Reliability and process characterization of electroless Nickel-Gold/Solder flip chip interconnect technology

2002 ◽  
Author(s):  
S. Wiegele ◽  
P. Thompson ◽  
P. Lee ◽  
E. Ramsland
Keyword(s):  
Flip Chip ◽  
Electroless Nickel ◽  
Process Characterization ◽  
Interconnect Technology

A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology

2014 ◽  
Author(s):  
Gwee Hoon Yen ◽  
Ng Kiong Kay
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Fault Localization ◽  
Cost Effective ◽  
Fault Isolation ◽  
Voltage Contrast ◽  
Interconnect Technology

Abstract Today, failure analysis involving flip chip [1] with copper pillar bump packaging technologies would be the major challenges faced by analysts. Most often, handling on the chips after destructive chemical decapsulation is extremely critical as there are several failure analysis steps to be continued such as chip level fault localization, chip micro probing for fault isolation, parallel lapping [2, 3, 4] and passive voltage contrast. Therefore, quality of sample preparation is critical. This paper discussed and demonstrated a quick, reliable and cost effective methodology to decapsulate the thin small leadless (TSLP) flip chip package with copper pillar (CuP) bump interconnect technology.

Pore wetting process characterization of Equal-Sized granular coals by using LF-NMR technology

Fuel ◽  
2021 ◽  
pp. 122670
Author(s):  
Yuebing Zhang ◽  
Quangui Li ◽  
Qianting Hu ◽  
Cheng Zhai ◽  
Mingyang Song ◽  
...  
Keyword(s):  
Process Characterization ◽  
Wetting Process ◽  
Lf Nmr

scholarly journals Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

2015 ◽  
Author(s):  
Aneliya KARADZHINOVA ◽  
Anton Nolvi ◽  
Jaakko Härkönen ◽  
Panja Luukka ◽  
Teppo Mäenpää ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pixel Detector ◽  
Silicon Pixel Detector

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

2014 ◽  
Vol 20 (4-5) ◽  
pp. 861-867 ◽  
Author(s):  
T. Waber ◽  
W. Pahl ◽  
M. Schmidt ◽  
G. Feiertag ◽  
S. Stufler ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pressure Sensors ◽  
Barometric Pressure
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