Influence of rapid thermal annealing temperature on the electrical properties of Be‐implanted GaAsp‐njunctions

1988 ◽  
Vol 52 (26) ◽  
pp. 2244-2246 ◽  
Author(s):  
T. J. de Lyon ◽  
H. C. Casey ◽  
H. Z. Massoud ◽  
M. L. Timmons ◽  
J. A. Hutchby ◽  
...  
2004 ◽  
Vol 830 ◽  
Author(s):  
Hua. Wang ◽  
Minfang Ren

AbstractFerroelectric Bi4Ti3O12 thin films were fabricated by sol-gel method with multiple rapid thermal annealing (MRTA) techniques on Pt/Ti/SiO2/p-Si substrates. The effect of annealing temperature on crystallinity, ferroelectric and electrical properties of Bi4Ti3O12 films derived by MRTA and by normal RTA were investigated. The results reveal that the grain size and the roughness of surface increase with the annealing temperature increase, but the maximal remnant polarization of Bi4Ti3O12


Electronics ◽  
2021 ◽  
Vol 10 (11) ◽  
pp. 1324
Author(s):  
Hanyeong Yu ◽  
Changhwan Shin

A metal-ferroelectric-metal (MFM) capacitor was fabricated to investigate the effect of the rate-of-change of temperature in the rapid thermal annealing (RTA) process on the physical properties of the MFM capacitor’s ferroelectric layer [lead zirconate oxide (PZT)]. Remnant polarization (2 × Pr) is measured and monitored while performing the RTA process at 500 °C–700 °C. It turned out that, for a given target/final temperature in the RTA process, 2Pr of the ferroelectric layer decreases with a higher rate-of-change of temperature. This can provide a way to adjust the properties of the PZT layer, depending on the RTA process condition (i.e., using various rate-of-changes of temperature) for a given final/target temperature.


Sign in / Sign up

Export Citation Format

Share Document