High-performance, high-reliability InP/GaInAS p-i-n photodiodes and flip-chip integrated receivers for lightwave communications

1991 ◽  
Vol 9 (9) ◽  
pp. 1200-1207 ◽  
Author(s):  
O. Wada ◽  
M. Makiuchi ◽  
H. Hamaguchi ◽  
T. Kumai ◽  
T. Mikawa
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
High Reliability ◽  
Integrated Receivers

High Reliability and Thermal Performance FCBGA Package

2007 ◽  
Author(s):  
Gino Hung ◽  
Ho-Yi Tsai ◽  
Chun An Huang ◽  
Steve Chiu ◽  
C. S. Hsiao
Keyword(s):  
Thermal Performance ◽  
High Performance ◽  
Flip Chip ◽  
Dielectric Material ◽  
High Reliability ◽  
Lead Free ◽  
Molding Process ◽  
Molding Compound ◽  
Reliability Performance ◽  
Low K

A high reliability and high thermal performance molding flip chip ball grid arrays structure which was improved from Terminator FCBGA®. (The structure are shown as Fig. 1) It has many advantages, like better coplanarity, high through put (multi pes for each shut of molding process), low stress, and high thermal performance. In conventional flip chip structure, underfill dispenses and cure processes are a bottleneck due to low through put (dispensing unit by unit). For the high performance demand, large package/die size with more integrated functions needs to meet reliability criteria. Low k dielectric material, lead free bump especially and the package coplanarity are also challenges for package development. Besides, thermal performance is also a key concern with high power device. From simulation and reliability data, this new structure can provide strong bump protection and reach high reliability performance and can be applied for low-K chip and all kind of bump composition such as tin-lead, high lead, and lead free. Comparing to original Terminator FCBGA®, this structure has better thermal performance because the thermal adhesive was added between die and heat spreader instead of epoxy molding compound (EMC). The thermal adhesive has much better thermal conductivity than EMC. Furthermore, this paper also describes the process and reliability validation result.

New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 000482-000490
Author(s):  
Eiji Yamaguchi ◽  
Mutsuo Tsuji ◽  
Nozomi Shimoishizaka ◽  
Takahiro Nakano ◽  
Katsunori Hirata
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
High Reliability ◽  
Device Structure ◽  
Bonding Pressure ◽  
Flip Chip Bonding ◽  
Reflow Temperature ◽  
Device Structures ◽  
Bonding Technology ◽  
The Cost

As the current and next generation devices are embracing geometries below 28nm and requiring softer low-K dielectric isolation on very thin large silicon dies ∼ to perform a reliable die-to-package interconnect is becoming a challenge. Further, the high pressure from Cu wire bonding and high reflow temperature of conventional flip-chip bonding often results in damage of device structure. A new flip-chip bonding technology has been developed for such critical applications, and is claimed to be “damage free”. It uses soft bump made by non-full cured conductive paste on the package substrate. These soft bumps require ultra-low bonding pressure on the pad of the die. Thus the bonding process don't make any damage on ULK isolation layer. Details of the process, material sets used for such fragile device structures have been discussed. Reliability results are shared, which further ensures the robustness of this process. Finally, the cost advantage through adaptation of this process has also been elaborated.

New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications

2013 ◽  
Vol 52 (1) ◽  
pp. 709-715 ◽  
Author(s):  
E. Yamaguchi ◽  
M. Tsuji ◽  
N. Shimoishizaka ◽  
T. Nakano ◽  
K. Hirata
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
High Reliability ◽  
Interconnect Technology

SI-ON-SI MCM TECHNOLOGY AND ITS APPLICATIONS

1991 ◽  
Vol 02 (04) ◽  
pp. 251-261 ◽  
Author(s):  
K.L. TAI
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Technological Development ◽  
High Reliability ◽  
Low Cost ◽  
Consumer Products ◽  
Printed Wiring Board ◽  
Cad System ◽  
Compact Size ◽  
Challenges And Opportunities

Multichip Module (MCM) packaging has been used in high-end systems, such as mainframe and supercomputers for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. We should not just try to find a solution, but also try to take a long-term view and plan the technological development. We would like to develop MCM technology which has a broad range of applications from consumer products to supercomputers. The technology should focus on low cost, high performance, compact size, and high reliability. We believe that it is most attractive to leverage IC technology and surface mount technology (SMT). Therefore we select Si wafer as the substrate, Al as the metallization, polyimide as the dielectrics, Ta-Si as the resistor material, and Si oxide and nitride as the dielectrics for capacitor. Flip-chip solder attachment are used to assemble chips on the substrate. We view our version of MCM as a “giant chip” rather than a miniaturized printed wiring board. This “giant chip” contains mixed device technologies which cannot be obtained by current device technology. The migration path should be from small to large module. The infrastructure of the CAD system and the testing system is critical for the development of MCM technology. Potential applications and implementations of MCM technology are given in this paper.

