Design tradeoffs between organic polymer-on-metal PWBs and ceramic thick-film PWBs for high-density operation using leadless ceramic chip carriers

1988 ◽  
Vol 11 (3) ◽  
pp. 298-313
Author(s):  
F.L. Gray ◽  
T.D. Petrovich ◽  
J.K. Pylant ◽  
J.S. Prokop
Keyword(s):  
Thick Film ◽  
High Density ◽  
Organic Polymer ◽  
Design Tradeoffs

Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry

2007 ◽  
Vol 1030 ◽  
Author(s):  
Jeroen van den Brand ◽  
Erik Veninga ◽  
Roel Kusters ◽  
Tomas Podprocky ◽  
Andreas Dietzel
Keyword(s):  
Thick Film ◽  
Low Cost ◽  
Cost Effective ◽  
High Density ◽  
Polyethylene Naphthalate ◽  
Electronic Circuitry ◽  
Effective Technology

AbstractA novel, cost effective technology to manufacture high density embedded electronic circuitry is demonstrated. The process consists of laser photoablation of the circuitry into a substrate through a mask and subsequent filling using a polymer thick film paste. Because the volume of the substrate is used it is possible to make thick and thereby highly conductive lines using low cost materials and processes. The process is demonstrated for a fan out circuitry in 100 µm thick polyethylene naphthalate (PEN). The fan out circuitry has linewidths of 50 µm and line spacings of 100 µm. The usability of the circuitry is demonstrated by the successful flipchip bonding of a thinned Si daisy chain dummy chip with 176 IO's.

Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias

2009 ◽  
Vol 6 (1) ◽  
pp. 6-12 ◽  
Author(s):  
Arne Albertsen ◽  
Koji Koiwai ◽  
Kyoji Kobayashi ◽  
Tomonori Oguchi ◽  
Katsumi Aruga
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Screen Printing ◽  
Flip Chip ◽  
High Density ◽  
Uv Laser ◽  
Fine Pitch ◽  
Ink Jet ◽  
Printing Ink ◽  
Base Substrate

This paper highlights the possible combination of technologies such as thick film screen printing, ink jet, and post-firing thin film processes in conjunction with laser-drilled fine vias to produce high-density, miniaturized LTCC substrates. To obtain the silver pattern on the inner layers, both conventional thick film printing and ink jet printing (using nano silver particle dispersed ink) were applied on the ceramic green sheets. The ink jet process made it possible to metallize fine lines with line/space = 30/30 μm. For interlayer connections, fine vias of 30 μm in diameter formed by UV laser were used. Then these sheets were stacked on top of each other and fired to obtain a base substrate. On this base substrate, fine copper patterns for flip chip mounting were formed by a thin film process. The surface finish consisted of a nickel passivation and a gold layer deposited by electroless plating. The combination of the three patterning processes for conducting traces and UV laser drilling of fine vias make it appear possible to realize fine pitch LTCC, for example, for flip chip device mounting.

scholarly journals Accelerating the Biodegradation of High-Density Polyethylene (HDPE) Using Bjerkandera adusta TBB-03 and Lignocellulose Substrates

2019 ◽  
Vol 7 (9) ◽  
pp. 304 ◽  
Author(s):  
Bo Ram Kang ◽  
Soo Bin Kim ◽  
Hyun A Song ◽  
Tae Kwon Lee
Keyword(s):  
High Density Polyethylene ◽  
Amorphous Structure ◽  
High Density ◽  
Wood Chips ◽  
White Rot ◽  
Organic Polymer ◽  
White Rot Fungus ◽  
Laccase Production ◽  
Bjerkandera Adusta ◽  
Emerging Pollutant

High-density polyethylene (HDPE) is a widely used organic polymer and an emerging pollutant, because it is very stable and nonbiodegradable. Several fungal species that produce delignifying enzymes are known to be promising degraders of recalcitrant polymers, but research on the decomposition of plastics is scarce. In this study, white rot fungus, Bjerkandera adusta TBB-03, was isolated and characterized for its ability to degrade HDPE under lignocellulose substrate treatment. Ash (Fraxinus rhynchophylla) wood chips were found to stimulate laccase production (activity was > 210 U/L after 10 days of cultivation), and subsequently used for HDPE degradation assay. After 90 days, cracks formed on the surface of HDPE samples treated with TBB-03 and ash wood chips in both liquid and solid states. Raman analysis showed that the amorphous structure of HDPE was degraded by enzymes produced by TBB-03. Overall, TBB-03 is a promising resource for the biodegradation of HDPE, and this work sheds light on further applications for fungus-based plastic degradation systems.

Design on polarization distribution in all-organic polymer hybrids for high density energy storage

2020 ◽  
Vol 394 ◽  
pp. 125052 ◽  
Author(s):  
Wentian Wei ◽  
Chen Huang ◽  
Lingyu Zhang ◽  
Yao Wang ◽  
Meiyu Xu ◽  
...  
Keyword(s):  
Energy Storage ◽  
High Density ◽  
Organic Polymer ◽  
Polarization Distribution ◽  
Polymer Hybrids

scholarly journals An efficient hydrogenation catalytic model hosted in a stable hyper-crosslinked porous-organic-polymer: from fatty acid to bio-based alkane diesel synthesis

2020 ◽  
Vol 22 (6) ◽  
pp. 2049-2068 ◽  
Author(s):  
Chitra Sarkar ◽  
Subhash Chandra Shit ◽  
Duy Quang Dao ◽  
Jihyeon Lee ◽  
Ngoc Han Tran ◽  
...  
Keyword(s):  
Fatty Acid ◽  
Vegetable Oils ◽  
Catalytic Performance ◽  
High Density ◽  
Organic Polymer ◽  
Porous Organic Polymer ◽  
Different Types ◽  
Long Chain

A novel Pd-based catalyst hosted over a nitrogen enriched fibrous porous-organic-polymer with a high density of step sites and exhibits versatile catalytic performance over different types of vegetable oils to furnish long chain diesel-range alkanes.

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