Polymeric conductive pastes as solder replacement for flip-chip attachment

1998 ◽  
Vol 21 (4) ◽  
pp. 382-393 ◽  
Author(s):  
Kaoru U. Maner ◽  
Simon S. Ang ◽  
Leonard W. Schaper ◽  
William D. Brown
Keyword(s):  
Flip Chip ◽  
Chip Attachment

Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000671-000707
Author(s):  
Stephen Kenny ◽  
Sven Lamprecht ◽  
Kai Matejat ◽  
Bernd Roelfs
Keyword(s):  
Flip Chip ◽  
Practical Experience ◽  
Electrolytic Deposition ◽  
Solder Paste ◽  
Stencil Printing ◽  
Printing Process ◽  
Advantages And Disadvantages ◽  
Novel Approach ◽  
Solder Bumps ◽  
Chip Attachment

Electrolytic Solder Deposit for Current methods for the formation of pre-solder bumps for flip chip attachment use stencil printing techniques with an appropriate solder paste. The continuing trend towards increasing miniaturisation and the associated decrease in size of solder resist opening, SRO is causing production difficulties with the stencil printing process. Practical experience of production yields has shown that stencil printing will not be able to meet future requirements for solder bump pitch production below 0.15 mm for these applications. This paper describes a novel approach to replace the stencil printing process by use of an electrolytic deposition of solder. In contrast to stencil printing, use of electrolytic deposition techniques allows production of solder bumps with a pitch below 0.15 mm and with a SRO below 80 μm. Methods for production of electrolytic solder bumps based on pure tin as well as alloys of tin/copper and also tin/silver are shown and in particular a method to control the alloy concentration of electroplated tin/copper bumps. Test results with both alloy systems and also pure tin bumping are presented together with comparison of the advantages and disadvantages. The general advantages of replacement of stencil printing by electrolytic deposition of solder bumps are shown and in particular the improvement of bump reliability and the potential to significantly decrease costs by yield improvement.

Aging Studies of Cu–Sn Intermetallics in Cu Micropillars Used in Flip Chip Attachment onto Cu Lead Frames

2017 ◽  
Vol 47 (2) ◽  
pp. 1694-1704 ◽  
Author(s):  
Maria Penafrancia C. Roma ◽  
Santosh Kudtarkar ◽  
Oliver Kierse ◽  
Dipak Sengupta ◽  
Junghyun Cho
Keyword(s):  
Flip Chip ◽  
Aging Studies ◽  
Chip Attachment

Reliability of 80 μm pitch flip chip attachment on flex

2001 ◽  
Vol 41 (5) ◽  
pp. 633-638 ◽  
Author(s):  
Petteri Palm ◽  
Jarmo Määttänen ◽  
Aulis Tuominen ◽  
Eero Ristolainen
Keyword(s):  
Flip Chip ◽  
Chip Attachment

Flux-free direct chip attachment of solder-bump flip chip by Ar + H2 plasma treatment

2002 ◽  
Vol 31 (10) ◽  
pp. 1104-1111 ◽  
Author(s):  
Soon-Min Hong ◽  
Choon-Sik Kang ◽  
Jae-Pil Jung
Keyword(s):  
Plasma Treatment ◽  
Flip Chip ◽  
Solder Bump ◽  
Chip Attachment
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