Correlation between current-voltage and capacitance-voltage characteristics of Schottky barrier diodes

1998 ◽  
Vol 45 (9) ◽  
pp. 2032-2036 ◽  
Author(s):  
Y. Zhu ◽  
Y. Ishimaru ◽  
N. Takahashi ◽  
M. Shimizu
2013 ◽  
Vol 43 (1-2) ◽  
pp. 13-21 ◽  
Author(s):  
Y. Munikrishana Reddy ◽  
M. K. Nagaraj ◽  
M. Siva Pratap Reddy ◽  
Jung-Hee Lee ◽  
V. Rajagopal Reddy

Silicon ◽  
2018 ◽  
Vol 11 (6) ◽  
pp. 2647-2657 ◽  
Author(s):  
Durmuş Ali Aldemir ◽  
Rukiye Aldemir ◽  
Ali Kökce ◽  
Songül Duman ◽  
Ahmet Faruk Özdemir

2018 ◽  
Vol 24 (8) ◽  
pp. 5582-5586
Author(s):  
R Padma ◽  
V. Rajagopal Reddy

In the present work, 20 Au/Ir/n-InGaN Schottky barrier diodes (SBDs) are fabricated using a electron beam evaporation technique. The Schottky barrier parameters such as ideality factor (n), Schottky barrier height (SBH) (Φb) and donar concentration (Nd) values are determined by current–voltage (I–V) and capacitance–voltage (C–V) measurements at room temperature. From I–V measurements, the statistical distribution of data gives the mean SBH value of 0.70 eV with a normal deviation of 10 meV and mean ideality factor value of 1.50 with a normal deviation of 0.0478. Two important parameters such as series resistance (RS) and shunt resistance (RSh) are also evaluated from the I–V characteristics. Furthermore, Norde and Cheung’s methods are used to evaluate the SBH, ideality factor and series resistance. The statistical distribution of C–V data gives the mean SBH value of 0.91 eV with a normal deviation of 12 meV and mean donar concentration of 0.71 × 1017 cm−3, with a normal deviation of 0.018 × 1017 cm−3 respectively.


2009 ◽  
Vol 615-617 ◽  
pp. 647-650 ◽  
Author(s):  
Denis Perrone ◽  
Marco Naretto ◽  
Sergio Ferrero ◽  
Luciano Scaltrito ◽  
C. Fabrizio Pirri

We have studied different Schottky and ohmic contacts on 4H-SiC with the aim to obtain Schottky barrier diodes (SBDs) capable to operate at high temperatures, frequencies and power densities for long periods of time, and showing low power losses. The control of the Schottky barrier plays an important role in minimizing the power loss of a SBD, and the metal-semiconductor interface properties strongly affect the overall performances of such a device. Schottky contacts were deposited using Ni, Ti, Ti/Al, Mo and Mo/Al layers, and the annealing treatments have been performed up to 600 °C using a rapid thermal annealing process (RTA). Ohmic contacts have been deposited on the wafer backside using Ti/Al or Ti/Ni/Ag layers. The Schottky diodes have been characterized by means of standard current-voltage (I-V) and capacitance-voltage (C-V) techniques. Schottky diodes with Mo and Mo/Al barriers show a lower barrier height and better overall performances in forward polarization when compared to the Ti- and Ni-based contacts.


2006 ◽  
Vol 100 (7) ◽  
pp. 074505 ◽  
Author(s):  
Muzaffer Çakar ◽  
Nezir Yıldırım ◽  
Şukru Karataş ◽  
Cabir Temirci ◽  
Abdulmecit Türüt

1992 ◽  
Vol 28 (3) ◽  
pp. 296 ◽  
Author(s):  
R.S. Spraggs ◽  
G. Pananakakis ◽  
D. Bauza ◽  
K.J. Reeson ◽  
B.J. Sealy

2019 ◽  
Vol 58 (1) ◽  
pp. 014002 ◽  
Author(s):  
Kamal Zeghdar ◽  
Lakhdar Dehimi ◽  
Fortunato Pezzimenti ◽  
Sandro Rao ◽  
Francesco G. Della Corte

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