Embedded memory fail analysis for production yield enhancement

2011 ◽  
Author(s):  
Youssef Baltagi ◽  
Daniele Li Rosi ◽  
Vincenzo Tancorre ◽  
Christophe Garagnon ◽  
Eric Faehn ◽  
...  
Keyword(s):  
Production Yield ◽  
Yield Enhancement ◽  
Embedded Memory

Improved Production of Two Anti-Candida Lipopeptide Homologues Co- Produced by the Wild-Type Bacillus subtilis RLID 12.1 under Optimized Conditions

2020 ◽  
Vol 21 (5) ◽  
pp. 438-450
Author(s):  
Ramya Ramchandran ◽  
Swetha Ramesh ◽  
Anviksha A ◽  
RamLal Thakur ◽  
Arunaloke Chakrabarti ◽  
...  
Keyword(s):  
Bacillus Subtilis ◽  
Pathogenic Fungi ◽  
Fold Increase ◽  
Production Yield ◽  
Yield Enhancement ◽  
Bioactive Metabolites ◽  
Candida Auris ◽  
Media Formulation ◽  
Static Conditions

Background:: Antifungal cyclic lipopeptides, bioactive metabolites produced by many species of the genus Bacillus, are promising alternatives to synthetic fungicides and antibiotics for the biocontrol of human pathogenic fungi. In a previous study, the co- production of five antifungal lipopeptides homologues (designated as AF1, AF2, AF3, AF4 and AF5) by the producer strain Bacillus subtilis RLID 12.1 using unoptimized medium was reported; though the two homologues AF3 and AF5 differed by 14 Da and in fatty acid chain length were found effective in antifungal action, the production/ yield rate of these two lipopeptides determined by High-Performance Liquid Chromatography was less in the unoptimized media. Methods:: In this study, the production/yield enhancement of the two compounds AF3 and AF5 was specifically targeted. Following the statistical optimization (Plackett-Burman and Box-Behnken designs) of media formulation, temperature and growth conditions, the production of AF3 and AF5 was improved by about 25.8- and 7.4-folds, respectively under static conditions. Results:: To boost the production of these two homologous lipopeptides in the optimized media, heat-inactivated Candida albicans cells were used as a supplement resulting in 34- and 14-fold increase of AF3 and AF5, respectively. Four clinical Candida auris isolates had AF3 and AF5 MICs (100 % inhibition) ranging between 4 and 16 μg/ml indicating the lipopeptide’s clinical potential. To determine the in vitro pharmacodynamic potential of AF3 and AF5, time-kill assays were conducted which showed that AF3 (at 4X and 8X concentrations) at 48h exhibited mean log reductions of 2.31 and 3.14 CFU/ml of C. albicans SC 5314, respectively whereas AF5 at 8X concentration showed a mean log reduction of 2.14 CFU/ml. Conclusion:: With the increasing threat of multidrug-resistant yeasts and fungi, these antifungal lipopeptides produced by optimized method promise to aid in the development of novel antifungal that targets disease-causing fungi with improved efficacy.

Novel Technique for Production-Yield Enhancement of Semiconductor Devices

2018 ◽  
Author(s):  
Shiro Ninomiya ◽  
Yoji Kawasaki ◽  
Yasuharu Okamoto ◽  
Kazuhisa Ishibashi ◽  
Toshio Yumiyama ◽  
...  
Keyword(s):  
Semiconductor Devices ◽  
Production Yield ◽  
Yield Enhancement ◽  
Novel Technique

Production Yield Enhancement through Failure Analysis Investigation

2009 ◽  
Author(s):  
Rajesh Medikonduri
Keyword(s):  
Failure Analysis ◽  
Flash Memory ◽  
Production Yield ◽  
Yield Enhancement ◽  
Related Issue ◽  
Data Loss ◽  
Current Testing ◽  
Corrective Actions ◽  
The One

Abstract Production yield verification for a complex device, such as the flash memory, is a problem of primary importance due to high design density and current testing capabilities of such design. In this paper, the flow byte issue in the one time programmable block is investigated through physical failure analysis (PFA). The customer reported fail for this unit was flow byte error with flipped data loss in one of the bit. Various experiments were done on numerous units to identify the yield related issue and prevent shipment of such units to customers. The case study from this paper is beneficial to the FA community by showing the exact methodology in identifying the problem, its containment, and implementation of corrective actions on the ATE to prevent shipment of low yield units to customer. The yield was enhanced by implementing the containment and corrective actions on the ATE.

