.An important foundation of modern high-tech fields of technology and national defense and other materials.This paper analyzes the different functions of the Nano, foam, smart, and biological status and application of new ceramic materials.And functional ceramics application of the main obstacles from the two aspects of price and reliability. Elaborated with the modern development of new technologies, functional ceramics and their applications are toward the high reliability, miniaturization, film, fine, multi-functional, intelligent, integrated, high performance, high functionality and composite structure direction.

Site specific agricultural soil management with the use of new technologies

2013 ◽  
Vol 16 (1) ◽  
pp. 59-67
Keyword(s):  
New Technologies ◽  
Digital Interface ◽  
Appropriate Treatment ◽  
Wide Range ◽  
Soil Variation ◽  
Soil Information ◽  
Remote Sensing Techniques ◽  
Agricultural Areas

<p>The Soil Science Institute of Thessaloniki produces new digitized Soil Maps that provide a useful electronic database for the spatial representation of the soil variation within a region, based on in situ soil sampling, laboratory analyses, GIS techniques and plant nutrition mathematical models, coupled with the local land cadastre. The novelty of these studies is that local agronomists have immediate access to a wide range of soil information by clicking on a field parcel shown in this digital interface and, therefore, can suggest an appropriate treatment (e.g. liming, manure incorporation, desalination, application of proper type and quantity of fertilizer) depending on the field conditions and cultivated crops. A specific case study is presented in the current work with regards to the construction of the digitized Soil Map of the regional unit of Kastoria. The potential of this map can easily be realized by the fact that the mapping of the physicochemical properties of the soils in this region provided delineation zones for differential fertilization management. An experiment was also conducted using remote sensing techniques for the enhancement of the fertilization advisory software database, which is a component of the digitized map, and the optimization of nitrogen management in agricultural areas.</p>

Digital Authoritarianism and the Future of Human Rights

2021 ◽  
pp. 1-27
Author(s):  
Tiberiu Dragu ◽  
Yonatan Lupu
Keyword(s):  
Human Rights ◽  
New Technologies ◽  
Theoretic Model ◽  
Human Rights Abuses ◽  
Human Rights Regime ◽  
Wide Range ◽  
The Future ◽  
Technological Developments ◽  
Game Theoretic ◽  
Strategic Context

Abstract How will advances in digital technology affect the future of human rights and authoritarian rule? Media figures, public intellectuals, and scholars have debated this relationship for decades, with some arguing that new technologies facilitate mobilization against the state and others countering that the same technologies allow authoritarians to strengthen their grip on power. We address this issue by analyzing the first game-theoretic model that accounts for the dual effects of technology within the strategic context of preventive repression. Our game-theoretical analysis suggests that technological developments may not be detrimental to authoritarian control and may, in fact, strengthen authoritarian control by facilitating a wide range of human rights abuses. We show that technological innovation leads to greater levels of abuses to prevent opposition groups from mobilizing and increases the likelihood that authoritarians will succeed in preventing such mobilization. These results have broad implications for the human rights regime, democratization efforts, and the interpretation of recent declines in violent human rights abuses.

scholarly journals The Comprehensive Autistic Trait Inventory (CATI): development and validation of a new measure of autistic traits in the general population

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Michael C. W. English ◽  
Gilles E. Gignac ◽  
Troy A. W. Visser ◽  
Andrew J. O. Whitehouse ◽  
James T. Enns ◽  
...  
Keyword(s):  
Factor Analysis ◽  
General Population ◽  
Measurement Invariance ◽  
High Reliability ◽  
Predictive Ability ◽  
Autistic Traits ◽  
Autism Spectrum ◽  
Autism Spectrum Quotient ◽  
Sensory Sensitivity ◽  
Wide Range

Abstract Background Traits and characteristics qualitatively similar to those seen in diagnosed autism spectrum disorder can be found to varying degrees in the general population. To measure these traits and facilitate their use in autism research, several questionnaires have been developed that provide broad measures of autistic traits [e.g. Autism-Spectrum Quotient (AQ), Broad Autism Phenotype Questionnaire (BAPQ)]. However, since their development, our understanding of autism has grown considerably, and it is arguable that existing measures do not provide an ideal representation of the trait dimensions currently associated with autism. Our aim was to create a new measure of autistic traits that reflects our current understanding of autism, the Comprehensive Autism Trait Inventory (CATI). Methods In Study 1, 107 pilot items were administered to 1119 individuals in the general population and exploratory factor analysis of responses used to create the 42-item CATI comprising six subscales: Social Interactions, Communication, Social Camouflage, Repetitive Behaviours, Cognitive Rigidity, and Sensory Sensitivity. In Study 2, the CATI was administered to 1068 new individuals and confirmatory factor analysis used to verify the factor structure. The AQ and BAPQ were administered to validate the CATI, and additional autistic participants were recruited to compare the predictive ability of the measures. In Study 3, to validate the CATI subscales, the CATI was administered to 195 new individuals along with existing valid measures qualitatively similar to each CATI subscale. Results The CATI showed convergent validity at both the total-scale (r ≥ .79) and subscale level (r ≥ .68). The CATI also showed superior internal reliability for total-scale scores (α = .95) relative to the AQ (α = .90) and BAPQ (α = .94), consistently high reliability for subscales (α > .81), greater predictive ability for classifying autism (Youden’s Index = .62 vs .56–.59), and demonstrated measurement invariance for sex. Limitations Analyses of predictive ability for classifying autism depended upon self-reported diagnosis or identification of autism. The autistic sample was not large enough to test measurement invariance of autism diagnosis. Conclusions The CATI is a reliable and economical new measure that provides observations across a wide range of trait dimensions associated with autism, potentially precluding the need to administer multiple measures, and to our knowledge, the CATI is also the first broad measure of autistic traits to have dedicated subscales for social camouflage and sensory sensitivity.

