Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling

2004 ◽  
Author(s):  
H.Y. Zhang ◽  
D. Pinjala ◽  
Poi-Siong Teo
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Power Dissipation ◽  
Air Cooling ◽  
Electronic Packages ◽  
Liquid Cooling

Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages

2021 ◽  
Author(s):  
Arunima Panigrahy ◽  
Prabhakar Subrahmanyam ◽  
Ying-Feng Pang ◽  
Ridvan Sahan ◽  
Amy Xia
Keyword(s):  
High Power ◽  
Power Dissipation ◽  
Closed Loop ◽  
Form Factors ◽  
Cost Effective ◽  
Systematic Evaluation ◽  
Air Cooling ◽  
Liquid Cooling ◽  
High Performing ◽  
Thermal Simulations

Abstract Current technological developmental efforts for high performing liquid assisted air-cooling solution (LAAC) is presented in this research. The roadmap needs of high-power packages such as client, datacenter and graphics product segments are addressed. Systematic evaluation and qualification process for developing cost effective LAAC solutions to provide cooling capabilities for multiple socketed packages are also discussed. This effort includes qualifying high performing heat exchanger (finned radiator) and cold plate with different fin designs. Thermal simulations were conducted and correlated with experimental data. The concept of power density approach is introduced for predicting the cooling capability of newly developed LAAC solution for different lidded package form factors. The paper presents supporting data of performance evaluation from graphics segment that extends the solution capability to data center segment. The technology developed here will address the increasing cooling capability needed for future products with high power dissipation and multiple socket cooling configuration.

A comparative study between air cooling and liquid cooling thermal management systems for a high-energy lithium-ion battery module

2021 ◽  
Vol 198 ◽  
pp. 117503 ◽  
Author(s):  
Mohsen Akbarzadeh ◽  
Theodoros Kalogiannis ◽  
Joris Jaguemont ◽  
Lu Jin ◽  
Hamidreza Behi ◽  
...  
Keyword(s):  
Comparative Study ◽  
Lithium Ion Battery ◽  
Thermal Management ◽  
Lithium Ion ◽  
High Energy ◽  
Management Systems ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Battery Module

scholarly journals Hybrid Battery Thermal Management System in Electrical Vehicles: A Review

Energies ◽  
2020 ◽  
Vol 13 (23) ◽  
pp. 6257
Author(s):  
Chunyu Zhao ◽  
Beile Zhang ◽  
Yuanming Zheng ◽  
Shunyuan Huang ◽  
Tongtong Yan ◽  
...  
Keyword(s):  
Thermal Management ◽  
Management System ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Battery Thermal Management ◽  
Thermal Management System ◽  
Battery Thermal Management System ◽  
Cooling Phase ◽  
Li Ion ◽  
Forced Air

The Li-ion battery is of paramount importance to electric vehicles (EVs). Propelled by the rapid growth of the EV industry, the performance of the battery is continuously improving. However, Li-ion batteries are susceptible to the working temperature and only obtain the optimal performance within an acceptable temperature range. Therefore, a battery thermal management system (BTMS) is required to ensure EVs’ safe operation. There are various basic methods for BTMS, including forced-air cooling, liquid cooling, phase change material (PCM), heat pipe (HP), thermoelectric cooling (TEC), etc. Every method has its unique application condition and characteristic. Furthermore, based on basic BTMS, more hybrid cooling methods adopting different basic methods are being designed to meet EVs’ requirements. In this work, the hybrid BTMS, as a more reliable and environmentally friendly method for the EVs, will be compared with basic BTMS to reveal its advantages and potential. By analyzing its cost, efficiency and other aspects, the evaluation criterion and design suggestions are put forward to guide the future development of BTMS.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

scholarly journals Design of an Optimized Thermal Management System for Li-Ion Batteries under Different Discharging Conditions

Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5695 ◽  
Author(s):  
Ankur Bhattacharjee ◽  
Rakesh K. Mohanty ◽  
Aritra Ghosh
Keyword(s):  
Thermal Management ◽  
Cooling System ◽  
Peak Temperature ◽  
Air Cooling ◽  
Li Ion Batteries ◽  
Li Ion Battery ◽  
Liquid Cooling ◽  
Thermal Management System ◽  
Li Ion ◽  
Liquid Cooling System

The design of an optimized thermal management system for Li-ion batteries has challenges because of their stringent operating temperature limit and thermal runaway, which may lead to an explosion. In this paper, an optimized cooling system is proposed for kW scale Li-ion battery stack. A comparative study of the existing cooling systems; air cooling and liquid cooling respectively, has been carried out on three cell stack 70Ah LiFePO4 battery at a high discharging rate of 2C. It has been found that the liquid cooling is more efficient than air cooling as the peak temperature of the battery stack gets reduced by 30.62% using air cooling whereas using the liquid cooling method it gets reduced by 38.40%. The performance of the liquid cooling system can further be improved if the contact area between the coolant and battery stack is increased. Therefore, in this work, an immersion-based liquid cooling system has been designed to ensure the maximum heat dissipation. The battery stack having a peak temperature of 49.76 °C at 2C discharging rate is reduced by 44.87% to 27.43 °C after using the immersion-based cooling technique. The proposed thermal management scheme is generalized and thus can be very useful for scalable Li-ion battery storage applications also.

