Characterization of magnetoresistors for contactless current sensing in power electronic applications

2017 ◽  
Author(s):  
Shahriar Jalal Nibir ◽  
Hossein Niakan ◽  
Babak Parkhideh
Keyword(s):  
Power Electronic ◽  
Current Sensing

Development and Characterization of a >1kV Power Electronic Capacitor for >300 degree C Operation

1997 ◽  
Author(s):  
J. Bowers ◽  
L. Mandelcorn ◽  
S. Gurkovich ◽  
K. Radford
Keyword(s):  
Power Electronic

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

2018 ◽  
Author(s):  
Erick Gutierrez ◽  
Subramani Manoharan ◽  
Maxim Serebreni ◽  
Patrick McCluskey
Keyword(s):  
Liquid Phase ◽  
Mechanical Load ◽  
Transient Liquid Phase ◽  
Electronic Systems ◽  
Power Electronic ◽  
Nano Indentation ◽  
Lap Shear ◽  
Die Attach ◽  
Power Modules

The increasing thermal demands in power electronic systems require the application of high temperature die attach materials. Transient Liquid Phase Sintered (TLPS) paste-based solder alloys have been demonstrated to effectively manage the thermal and mechanical load requirements of power modules. The microstructural features of these alloys provide interconnects with the necessary strength required to sustain high loads at high temperatures. To properly understand the influence of microstructure on mechanical behavior of these alloys, single lap shear experiments were performed on a TLPS system consisting of Copper and Tin particles (Cu-Sn). Nano-indentation measurements were performed on intermetallic phases of the TLPS, and the results obtained from lap shear testing and nano-indentation measurements are presented.

Integrating GMR Field Detectors for High-Bandwidth Current Sensing in Power Electronic Modules

2012 ◽  
Vol 48 (4) ◽  
pp. 1432-1439 ◽  
Author(s):  
Patrick E. Schneider ◽  
Masafumi Horio ◽  
Robert D. Lorenz
Keyword(s):  
Power Electronic ◽  
Current Sensing ◽  
High Bandwidth
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