scholarly journals Responses to Ecopollutants and Pathogenization Risks of Saprotrophic Rhodococcus Species

Pathogens ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 974
Author(s):  
Irina B. Ivshina ◽  
Maria S. Kuyukina ◽  
Anastasiia V. Krivoruchko ◽  
Elena A. Tyumina
Keyword(s):  
Survival Strategies ◽  
Complex Life Cycle ◽  
Anthropogenic Pressure ◽  
Resting Cells ◽  
Organic Substrates ◽  
Negative Effects ◽  
Anthropogenic Pollutants ◽  
Rhodococcus Species ◽  
Wide Range ◽  
Rigid Cell Wall

Under conditions of increasing environmental pollution, true saprophytes are capable of changing their survival strategies and demonstrating certain pathogenicity factors. Actinobacteria of the genus Rhodococcus, typical soil and aquatic biotope inhabitants, are characterized by high ecological plasticity and a wide range of oxidized organic substrates, including hydrocarbons and their derivatives. Their cell adaptations, such as the ability of adhering and colonizing surfaces, a complex life cycle, formation of resting cells and capsule-like structures, diauxotrophy, and a rigid cell wall, developed against the negative effects of anthropogenic pollutants are discussed and the risks of possible pathogenization of free-living saprotrophic Rhodococcus species are proposed. Due to universal adaptation features, Rhodococcus species are among the candidates, if further anthropogenic pressure increases, to move into the group of potentially pathogenic organisms with “unprofessional” parasitism, and to join an expanding list of infectious agents as facultative or occasional parasites.

The chemistry of stabilized clusters

1982 ◽  
Vol 308 (1501) ◽  
pp. 27-34 ◽  
Keyword(s):  
Electron Donor ◽  
Organic Molecules ◽  
Metal Cluster ◽  
Organic Substrates ◽  
Insertion Reactions ◽  
Donor Ligand ◽  
Small Organic Molecules ◽  
Wide Range ◽  
Metal Metal ◽  
High Yields

Studies of the chemistry of metal cluster complexes and, in particular, their reactions with small organic molecules, have been confined to relatively few systems. Among the reasons for this are: (i) not many clusters are easily synthesized in high yields; (ii) their reactions often give a multitude of products that are difficult to separate and characterize; (iii) the conditions required to bring about reactions often lead to fragmentation of the cluster into lower nuclearity (often mononuclear) species. One cluster whose chemistry has been extensively studied is [Os 3 H 2 (CO) 10 ]. This can be synthesized in high yields from [Os 3 (CO) 12 ] + H 2 (Knox et al. 1975) and reacts readily under mild conditions with a wide range of electron-donor molecules by virtue of its coordinative unsaturation (Shapley et al. 1975; Deeming & Hasso 1976; Adams & Golembeski 1979). Formally, one may consider that a metal—metal double bond is present, which is reduced to a single bond on coordination of an additional two-electron donor ligand such as an organophosphine. The presence of metal—hydrogen bonds in this cluster and the cluster’s ability to coordinate organic substrates enable it to undergo a wide variety of insertion reactions, leading to products that may be regarded as intermediates in the reduction of organic molecules by clusters (Deeming & Hasso 1975; Keister & Shapley 1975).

The Effect of Distraction on Schizophrenic Performance (2) Psychomotor Ability

1965 ◽  
Vol 111 (474) ◽  
pp. 391-398 ◽  
Author(s):  
Andrew McGhie ◽  
James Chapman ◽  
J. S. Lawson
Keyword(s):  
Present Report ◽  
Sensory Modality ◽  
Preceding Paper ◽  
Auditory Distraction ◽  
Psychomotor Tests ◽  
Motor Responses ◽  
Wide Range ◽  
Schizophrenic Patients ◽  
Psychomotor Ability ◽  
Experimental Findings

In the preceding paper the effect of experimental distraction was examined and the findings discussed. The present report is concerned with a similar study of the effect of distraction on tests which involve another aspect of schizophrenic performance, that of psychomotor ability. Earlier studies (Chapman and McGhie, 1961, 1962) produced both clinical and experimental evidence that auditory distraction disrupted the motor responses of some schizophrenic patients. As the previous experimental findings were based on two tests involving only very limited areas of psychomotor performance, it was necessary to examine patients on a wide range of psychomotor tests. A second aim of the present investigation was to assess any differential effects due to variation in the sensory modality of the distracting stimuli.

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