Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780336429

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

High reliable FC-PBGA

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559696 ◽

2002 ◽

Cited By ~ 1

Author(s):

Y. Ishida ◽

T. Katoh ◽

S. Ishiwata ◽

A. Omura ◽

T. Oohara

Download Full-text

Transport mechanism in borophosphosilicate glass passivation

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559729 ◽

2002 ◽

Author(s):

A. Achari

Keyword(s):

Transport Mechanism ◽

Borophosphosilicate Glass

Download Full-text

A method for the measurement of chip to leadframe adhesion in LOC packages

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559772 ◽

2002 ◽

Author(s):

S.S. Ahmad ◽

Tongbi Jiang ◽

W. Moden ◽

C. Breen ◽

J. Reeder

Download Full-text

Prototype sensor and data acquisition system for the CILAP polymer deposition process

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559786 ◽

2002 ◽

Cited By ~ 2

Author(s):

A. Krauss ◽

T. Miller

Keyword(s):

Data Acquisition ◽

Data Acquisition System ◽

Deposition Process ◽

Acquisition System ◽

Polymer Deposition

Download Full-text

Eutectic solder flip chip technology for chip scale package

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559794 ◽

2002 ◽

Cited By ~ 3

Author(s):

C. Takubo ◽

N. Hirano ◽

K. Doi ◽

H. Tazawa ◽

E. Hosomi ◽

...

Keyword(s):

Flip Chip ◽

Eutectic Solder ◽

Chip Technology ◽

Chip Scale Package

Download Full-text

An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559785 ◽

2002 ◽

Cited By ~ 4

Author(s):

A.R. Kalukin ◽

V. Sankaran ◽

B. Chartrand ◽

D.L. Millard ◽

R.P. Kraft ◽

...

Keyword(s):

Solder Joints ◽

Improved Method ◽

X Ray

Download Full-text

Moldability improvements in thin quad flat packages (TQFPs)

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559741 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Downey ◽

D. Hagen ◽

M.L. Lim ◽

R. Ibrahim ◽

K. Anuar ◽

...

Download Full-text

Statistical experimental design for MBE process characterization

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559765 ◽

2002 ◽

Cited By ~ 4

Author(s):

K.K. Lee ◽

R. Bicknell-Tassius ◽

G. Dagnall ◽

A. Brown ◽

G. May

Keyword(s):

Experimental Design ◽

Statistical Experimental Design ◽

Process Characterization

Download Full-text

Evaluating the environment, safety and health impacts of semiconductor manufacturing at the design and process development stages

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559736 ◽

2002 ◽

Cited By ~ 3

Author(s):

W. Lashbrook ◽

P. O'Hara

Keyword(s):

Semiconductor Manufacturing ◽

Process Development ◽

Health Impacts ◽

Development Stages ◽

Safety And Health

Download Full-text

Applications of cost of ownership to environment, safety and health

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559737 ◽

2002 ◽

Cited By ~ 9

Author(s):

D. Dance ◽

A. Veltri ◽

W. Lashbrook

Keyword(s):

Cost Of Ownership ◽

Safety And Health

Download Full-text

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

High reliable FC-PBGA

Transport mechanism in borophosphosilicate glass passivation

A method for the measurement of chip to leadframe adhesion in LOC packages

Prototype sensor and data acquisition system for the CILAP polymer deposition process

Eutectic solder flip chip technology for chip scale package

An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography

Moldability improvements in thin quad flat packages (TQFPs)

Statistical experimental design for MBE process characterization

Evaluating the environment, safety and health impacts of semiconductor manufacturing at the design and process development stages

Applications of cost of ownership to environment, safety and health

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium
Latest Publications