Liquid Cooling of Compute System

2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Jessica Gullbrand ◽  
Mark J. Luckeroth ◽  
Mark E. Sprenger ◽  
Casey Winkel
Keyword(s):  
Power Density ◽  
High Power ◽  
Data Center ◽  
Large Data ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Cold Plates ◽  
Performance Results ◽  
System Power ◽  
Design Challenges

The continued demand for increasing compute performance results in an increasing system power and power density of many computers. The increased power requires more efficient cooling solutions than traditionally used air cooling. Therefore, liquid cooling, which has traditionally been used for large data center deployments, is becoming more mainstream. Liquid cooling can be used selectively to cool the high power components or the whole compute system. In this paper, the example of a fully liquid cooled server is used to describe different ingredients needed, together with the design challenges associated with them. The liquid cooling ingredients are cooling distribution unit (CDU), fluid, manifold, quick disconnects (QDs), and cold plates. Intel is driving an initiative to accelerate liquid cooling implementation and deployment by enabling the ingredients above. The functionality of these ingredients is discussed in this paper, while cold plates are discussed in detail.

scholarly journals Control Strategy for Helicopter Thermal Management System Based on Liquid Cooling and Vapor Compression Refrigeration

Energies ◽  
2020 ◽  
Vol 13 (9) ◽  
pp. 2177 ◽  
Author(s):  
Miao Zhao ◽  
Liping Pang ◽  
Meng Liu ◽  
Shizhao Yu ◽  
Xiaodong Mao
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Control Strategy ◽  
Management System ◽  
Inlet Temperature ◽  
Cold Plate ◽  
Vapor Compression ◽  
Liquid Cooling ◽  
Thermal Management System ◽  
Vapor Compression Refrigeration

With the continuous application of high-power electronic equipment in aircraft, highly efficient heat transfer technology has been emphasized for airborne applications. In this paper, a thermal management system based on an antifreeze liquid cooling loop and a vapor compression refrigeration loop is presented for high-power airborne equipment in a helicopter. The simulation models of the thermal management system are built in order to study its control strategy for the changing flight conditions. The antifreeze-refrigerant evaporator and air-refrigerant condenser are specially validated with the experimental data. A dual feedforward proportion integration differentiation and expert control algorithm are adopted in the inlet temperature of the cold plate and sub-cooling control of the refrigerant by regulating the compressor speed and the fan speed, respectively. A preheating strategy for antifreeze is set up to decrease its flow resistance in cold day conditions. The control strategy for the thermal management system is finally built based on the above control methods. In this paper, two extreme conditions are discussed, including cold and hot days. Both the simulation results show that the superheated, sub-cooling and antifreeze inlet temperature of the cold plate can be controlled at 3 to8 °C, −10 to −3 °C and 18 to22 °C, respectively. Under the same changing flight envelope, the coefficient of performance of the vapor compression refrigeration loop is relatively stable on the cold day, which is about 6, while it has a range of 2.58–4.9 on the hot day.

Liquid Cooling for Thermal Management of Data Centers

2008 ◽  
Author(s):  
Veerendra Mulay ◽  
Dereje Agonafer ◽  
Roger Schmidt
Keyword(s):  
Thermal Management ◽  
Data Center ◽  
Heat Load ◽  
Data Centers ◽  
High Heat ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Air Conditioners ◽  
Server Systems ◽  
Heat Loads

The power trend for Server systems continues to grow thereby making thermal management of Data centers a very challenging task. Although various configurations exist, the raised floor plenum with Computer Room Air Conditioners (CRACs) providing cold air is a popular operating strategy. The air cooling of data center however, may not address the situation where more energy is expended in cooling infrastructure than the thermal load of data center. Revised power trend projections by ASHRAE TC 9.9 predict heat load as high as 5000W per square feet of compute servers’ equipment footprint by year 2010. These trend charts also indicate that heat load per product footprint has doubled for storage servers during 2000–2004. For the same period, heat load per product footprint for compute servers has tripled. Amongst the systems that are currently available and being shipped, many racks exceed 20kW. Such high heat loads have raised concerns over limits of air cooling of data centers similar to air cooling of microprocessors. Thermal management of such dense data center clusters using liquid cooling is presented.

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