Flip chip assembly utilizing anisotropic conductive films: a feasibility study

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853226 ◽

2002 ◽

Cited By ~ 2

Author(s):

D. Delaney ◽

J. White

Keyword(s):

Feasibility Study ◽

Flip Chip ◽

Conductive Films ◽

Flip Chip Assembly

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Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications

Microelectronics Reliability ◽

10.1016/j.microrel.2008.03.002 ◽

2008 ◽

Vol 48 (7) ◽

pp. 1052-1061 ◽

Cited By ~ 16

Author(s):

Kyung-Woon Jang ◽

Chang-Kyu Chung ◽

Woong-Sun Lee ◽

Kyung-Wook Paik

Keyword(s):

Material Properties ◽

Flash Memory ◽

Flip Chip ◽

Nand Flash ◽

Nand Flash Memory ◽

Conductive Films ◽

Flip Chip Assembly ◽

Memory Applications

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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of Electronic Materials ◽

10.1007/s11664-006-0203-0 ◽

2006 ◽

Vol 35 (1) ◽

pp. 189-189

Author(s):

J. W. Hwang ◽

M. J. Yim ◽

K. W. Paik

Keyword(s):

Flip Chip ◽

Resin Content ◽

Test Reliability ◽

Anisotropic Conductive Film ◽

Thermoplastic Resin ◽

Conductive Films ◽

Conductive Film ◽

Flip Chip Assembly

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Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Microelectronics Reliability ◽

10.1016/j.microrel.2007.10.004 ◽

2008 ◽

Vol 48 (4) ◽

pp. 645-651 ◽

Cited By ~ 15

Author(s):

J.S. Hwang

Keyword(s):

Flip Chip ◽

Conductive Films ◽

Filler Size ◽

Flip Chip Assembly ◽

Composite Properties

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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of Electronic Materials ◽

10.1007/s11664-005-0205-3 ◽

2005 ◽

Vol 34 (11) ◽

pp. 1455-1461 ◽

Cited By ~ 11

Author(s):

J. W. Hwang ◽

M. J. Yim ◽

K. W. Paik

Keyword(s):

Flip Chip ◽

Resin Content ◽

Test Reliability ◽

Anisotropic Conductive Film ◽

Thermoplastic Resin ◽

Conductive Films ◽

Conductive Film ◽

Flip Chip Assembly

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63.1: Flip Chip Assembly of Panel-Sized TFT-LCD Scan Drivers with Electroless-Plated Bumps Using Anisotropic Conductive Films

SID Symposium Digest of Technical Papers ◽

10.1889/1.2036364 ◽

2005 ◽

Vol 36 (1) ◽

pp. 1788 ◽

Cited By ~ 1

Author(s):

Shunji Noda ◽

Tamaki Toba ◽

Hiroshi Hayama

Keyword(s):

Flip Chip ◽

Conductive Films ◽

Flip Chip Assembly

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A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00371 ◽

2018 ◽

Cited By ~ 5

Author(s):

HanMin Lee ◽

SeYong Lee ◽

JongHo Park ◽

Chang-kyu Chung ◽

Kyung-Woon Jang ◽

...

Keyword(s):

Flip Chip ◽

Solder Bump ◽

Conductive Films ◽

Flip Chip Assembly

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Co-design/simulation of flip-chip assembly for high voltage IGBT packages

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233847 ◽

2017 ◽

Author(s):

P. Rajaguru ◽

C. Bailey ◽

H. Lu ◽

A. M. Aliyu ◽

A. Castellazzi ◽

...

Keyword(s):

High Voltage ◽

Flip Chip ◽

Flip Chip Assembly

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Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507801 ◽

2008 ◽

Cited By ~ 4

Author(s):

R. Durairaj ◽

S. Mallik ◽

A. Seman ◽

A. Marks ◽

N.N. Ekere

Keyword(s):

Viscoelastic Properties ◽

Flip Chip ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives ◽

Solder Pastes ◽

Flip Chip Assembly

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Indium Bumps Investigation for the Flip-chip Assembly

International Workshops and Tutorials on Electron Devices and Materials ◽

10.1109/sibedm.2006.230301 ◽

2006 ◽

Author(s):

Aidar Biktashov ◽

Nikolai Kuzmin ◽

Andrei Paulish

Keyword(s):

Flip Chip ◽

Indium Bumps ◽

Flip Chip Assembly

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The effect of polyimide surface treatment on flip-chip assembly

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232691 ◽

2009 ◽

Cited By ~ 1

Author(s):

M.C. Ong ◽

X.L. Zhao ◽

S.H. Lim ◽

J.M. Chin ◽

Chia-Ken Leong ◽

...

Keyword(s):

Surface Treatment ◽

Flip Chip ◽

Flip Chip Assembly

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