Flip chip on board connection technology: process characterization and reliability

1994 ◽  
Vol 17 (3) ◽  
pp. 256-263 ◽  
Author(s):  
J. Giesler ◽  
G. O'Malley ◽  
M. Williams ◽  
S. Machuga
Keyword(s):  
Flip Chip ◽  
Process Characterization ◽  
Technology Process

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

1999 ◽  
Author(s):  
Brian J. Lewis ◽  
Hilary Sasso
Keyword(s):  
Process Parameters ◽  
Flip Chip ◽  
Failure Modes ◽  
Shock Testing ◽  
Fine Pitch ◽  
Process Characterization ◽  
Solder Bumps ◽  
Optimum Height ◽  
High Yields

Abstract Processing fine pitch flip chip devices continues to pose problems for packaging and manufacturing engineers. Optimizing process parameters such that defects are limited and long-term reliability of the assembly is increased can be a very tedious task. Parameters that effect the robustness of the process include the flux type and placement parameters. Ultimately, these process parameters can effect the long-term reliability of the flip chip assembly by either inhibiting or inducing process defects. Therefore, care is taken to develop a process that is robust enough to supply high yields and long term reliability, but still remains compatible with a standard surface mount technology process. This is where process optimization becomes most critical and difficult. What is the optimum height of the flux thin film used for a dip process? What force is required to insure that the solder bumps make contact with the pads? What are the limiting boundaries in which high yields and high reliabilities are achieved, while maintaining a streamlined, proven process? The following study evaluates a set of process parameters and their impact on process defects and reliability. The study evaluates process parameters including, flux type, flux application parameters, placement force and placement accuracy to determine their impact. Solder voiding, inadequate solder wetting, and crack propagation and delamination in the underfill layer are defects examined in the study. Assemblies will be subjected to liquid-to-liquid thermal shock testing (−55° C to 125°C) to determine failure modes due to the aforementioned defects. The results will show how changes in process parameters effect yield and reliability.

Analysis of Characteristics of Halogen and LED Automobile Lamps

2020 ◽  
pp. 57-62
Author(s):  
Olga Yu. Kovalenko ◽  
Yulia A. Zhuravlyova
Keyword(s):  
Power Consumption ◽  
Flip Chip ◽  
Weather Conditions ◽  
Luminous Flux ◽  
Luminous Efficacy ◽  
Colour Temperature ◽  
Study Results ◽  
Calculation Results ◽  
Mandatory Rules ◽  
Halogen Lamps

This work contains analysis of characteristics of automobile lamps by Philips, KOITO, ETI flip chip LEDs, Osram, General Electric (GE), Gtinthebox, OSLAMPledbulbs with H1, H4, H7, H11 caps: luminous flux, luminous efficacy, correlated colour temperature. Characteristics of the studied samples are analysed before the operation of the lamps. The analysis of the calculation results allows us to make a conclusion that the values of correlated colour temperature of halogen lamps are close to the parameters declared by manufacturers. The analysis of the study results has shown that, based on actual values of correlated colour temperature, it is not advisable to use LED lamps in unfavourable weather conditions (such as rain, fog, snow). The results of the study demonstrate that there is a slight dispersion of actual values of luminous flux of halogen lamps by different manufacturers. Maximum variation between values of luminous flux of different lamps does not exceed 14 %. The analysis of the measurement results has shown that actual values of luminous flux of all halogen lamps comply with the mandatory rules specified in the UN/ECE Regulation No. 37 and luminous flux of LED lamps exceeds maximum allowable value by more than 8 %. Luminous efficacy of LED lamps is higher than that of halogen lamps: more than 82 lm/W and lower power consumption. The results of the measurements have shown that power consumption of a LED automobile lamp is lower than that of similar halogen lamps by 3 times and their luminous efficacy is higher by 5 times.

Analisis Deskriptif Strategi Komunikasi Hotel Sakura Syariah

2020 ◽  
Vol 5 (2) ◽  
Author(s):  
Nazwirman Nazwirman ◽  
Efendy Zein
Keyword(s):  
Local Government ◽  
Analytical Method ◽  
Marketing Mix ◽  
Communication Strategy ◽  
Easy Access ◽  
Marketing Communication ◽  
Integrated Marketing ◽  
Integrated Marketing Communication ◽  
Physical Evidence ◽  
Technology Process

The research objective describes an integrated marketing communication strategy in developing Sakura Syariah Hotel to see a comprehensive marketing communication strategy. Hotel Sakura Syariah is a 3-star syariah concept hotel which has 70 rooms. The analytical method uses the 7P (marketing mix) approach. The research results to increase the number of guests staying the strategy consisted of products, which offer a sharia concept with various types of representative rooms. Pricing, using the appropriate price preferences. Place, hotel location that is close to the center of the district capital and easy access. Promotion, with direct selling in accordance with local government and private selling by participating in various marketing events, sales proposals and advertising. People, conduct trainings to improve human resource capabilities. Physical evidence, a physical building that has Sharia characters and is supported by fairly good technology. Process, reservation service is quite fast and excellent. The development of this Sayriah hotel must be supported by related parties, especially the local government in order to increase the number of hotel guests

Sign in / Sign up

Export Citation Format

Share Document