Thermal Management of Electronic Packages for Space Applications

1990 ◽  
Vol 11 (3) ◽  
pp. 27-44 ◽  
Author(s):  
K. N. SHUKLA ◽  
M. J. CHACKO ◽  
LEELAMMA MANI
Keyword(s):  
Thermal Management ◽  
Electronic Packages ◽  
Space Applications

Parametric Analysis of a Thermally Actuated Cooling System for Space Applications

2000 ◽  
Author(s):  
K. Freudenberg ◽  
W. E. Lear ◽  
S. A. Sherif
Keyword(s):  
Thermal Management ◽  
Parametric Analysis ◽  
Cooling System ◽  
Space Applications ◽  
Development Stages ◽  
Prototype Development ◽  
Design Cycle ◽  
Subsystem Design ◽  
Design Requirements ◽  
Thermally Actuated

Abstract Integration of new and existing technologies for thermal management will be required to meet the challenges associated with the increased need for an efficient, lightweight, heat rejection system. Subsystem design requirements, such as thermal and mass management, must be brought into me design cycle to establish an optimal configuration. This paper provides a parametric analysis that determines a range of parameters under which a proposed system becomes viable from a weight management standpoint. The analysis can be applied to essentially any space-operated thermally-actuated heat pump with power and refrigeration subsystems. By applying the techniques demonstrated in this paper, designers can identify and optimize conceptual configurations during the initial prototype development stages to reduce payload weight and increase financial savings.

Characterization of Electronic Packages by Thermal Diffusion Tomography

2009 ◽  
Author(s):  
Hakan Erturk
Keyword(s):  
Thermal Management ◽  
Thermal Diffusion ◽  
Process Development ◽  
Imaging Techniques ◽  
Interface Layer ◽  
Acoustic Microscopy ◽  
Perturbation Approach ◽  
Electronic Packages ◽  
X Rays ◽  
Reconstruction Algorithms

One of the most important functions of an electronic package is thermal management, as package is responsible from removing the heat generated by the transistors to ensure reliability. The quality of the package is very important for proper thermal management and it is important to have minimal flaws that increase thermal resistance of the package. Therefore, detection of flaws in the multi-layered package is critical during the assembly process development to monitor the package quality. This is achieved by techniques such as computerized tomography (CT) using x-rays, or scanning acoustic microscopy (SAM), all of which require very expensive equipment and significant processing time. Thermal diffusion tomography (TDT) can be used for detecting the flaws as a lower cost alternative to these imaging techniques. The feasibility of TDT as a fault detection technique for electronic packages with IR thermometry is considered in the current study. Two reconstruction algorithms considered; an iterative perturbation approach and Levenberg-Marquard method were found to be capable of detecting the flaws in the thermal interface layer.

Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications

2008 ◽  
Vol 62 (6-7) ◽  
pp. 422-430 ◽  
Author(s):  
J. Barcena ◽  
J. Maudes ◽  
M. Vellvehi ◽  
X. Jorda ◽  
I. Obieta ◽  
...  
Keyword(s):  
Thermal Management ◽  
Semiconductor Devices ◽  
Wide Bandgap ◽  
Space Applications ◽  
Wide Bandgap Semiconductor

scholarly journals Thermal diode based on a multilayer structure of phase change materials

2021 ◽  
Vol 2116 (1) ◽  
pp. 012115
Author(s):  
T Swoboda ◽  
K Klinar ◽  
A Kitanovski ◽  
M Muñoz Rojo
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Multilayer Structure ◽  
Phase Change Materials ◽  
Rectification Ratio ◽  
Optimum Conditions ◽  
Space Applications ◽  
Thermal Rectification ◽  
Management Capability ◽  
The Impact

Abstract Thermal diodes are devices that allow heat to flow preferentially in one direction. This unique thermal management capability has attracted attention in various applications, like electronics, sensors, energy conversion or space applications, among others. Despite their interest, the development of efficient thermal diodes remains still a challenge. In this paper, we report a scalable and adjustable thermal diode based on a multilayer structure that consists of a combination of phase change and phase invariant materials. We applied a parametric sweep in order to find the optimum conditions to maximize the thermal rectification ratio. Our simulations predicted a maximum thermal rectification ratio of ~20%. To evaluate the impact of these devices in real applications, we theoretically analysed the performance of a magnetocaloric refrigerating device that integrates this thermal diode. The results showed a 0.18 K temperature span between the heat source and the heat sink at an operating frequency of 25 Hz.

Mass-Based Optimization of Thermal Management and Power Systems for Space Applications

2002 ◽  
Vol 18 (6) ◽  
pp. 1161-1169 ◽  
Author(s):  
K. D. Freudenberg ◽  
W. E. Lear ◽  
S. A. Sherif ◽  
E. L. Golliher
Keyword(s):  
Power Systems ◽  
Thermal Management ◽  
Space Applications
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