Lead Free Flip Chip Reliability for Various Package Types

2011 ◽  
Author(s):  
Nokibul Islam ◽  
Miguel Jimarez ◽  
Ahmer Syed ◽  
TaeKyeong Hwang ◽  
JaeYun Gim ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Large Body ◽  
Temperature Cycle ◽  
Molding Compound ◽  
Board Level ◽  
Board Level Reliability

Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as wire bond. Extensive research has been carried out to make the flip chip more robust, smaller foot prints, and excellent performance. FC packages are fabricated typically in two main configurations. Bare die FC packages leave the non active side of the die exposed. This allows the customer to apply their preferred heat dissipation scheme during board level attach. Lidded FC packages use a metallic lid attached to the die. Bare die package can be further subdivided into bare die underfilled package and bare die flip chip molded ball grid array (FCmBGA) package. Each of these packaging configurations has advantages as well as disadvantages. FCmBGA uses molding compound or EMC instead of capillary underfill, to protect FC die, and eliminate the need for a lid. Package warpage reduced a lot by adding a lid with the bare die FC package. However, the package and board level reliability for the above package types are still debatable. In this study test vehicles with three package types with bumps and BGAs are daisy chain to measure in situ data during accelerated tests. Impact of standard vs. low CTE (coefficient of thermal expansion) core substrate, accelerated temperature cycle conditions (temperature cycle condition “B”, “H”, and “J” according to JEDEC), and package level vs. package mounted on the board level reliability will be investigated. Comprehensive reliability data will help to select the right package type for next generation large die large body flip chip application.

Electrostatic bellow muscle actuators and energy harvesters that stack up

2021 ◽  
Vol 6 (51) ◽  
pp. eaaz5796
Author(s):  
I. D. Sîrbu ◽  
G. Moretti ◽  
G. Bortolotti ◽  
M. Bolignari ◽  
S. Diré ◽  
...  
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Artificial Muscle ◽  
Pressure Head ◽  
Robotic Systems ◽  
Maximum Pressure ◽  
Term Operation ◽  
Energy Harvesters ◽  
Out Of Plane

Future robotic systems will be pervasive technologies operating autonomously in unknown spaces that are shared with humans. Such complex interactions make it compulsory for them to be lightweight, soft, and efficient in a way to guarantee safety, robustness, and long-term operation. Such a set of qualities can be achieved using soft multipurpose systems that combine, integrate, and commute between conventional electromechanical and fluidic drives, as well as harvest energy during inactive actuation phases for increased energy efficiency. Here, we present an electrostatic actuator made of thin films and liquid dielectrics combined with rigid polymeric stiffening elements to form a circular electrostatic bellow muscle (EBM) unit capable of out-of-plane contraction. These units are easy to manufacture and can be arranged in arrays and stacks, which can be used as a contractile artificial muscle, as a pump for fluid-driven soft robots, or as an energy harvester. As an artificial muscle, EBMs of 20 to 40 millimeters in diameter can exert forces of up to 6 newtons, lift loads over a hundred times their own weight, and reach contractions of over 40% with strain rates over 1200% per second, with a bandwidth over 10 hertz. As a pump driver, these EBMs produce flow rates of up to 0.63 liters per minute and maximum pressure head of 6 kilopascals, whereas as generator, they reach a conversion efficiency close to 20%. The compact shape, low cost, simple assembling procedure, high reliability, and large contractions make the EBM a promising technology for high-performance robotic systems.

A New Concept of High-Performance Marine Reversing Reduction Gears

1988 ◽  
Vol 110 (4) ◽  
pp. 572-577
Author(s):  
D. J. Folenta
Keyword(s):  
Gas Turbine ◽  
High Performance ◽  
Power Transmission ◽  
High Reliability ◽  
Mechanical Efficiency ◽  
Gas Turbine Engine ◽  
Turbine Engines ◽  
Turbine Engine ◽  
Epicyclic Gear ◽  
Gear Technology

This paper presents a brief description and several illustrations of a new concept of marine reversing gears that utilize high-performance differentially driven epicyclic gear arrangements. This new marine power transmission has the potential to offer high reliability, simplicity, light weight, high mechanical efficiency, compactness, and technological compatibility with aircraft derivative marine gas turbine engines. Further, this new reversing gear minimizes the danger of driving the free turbine in reverse as might be the case with conventional parallel shaft reversing gear arrangements. To illustrate the weight reduction potential, a modern naval ship propulsion system utilizing an aircraft derivative gas turbine engine as the prime mover in conjunction with a conventional parallel shaft reversing gear can be compared to the subject reversing gear differential. A typical 18,642 kW (25,000 hp) marine gas turbine engine might weigh approximately 5000 kg (11,000 lb) and a conventional marine technology parallel shaft reversing gear might weigh on the order of 90,000 to 136,000 kg (200,000 to 300,000 lb). Using gear technology derived from the aircraft industry, a functionally similar differentially driven marine reversing gear might weigh approximately 13,600 kg (30,000 lb).

Multiple CMOS Intersection Measuring System Modeling and Analysis

2012 ◽  
Vol 614-615 ◽  
pp. 1299-1302
Author(s):  
Ming Jing Li ◽  
Yu Bing Dong ◽  
Guang Liang Cheng
Keyword(s):  
High Speed ◽  
High Performance ◽  
High Reliability ◽  
System Modeling ◽  
Position Effect ◽  
Field Of View ◽  
Measuring System ◽  
Price Ratio ◽  
Matlab Simulation ◽  
Modeling And Analysis

Multiple high speed CMOS cameras composing intersection system to splice large effect field of view(EFV). The key problem of system is how to locate multiple CMOS cameras in suitable position. Effect field of view was determined according to size, quantity and dispersion area of objects, so to determine camera position located on below, both sides and ahead to moving targets. This paper analyzes effect splicing field of view, operating range etc through establishing mathematical model and MATLAB simulation. Location method of system has advantage of flexibility splicing, convenient adjustment, high reliability and high performance-price ratio.

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