Proceedings of Electrical Performance of Electronic Packaging EPEP-95
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The Impedance Transformation Technique for the Elimination of Numerical Errors in the Simulation of

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524860 ◽

2005 ◽

Author(s):

Zhonghua Wu ◽

Jiayuan Fang

Keyword(s):

Transformation Technique ◽

Numerical Errors

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A New Approach to Signal Integrity Analysis of High-Speed Packaging

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.526275 ◽

2005 ◽

Cited By ~ 10

Author(s):

Yuzhe Chen ◽

Zhaoqing Chen ◽

Zhonghua Wu ◽

Danwei Xue ◽

Jiayuan Fang

Keyword(s):

High Speed ◽

Signal Integrity ◽

New Approach ◽

Integrity Analysis

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Canonical Models for Determining the Effect of Decoupling Capacitors on Computer Packages

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524692 ◽

2005 ◽

Author(s):

B.J. Rubin

Keyword(s):

Canonical Models ◽

Decoupling Capacitors

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FREQUENCY DOMAIN MEASUREMENTS OF VSPA: A NOVEL PACKAGING TECHNOLOGY

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524875 ◽

2005 ◽

Cited By ~ 1

Author(s):

J. Hao ◽

A. Richter ◽

J. Laskar ◽

M. Swaminathan ◽

J. Mosley

Keyword(s):

Frequency Domain ◽

Packaging Technology

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LC::: An Integrated Methodology to Model and Visualize the Complex Electrodynamics of 3D Structures

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524855 ◽

2005 ◽

Author(s):

R. Gravrok ◽

M. Piket-May ◽

K. Thomas

Keyword(s):

3D Structures ◽

Integrated Methodology

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14nalysis and Simulation of Complex Interconnect Structures andd Power/Ground Distribution Networks

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524858 ◽

2005 ◽

Author(s):

F.Y. Yuan

Keyword(s):

Distribution Networks

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A COPLANAR WAVEGUIDE PROBE WITH APPLICATIONS TO THIN FILM DIELECTRIC MEASUREMENTS

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524872 ◽

2005 ◽

Author(s):

E.W. Seltmann ◽

J. Laskar ◽

K. Smith ◽

R. Gleason

Keyword(s):

Thin Film ◽

Coplanar Waveguide ◽

Dielectric Measurements ◽

Film Dielectric

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Low cost 400 MHz source synchronous data links

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524878 ◽

2002 ◽

Cited By ~ 2

Author(s):

R.E. Nikel

Keyword(s):

Low Cost ◽

Data Links

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Large-signal modeling and characterization of a plastic packaged HBT for use in wireless portable units

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524884 ◽

2002 ◽

Cited By ~ 1

Author(s):

Der-Woei Wu ◽

G.N. Henderson

Keyword(s):

Signal Modeling ◽

Large Signal

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Effect of package shape on spurious coupling among microstrip discontinuities

Proceedings of Electrical Performance of Electronic Packaging EPEP-95 ◽

10.1109/epep.1995.524890 ◽

2002 ◽

Author(s):

K.C. Gupta ◽

H. Cebi ◽

Cheok Thng

Keyword(s):

Microstrip Discontinuities

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Proceedings of Electrical Performance of Electronic Packaging EPEP-95Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

The Impedance Transformation Technique for the Elimination of Numerical Errors in the Simulation of

A New Approach to Signal Integrity Analysis of High-Speed Packaging

Canonical Models for Determining the Effect of Decoupling Capacitors on Computer Packages

FREQUENCY DOMAIN MEASUREMENTS OF VSPA: A NOVEL PACKAGING TECHNOLOGY

LC::: An Integrated Methodology to Model and Visualize the Complex Electrodynamics of 3D Structures

14nalysis and Simulation of Complex Interconnect Structures andd Power/Ground Distribution Networks

A COPLANAR WAVEGUIDE PROBE WITH APPLICATIONS TO THIN FILM DIELECTRIC MEASUREMENTS

Low cost 400 MHz source synchronous data links

Large-signal modeling and characterization of a plastic packaged HBT for use in wireless portable units

Effect of package shape on spurious coupling among microstrip discontinuities

Proceedings of Electrical Performance of Electronic Packaging EPEP-95
Latest Publications