Mass-Based Optimization of Thermal Management and Power Systems for Space Applications

2002 ◽  
Vol 18 (6) ◽  
pp. 1161-1169 ◽  
Author(s):  
K. D. Freudenberg ◽  
W. E. Lear ◽  
S. A. Sherif ◽  
E. L. Golliher
Keyword(s):  
Power Systems ◽  
Thermal Management ◽  
Space Applications

Parametric Analysis of a Thermally Actuated Cooling System for Space Applications

2000 ◽  
Author(s):  
K. Freudenberg ◽  
W. E. Lear ◽  
S. A. Sherif
Keyword(s):  
Thermal Management ◽  
Parametric Analysis ◽  
Cooling System ◽  
Space Applications ◽  
Development Stages ◽  
Prototype Development ◽  
Design Cycle ◽  
Subsystem Design ◽  
Design Requirements ◽  
Thermally Actuated

Abstract Integration of new and existing technologies for thermal management will be required to meet the challenges associated with the increased need for an efficient, lightweight, heat rejection system. Subsystem design requirements, such as thermal and mass management, must be brought into me design cycle to establish an optimal configuration. This paper provides a parametric analysis that determines a range of parameters under which a proposed system becomes viable from a weight management standpoint. The analysis can be applied to essentially any space-operated thermally-actuated heat pump with power and refrigeration subsystems. By applying the techniques demonstrated in this paper, designers can identify and optimize conceptual configurations during the initial prototype development stages to reduce payload weight and increase financial savings.

General Atomics Radioisotope Fueled Thermophotovoltaic Power Systems for Space Applications

2015 ◽  
Author(s):  
Jason E. Strauch ◽  
Andre Klein ◽  
Patrick Charles ◽  
Christopher Murray ◽  
Miting Du
Keyword(s):  
Power Systems ◽  
Space Applications

Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications

2008 ◽  
Vol 62 (6-7) ◽  
pp. 422-430 ◽  
Author(s):  
J. Barcena ◽  
J. Maudes ◽  
M. Vellvehi ◽  
X. Jorda ◽  
I. Obieta ◽  
...  
Keyword(s):  
Thermal Management ◽  
Semiconductor Devices ◽  
Wide Bandgap ◽  
Space Applications ◽  
Wide Bandgap Semiconductor

scholarly journals Thermal diode based on a multilayer structure of phase change materials

2021 ◽  
Vol 2116 (1) ◽  
pp. 012115
Author(s):  
T Swoboda ◽  
K Klinar ◽  
A Kitanovski ◽  
M Muñoz Rojo
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Multilayer Structure ◽  
Phase Change Materials ◽  
Rectification Ratio ◽  
Optimum Conditions ◽  
Space Applications ◽  
Thermal Rectification ◽  
Management Capability ◽  
The Impact

Abstract Thermal diodes are devices that allow heat to flow preferentially in one direction. This unique thermal management capability has attracted attention in various applications, like electronics, sensors, energy conversion or space applications, among others. Despite their interest, the development of efficient thermal diodes remains still a challenge. In this paper, we report a scalable and adjustable thermal diode based on a multilayer structure that consists of a combination of phase change and phase invariant materials. We applied a parametric sweep in order to find the optimum conditions to maximize the thermal rectification ratio. Our simulations predicted a maximum thermal rectification ratio of ~20%. To evaluate the impact of these devices in real applications, we theoretically analysed the performance of a magnetocaloric refrigerating device that integrates this thermal diode. The results showed a 0.18 K temperature span between the heat source and the heat sink at an operating frequency of 25 Hz.

Measurement of Thermal Properties of Composite Panels

Volume 1 ◽  
2004 ◽  
Author(s):  
A. M. Druma ◽  
M. K. Alam ◽  
M. Kistner ◽  
Roland Watts
Keyword(s):  
Thermal Properties ◽  
Carbon Fiber ◽  
Power Systems ◽  
Thermal Management ◽  
Carbon Materials ◽  
Organic Matrix ◽  
Composite Panels ◽  
Light Weight ◽  
Ambient Temperatures ◽  
Flash Diffusivity

Thermal panels are used in spacecrafts and planned for thermal management in aircraft electronics and power systems. The requirements are light-weight, highly conductive emerging carbon materials that can withstand the stresses in the specific applications. A number of carbon fiber reinforced carbon-carbon and organic matrix composite panels were fabricated and tested by using a cryogenic Flash Diffusivity instrument and Differential Scanning Calorimeter (DSC). The properties were measured at cryogenic and above ambient temperatures.

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