Impurity-characterization agreement in type-IIb single-crystal diamond by high-temperature Hall-effect, capacitance-voltage, and secondary-ion mass-spectroscopy measurements

1994 ◽  
Vol 49 (8) ◽  
pp. 5745-5748 ◽  
Author(s):  
H. A. Wynands ◽  
D. M. Malta ◽  
B. A. Fox ◽  
J. A. von Windheim ◽  
J. P. Fleurial ◽  
...  
2013 ◽  
Vol 15 (14) ◽  
pp. 5202 ◽  
Author(s):  
Robert J. Thompson ◽  
Sarah Fearn ◽  
Ke Jie Tan ◽  
Hans George Cramer ◽  
Christian L. Kloc ◽  
...  

1998 ◽  
Vol 510 ◽  
Author(s):  
R. Job ◽  
W. R. Fahrner ◽  
A. I. Ivanov ◽  
L. Palmetshofer ◽  
A. G Ulyashin

AbstractP-type Czochralski (Cz) Si was implanted with H (180 keV, 2.7.1016 cm−2) or He (300 keV, 1.1016 cm−2) ions. The gettering of O and H atoms by the buried implantation damage layers during annealing up to 4 hours (1000°C in H2 or N2 ambient) was studied by secondary ion mass spectroscopy (SIMS) and spreading resistance probe (SRP) measurements. Buried defect layers act as good getter centers for O and H atoms at appropriate heat treatments. The enhanced gettering of O atoms in H implanted Cz Si (as compared to the gettering of O in He implanted samples) as well as the enhanced gettering of O during annealing in H2 flow (as compared to N2 ambient) can be explained by a hydrogen enhanced O diffusion towards the defect layers. According to a strong accumulation of O at the buried damage layers and near the surface some anomalies of the SRP profiles can be observed after post-implantation annealing.


2016 ◽  
Vol 18 (47) ◽  
pp. 32302-32307 ◽  
Author(s):  
Robert J. Thompson ◽  
Thomas Bennett ◽  
Sarah Fearn ◽  
Muhammad Kamaludin ◽  
Christian Kloc ◽  
...  

Oxygen diffusion channels are imaged in the single crystal organic semiconductor rubrene using Time of Flight Secondary Ion Mass Spectroscopy.


1990 ◽  
Vol 216 ◽  
Author(s):  
Suhit R. Das ◽  
David J. Lockwood ◽  
Stephen J. Rolfe ◽  
John P. McCaffrey ◽  
John G. Cook

ABSTRACTHeteroepitaxial (100)CdTe || (100)InSb structures have been fabricated by growing CdTe epilayers, at growth temperatures below 200°C, on single crystal InSb substrates by low-energy bias sputtering. Controlled low-energy ion bombardment at the substrate was employed to clean the growth surface in-situ just prior to film deposition and to modify the growth kinetics and enhance adatom mobility during deposition. Raman spectroscopy of the interface revealed no evidence of In2Te3 and secondary ion mass spectroscopy showed the interface to be chemically abrupt.


2000 ◽  
Vol 88 (4) ◽  
pp. 1811-1817 ◽  
Author(s):  
D. Meister ◽  
M. Böhm ◽  
M. Topf ◽  
W. Kriegseis ◽  
W. Burkhardt ◽  
...  

2004 ◽  
Vol 809 ◽  
Author(s):  
Mudith S. A. Karunaratne ◽  
Janet M. Bonar ◽  
Jing Zhang ◽  
Arthur F. W. Willoughby

ABSTRACTIn this paper, we compare B diffusion in epitaxial Si, Si with 0.1%C, SiGe with 11% Ge and SiGe:C with 11%Ge and 0.1%C at 1000°C under interstitial, vacancy and non-injection annealing conditions. Diffusion coefficients of B in each material were extracted by computer simulation, using secondary ion mass spectroscopy (SIMS) profiles obtained from samples before and after annealing.Interstitial injection enhances B diffusion considerably in all materials compared to inert annealing. In samples which experienced vacancy injection, B diffusion was suppressed. The results are consistent with the view that B diffusion in these materials occurs primarily via interstitialcy type defects.


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