Embedded Memory Analysis for Standard Cell ASIC Yield Enhancement

2000 ◽  
Author(s):  
Cary A. Gloor
Keyword(s):  
Failure Analysis ◽  
Yield Enhancement ◽  
Standard Cell ◽  
Embedded Memory ◽  
Process Technology ◽  
Quality Performance ◽  
Root Cause ◽  
Process Characterization ◽  
System On A Chip ◽  
Made In

Abstract The advances made in process technology along with system-on-a-chip capabilities have made failure analysis ever more difficult and expensive to perform. Quick product time-to-market and the required high fabrication yields demand top quality performance from the failure analysis team. In this paper we present a methodology for embedded memory analysis (EMA) which provides design, layout, and process characterization, and yield and reliability enhancement for standard cell ASIC products. The methodology takes the power of memory testing and failure signature analysis and brings it to the logic chip to accurately predict root cause defects. We also present the application tool that is used to query, bitmap, analyze, and report the data, along with numerous case histories. This process has greatly improved failure analysis hit rates and provided much quicker turn-times for process improvement feedback and customer return root cause analysis.

scholarly journals Production Yield Enhancement of Mycosporine-like amino acid(MAA)s in Transformed Microalgae Culture by Radiofrequency

2014 ◽  
Vol 15 (6) ◽  
pp. 3799-3804 ◽  
Author(s):  
Hyo Hyun Seo ◽  
Mi Young Song ◽  
Atul Kulkarni ◽  
Sung-Suk Suh ◽  
Taek-Kyun Lee ◽  
...  
Keyword(s):  
Amino Acid ◽  
Production Yield ◽  
Yield Enhancement ◽  
Microalgae Culture

ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and Yield Enhancement

1998 ◽  
Author(s):  
D.S. Patrick ◽  
L.C. Wagner ◽  
P.T. Nguyen
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Yield Enhancement ◽  
Production Test ◽  
Final Test ◽  
Critical Design ◽  
The Past ◽  
Product Engineering ◽  
Time Savings ◽  
Analysis Design

Abstract Failure isolation and debug of CMOS integrated circuits over the past several years has become increasingly difficult to perform on standard failure analysis functional testers. Due to the increase in pin counts, clock speeds, increased complexity and the large number of power supply pins on current ICS, smaller and less equipped testers are often unable to test these newer devices. To reduce the time of analysis and improve the failure isolation capabilities for failing ICS, failure isolation is now performed using the same production testers used in product development, multiprobe and final test. With these production testers, the test hardware, program and pattern sets are already available and ready for use. By using a special interface that docks the production test head to failure isolation equipment such as the emission microscope, liquid crystal station and E-Beam prober, the analyst can quickly and easily isolate the faillure on an IC. This also enables engineers in design, product engineering and the waferfab yield enhancement groups to utilize this equipment to quickly solve critical design and yield issues. Significant cycle time savings have been achieved with the migration to this method of electrical stimulation for failure isolation.

Transmission Electron Microscopy and Scanning Capacitance Microscopy Analysis of Dislocation-Induced Leakages in n-channel I/O Transistors

2005 ◽  
Author(s):  
M.L. Anderson ◽  
P. Tangyunyong ◽  
T.A. Hill ◽  
C.Y. Nakakura ◽  
T.J. Headley ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
New Product Development ◽  
Yield Enhancement ◽  
Product Development Process ◽  
Product Lines ◽  
Scanning Capacitance Microscopy ◽  
Transmission Electron ◽  
Complementary Techniques ◽  
Analytical Tools

Abstract By combining transmission electron microscopy (TEM) [1] with scanning capacitance microscopy (SCM) [2], it is possible to enhance our understanding of device failures. At Sandia, these complementary techniques have been utilized for failure analysis in new product development, process validation, and yield enhancement, providing unique information that cannot be obtained with other analytical tools. We have previously used these instruments to identify the root causes of several yield-limiting defects in CMOS device product lines [3]. In this paper, we describe in detail the use of these techniques to identify electrically active silicon dislocations in failed SRAMs and to study the underlying leakage mechanisms associated with these defects.

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